A heater-sensor complex 10 includes a heating wire 12, a lead wire 14 which is made from the same metal of the heating wire 12 and connected to the proximal end of the heating wire 12, the lead wire 14 having a bigger diameter than the heating wire 12, a non-heating wire 16 constituted by a different metal from the metal constituting the heating wire 12, and a sensor head 18 constituted by a metal different from the metal constituting the heating wire 12 or the metal constituting the non-heating wire 16. The sensor head 18 have a lower thermal conductivity than the non-heating wire. To the sensor head 18, the distal end of the heating wire 12 and the distal end of the non-heating wire is connected. The heating wire 12 and the non-heating wire 16 electrically conducts at least through the sensor head 18.

A robotic wire termination system for efficiently connecting a plurality of wires to an electrical connector. The robotic wire termination system generally includes a frame, a connector support attached to the frame, a robot manipulator having at least one arm, a heating device attached to the at least one arm and a control unit in communication with the robot manipulator to control the operation of the robot manipulator. The arm of the robot manipulator is adapted to move the heating device so that the heating device can apply heat to a selected connector pin of the electrical connector.

A method for joining of at least two materials, non-weldable directly to each other with thermal joining processes in a lap joint configuration includes a two step sequence including a first step to apply a thermomechanical or mechanical surface protection layer on the surface of a (stainless) steel substrate and a second step where, a thermal joining process is used to weld the sprayed layer with an applied aluminum sheet without having brittle intermetallic phases in the whole material configuration.

A system for assembling a vehicular window assembly includes a heating device that, when electrically operated, heats an electrical connector disposed at a glass panel of a vehicular window assembly to heat and melt solder disposed between the electrical connector and an electrically conductive trace established at the glass panel to form a solder joint providing electrically-conductive connection between the electrical connector and the electrically conductive trace established at the glass panel. A temperature sensor captures sensor data indicative of a temperature of the electrical connector and the solder. The system, based on processing at an electronic control unit (ECU) of the captured sensor data, adjusts electrical operation of the heating device to adjust the temperature of the electrical connector and the solder during the soldering process that forms the solder joint.

An apparatus is described for carrying out controlled local heating a target surface of a substrate provided with a heat sensitive material to change a state of the heat sensitive material. The apparatus includes a carrier having a carrier surface for carrying the substrate at a carried surface opposite the target surface. The carrier has a plurality of laterally distributed heating zones that are thermally insulated from each other by slits that are in communication with an evacuation channel. The respective heating zones include respective resistive heating elements and are thermally coupled to a heat sink. The apparatus further includes a controller configured to control a selective supply of electric energy to at least one of the respective resistive heating elements of at least one of the plurality of laterally distributed heating zones.

A soldering device capable of shortening operation time of soldering and suppressing solder non-wetting is provided. A soldering device includes: a plurality of tubular solder piece guide tubes which have space therein for a solder piece supplied from a supply port to pass through; a first holding unit which holds the solder piece guide tubes; and a heating unit which heats the first holding unit. Tip end portions of the solder piece guide tubes on a soldering side are arranged on an inner side of the first holding unit.

An apparatus for soldering a terminal to which a solder alloy is attached on window glass for a vehicle, includes a terminal to which the solder alloy is attached; a coil unit including a coil which generates induction heat; a gripper which grips and releases the terminal and is configured to be movable upward and downward relative to the coil unit in a state of gripping the terminal; and a ferrite core unit including a ferrite core which is configured to be surrounded by the coil unit to receive the induction heat, and is configured to be movable upward and downward relative to the coil unit, wherein the solder alloy attached to the terminal, in a state of being in contact with the window glass, is melted by the induction heat from the coil unit and the ferrite core unit such that the terminal is attached to the window glass.

A device for soldering, in particular for reflow soldering, of at least one assembly, having a process chamber arrangement, comprises at least two process chambers for preparing a soldering method and/or for carrying out a soldering method and/or for post-processing a soldering method, wherein the at least two process chambers are arranged above one another, in particular in a stack-like manner.

A unitary wafer assembly arrangement for the application of solder balls onto a substrate for subsequent use in the electronics industry. This wafer tool assembly comprises a number of modules connected to one another and all serviced by a robotic arm to transfer processed wafers from one module to another. The tool assembly comprises a load port and pre-aligner module, a binder module, a solder ball mount module and a reflow module. A wafer inspection and repair module arrangement is also part of the tool assembly.

A unitary wafer assembly arrangement for the application of solder balls onto a substrate for subsequent use in the electronics industry. This wafer tool assembly comprises a number of modules connected to one another and all serviced by a robotic arm to transfer processed wafers from one module to another. The tool assembly comprises a load port and pre-aligner module, a binder module, a solder ball mount module and a reflow module. A wafer inspection and repair module arrangement is also part of the tool assembly.