Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

A screen printing machine configured to print solder onto a surface of a circuit board using a screen mask. The screen printing machine is provided with: a screen mask arranged at a top side of the circuit board; a box member arranged at an underside of the circuit board including a space that is closed by the circuit board; a negative pressure generator connected to the space of the box member and configured to create negative pressure inside the space; a sensor configured to detect a pressure inside the space; and a control device configured to control the negative pressure generator based on the pressure detected by the sensor.

A method for forming solder deposits on elevated contact metallizations of terminal faces of a substrate formed in particular as a semiconductor component includes bringing wetting surfaces of the contact metallizations into physical contact with a solder material layer. The solder material is arranged on a solder material carrier. At least for the duration of the physical contact, a heating of the substrate and a tempering of the solder material layer takes place. Subsequently a separation of the physical contact between the contact metallizations wetted with solder material and the solder material layer takes place.

A method for filling a through hole with solder includes mounting a substrate having a through hole formed therein on a permeable barrier layer having pores that enable gas to flow through the permeable barrier. A solder source is positioned over the through hole. Molten solder is delivered in the through hole with a positive pressure from the solder source such that gas in the through holes passes the permeable barrier while the molten solder remains in the through hole.

A soldering device includes a laser head for outputting a laser beam and a solder feeder for feeding a thread solder to a path of the laser beam. The soldering device includes a solder receiving member for receiving solder melted by the laser beam and a pouring member for pouring molten solder into a workpiece. The solder receiving member includes a recess part having a shape for retaining the molten solder. The pouring member has a groove part communicating with the recess part and allowing the solder to flow therein.

A micro-region semi-solid additive manufacturing method is provided, where rod-shaped materials are used as consumables, and front ends of the consumables are heated by means of high-energy beam, an electric arc, a resistance heat, or the like, to enable the front ends to be in a semi-solid state in which the solid-liquid two phases coexist; at the same time, the rotational torsion and the axial thrust are applied to the consumables to perform shearing, agitation and extrusion on the semi-solid front ends, that is, the mold-free semi-solid rheoforming is performed. The consumable is transmitted to the bottom layer metal continuously in this manner to form metallurgical bonding, the stacking process is repeated according to a planned route obtained after discretization slicing treatment, and then an object or a stack layer in a special shape can be formed.

The present application relates to a stencil device (150) for simultaneous stencil printing of brazing material onto elevations, areas surrounding port openings, and a circumferential skirt (210) of a heat exchanger plate (200) wherein the stencil device (150) comprises an upper stencil having openings for applying brazing material to elevations and areas surrounding port openings of the heat exchanger plate (200) and a lower stencil printing stencil (150) having a large opening (190) for receiving the heat exchanger plate (200) and contacting an outer perimeter of the circumferential skirt (210) of the heat exchanger plate (200), wherein an inner surface (195) of the large opening (190) comprises brazing material exits (160) for applying brazing material to the circumferential skirts (195). Disclosed is also a method of such stencil printing and also the use of a stencil device for applying heat exchanger plates (200) with a brazing material.

Systems and methods for moving a substrate to a vision system using a robot; using the vision system to determine where a braze material is to be applied to the substrate; moving the substrate to a braze dispenser using the robot; applying a braze material to the substrate using the braze dispenser based on the determination from the vision system; and using the vison system to determine whether to apply additional braze to the substrate, including for the substrate of a component for gas turbine engine, such as configured for use in an aircraft.

Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wettable surface of a planar substrate; aligning the pin with the solder disposed on the non-wettable surface of the planar substrate; inserting the pin in the solder; and/or performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

A method for bonding a first downhole tool to a borehole tubular. The method may include applying solder particles, each particle having an outer shell and a core of liquid metal, to at least one of a surface of the first downhole tool or a surface of the borehole tubular. The method may also include rupturing the shells of the solder particles to release the liquid metal cores. The method may further include bonding the first downhole tool to the borehole tubular by allowing the released liquid metal core to solidify.