An object is to provide a technology for enabling reduction in the time and cost taken to manufacture a die to be used for molding a case that surrounds semiconductor elements. A semiconductor device includes a base plate, a cooling plate, an insulating substrate, a semiconductor element, a case, a lead frame formed integrally with the case and including a terminal formed on one end portion of the lead frame and protruding outward, and a sealant. The case includes a pair of first case components arranged to face each other, and a pair of second case components arranged to face each other and crossing the pair of first case components. Joining end portions of the first case components to end portions of the pair of second case components forms the case.

A method for adjusting furnace temperature of a reflow oven by AI, through obtaining product data of the reflow oven, obtaining initial characteristic data of a preceding work station and calculating mean values of temperatures of an upper furnace and a lower furnace, and taking the mean values as initial reflow characteristic data. Data as to first reflow characteristics of each reflow temperature zone and second reflow characteristics data of each zone are obtained, and data of the first and second reflow characteristics data are obtained. The electronic device further combines the characteristic data of the preceding work station with the combined reflow characteristics and combines results into a trained neural network model to output a temperature prediction, the oven temperature being adjusted according to the temperature prediction.

A method for adjusting furnace temperature of a reflow oven by AI, through obtaining product data of the reflow oven, obtaining initial characteristic data of a preceding work station and calculating mean values of temperatures of an upper furnace and a lower furnace, and taking the mean values as initial reflow characteristic data. Data as to first reflow characteristics of each reflow temperature zone and second reflow characteristics data of each zone are obtained, and data of the first and second reflow characteristics data are obtained. The electronic device further combines the characteristic data of the preceding work station with the combined reflow characteristics and combines results into a trained neural network model to output a temperature prediction, the oven temperature being adjusted according to the temperature prediction.

A solder reflow oven may include a reflow chamber and a plurality of vertically spaced apart wafer-support plates positioned in the reflow chamber. A plurality of semiconductor wafers each including a solder are configured to be disposed in the reflow chamber such that each semiconductor wafer is disposed proximate to, and vertically spaced apart from, a wafer-support plate. Each wafer-support plate may include at least one of liquid-flow channels or resistive heating elements. A control system control the flow of a hot liquid through the channels or activate the heating elements to heat a wafer to a temperature above the solder reflow temperature.

A robotic wire termination system for efficiently connecting a plurality of wires to an electrical connector. The robotic wire termination system generally includes a frame, a connector support attached to the frame, a robot manipulator having at least one arm, a heating device attached to the at least one arm and a control unit in communication with the robot manipulator to control the operation of the robot manipulator. The arm of the robot manipulator is adapted to move the heating device so that the heating device can apply heat to a selected connector pin of the electrical connector.

A robotic wire termination system for efficiently connecting a plurality of wires to an electrical connector. The robotic wire termination system generally includes a frame, a connector support attached to the frame, a robot manipulator having at least one arm, a heating device attached to the at least one arm and a control unit in communication with the robot manipulator to control the operation of the robot manipulator. The arm of the robot manipulator is adapted to move the heating device so that the heating device can apply heat to a selected connector pin of the electrical connector.

A brazing apparatus and method for brazing an anode target plate of an X-ray generator are disclosed. The brazing apparatus comprises: a vacuum part for providing, during brazing, a vacuum environment at least for a target plate main body formed of an alloy, a brazing material, and a substrate; an induction brazing part for applying an induction current to the target plate main body, the brazing material and the substrate in the vacuum part so as to achieve heating to a temperature higher than the melting point of the brazing material, causing the substrate to be welded to the target plate main body through melting of the brazing material and a resulting reaction; and a directional energy welding part for applying a generated directional energy beam to a position of lower temperature determined on the target plate main body to perform heating.

Provided is a soldering apparatus capable of blowing gas through a first blowing port more uniformly than a conventional apparatus, at each position in the first blowing port. The soldering apparatus according to the present disclosure is a soldering apparatus that performs soldering, including a blowing unit that supplies gas to an object, wherein the blowing unit includes a case including a first blowing chamber, a fan housed in the first blowing chamber to blow the gas in a centrifugal direction, a first baffle plate, and a heater that heats the gas or a cooling unit that cools the gas, the case includes a first wall that faces the fan in an axial direction of the fan, a second wall that faces the first wall, and an inner wall connecting the first wall and the second wall, the first wall, the second wall and the inner wall define the first blowing chamber, in the first wall, a first blowing port is formed, and the first baffle plate is disposed in the first blowing chamber to guide part of the gas blown from the fan to the first blowing port.

A robotic wire termination system for efficiently connecting a plurality of wires to an electrical connector. The robotic wire termination system generally includes a frame, a connector support attached to the frame, a robot manipulator having at least one arm, a heating device attached to the at least one arm and a control unit in communication with the robot manipulator to control the operation of the robot manipulator. The arm of the robot manipulator is adapted to move the heating device so that the heating device can apply heat to a selected connector pin of the electrical connector.

A robotic wire termination system for efficiently connecting a plurality of wires to an electrical connector. The robotic wire termination system generally includes a frame, a connector support attached to the frame, a robot manipulator having at least one arm, a heating device attached to the at least one arm and a control unit in communication with the robot manipulator to control the operation of the robot manipulator. The arm of the robot manipulator is adapted to move the heating device so that the heating device can apply heat to a selected connector pin of the electrical connector.