The present disclosure is directed to a compact vertical oven for reflow of solder bumps for backend processes in semiconductor wafer assembly and packaging. This disclosure describes a vertical oven which uses a plurality of wafers (e.g., an example value is 50-100 wafers) in a batch with controlled injection of the reducing agent (e.g. formic acid), resulting in a process largely free of contamination. This disclosure describes controlled formic acid flow through a vertical system using laminar flow technology in a sub-atmospheric pressure environment, which is not currently available in the industry. The efficacy of the process depends on effective formic acid vapor delivery, integrated temperature control during heating and cooling, and careful design of the vapor flow path with exhaust. Zone-dependent reaction dynamics managed by vapor delivery process, two-steps temperature ramp control, and controlled cooling process and formic acid content ensures the effective reaction without any flux.

A device for soldering an electrical conductor with a connection device includes a base plate having a passageway and an anvil mounted on the base plate and at least partially housed in the passageway. The anvil is electrically insulated from the base plate and positioned to allow an electrical current to pass through the electrical conductor and/or the connection device.

Provided is a soldering apparatus capable of blowing gas through a first blowing port more uniformly than a conventional apparatus, at each position in the first blowing port. The soldering apparatus according to the present disclosure is a soldering apparatus that performs soldering, including a blowing unit that supplies gas to an object, wherein the blowing unit includes a case including a first blowing chamber, a fan housed in the first blowing chamber to blow the gas in a centrifugal direction, a first baffle plate, and a heater that heats the gas or a cooling unit that cools the gas, the case includes a first wall that faces the fan in an axial direction of the fan, a second wall that faces the first wall, and an inner wall connecting the first wall and the second wall, the first wall, the second wall and the inner wall define the first blowing chamber, in the first wall, a first blowing port is formed, and the first baffle plate is disposed in the first blowing chamber to guide part of the gas blown from the fan to the first blowing port.

A uniform pressure gang bonding device and fabrication method are presented using an expandable upper chamber with an elastic surface. Typically, the elastic surface is an elastomer material having a Young's modulus in a range of 40 to 1000 kilo-Pascal (kPA). After depositing a plurality of components overlying a substrate top surface, the substrate is positioned over the lower plate, with the top surface underlying and adjacent (in close proximity) to the elastic surface. The method creates a positive upper chamber medium pressure differential in the expandable upper chamber, causing the elastic surface to deform. For example, the positive upper chamber medium pressure differential may be in the range of 0.05 atmospheres (atm) and 10 atm. Typically, the elastic surface deforms between 0.5 millimeters (mm) and 20 mm, in response to the positive upper chamber medium pressure differential.

An LED tube lamp comprises a glass tube, two end caps coupled to a respective end of the glass tube, an LED light strip attached to an inner circumferential surface of the glass tube, a protective layer disposed on a surface of the LED light strip, a plurality of LED light sources mounted on the LED light strip, two first soldering pads arranged at an end of the LED light strip, two notches formed at an edge of the end of the LED light strip, a power supply module configured to drive the plurality of LED light sources. The protective layer comprises two openings to expose the two first soldering pads. The power supply module comprises a printed circuit board comprising two second soldering pads and each of the two first soldering pad soldered to the respective second soldering pad by a solder. The solder is disposed on the first soldering pad, the corresponding second soldering pad and in the corresponding notch. The power supply module comprises a rectifying circuit and a filtering circuit coupled to the rectifying circuit.

An LED tube lamp comprises a glass tube, two end caps coupled to a respective end of the glass tube, an LED light strip attached to an inner circumferential surface of the glass tube, a protective layer disposed on a surface of the LED light strip, a plurality of LED light sources mounted on the LED light strip, two first soldering pads arranged at an end of the LED light strip, two notches formed at an edge of the end of the LED light strip, a power supply module configured to drive the plurality of LED light sources. The protective layer comprises two openings to expose the two first soldering pads. The power supply module comprises a printed circuit board comprising two second soldering pads and each of the two first soldering pad soldered to the respective second soldering pad by a solder. The solder is disposed on the first soldering pad, the corresponding second soldering pad and in the corresponding notch. The power supply module comprises a rectifying circuit and a filtering circuit coupled to the rectifying circuit.

A device for inductively soldering at least one ferromagnetic contact element to at least one conductor structure on a nonmetallic plate, includes a system for fastening a plate during the soldering operation, at least one soldering tool having at least one induction loop or induction coil suitable for emitting a magnetic field, a system for mutually positioning the soldering tool and the contact element such that the switched-on magnetic field of the soldering tool reliably heats the ferromagnetic contact element and thus the solder joint, a generator that is suitable for generating an alternating voltage with a frequency of up to 1500 kHz and that can be connected to the induction loop or induction coil.

A soldering tool for inductive soldering, includes an induction loop and an induction generator that is electrically conductively connected to the induction loop, wherein the induction loop consists of a metal profiled element, has at least one U-shaped region or two U-shaped regions, and each U-shaped region has in each case two legs and an end region connecting the legs, the at least one U-shaped region has a length L of at least 3 mm to 500 mm and a width B of 2 mm to 30 mm.

An LED tube lamp comprises an LED module for emitting light; and a ballast interface circuit coupled to the LED module and comprising a thyristor device configured to determine whether an input external driving signal is a high frequency or high voltage signal. When the external driving signal is determined to be a high frequency or high voltage signal, the ballast interface circuit causes current conduction in the LED module for emitting light, and specifically the thyristor device is configured to conduct current upon the external driving signal being input. The ballast interface circuit further comprises a transistor, an inductor, and a resistor connected to each other; and the inductor is coupled between a terminal of the thyristor device and the LED module. Upon the thyristor device being turned on a current flowing through the inductor and the transistor maintains the conduction state of the thyristor device.

An LED tube lamp comprises an LED module for emitting light; and a ballast interface circuit coupled to the LED module and comprising a thyristor device configured to determine whether an input external driving signal is a high frequency or high voltage signal. When the external driving signal is determined to be a high frequency or high voltage signal, the ballast interface circuit causes current conduction in the LED module for emitting light, and specifically the thyristor device is configured to conduct current upon the external driving signal being input. The ballast interface circuit further comprises a transistor, an inductor, and a resistor connected to each other; and the inductor is coupled between a terminal of the thyristor device and the LED module. Upon the thyristor device being turned on a current flowing through the inductor and the transistor maintains the conduction state of the thyristor device.