Filing a plated through-hole of a circuit board with solder is facilitated by an apparatus which includes a wire solder assembly and a controller. The wire solder assembly includes a wire probe sized to extend into the plated through-hole from one side of the circuit board, and a solder block associated with the wire probe so that the probe passes through the solder block. The controller controls heating of the wire probe, when the wire probe is operatively inserted into the plated through-hole, by passing a current through the wire probe. The heating of the wire probe heats a conductive plating of the plated through-hole and melts the solder block. The heating of the conductive plating and the melting of the solder block causes the solder to migrate into the plated through-hole by capillary action to fill the plated through-hole with the solder.

In an Injection Molded Soldering system, a single, one-layer decal has one or more through hole patterns where each through hole pattern has a plurality of through holes through the decal. A drum with a drum circumference turns while the decal is forced to be adjacent to the drum circumference. The decal passes by a tangent point on the drum circumference where one or more solder-filled through hole patterns align with recessed openings on a substrate at the tangent point of the drum circumference. Applied heat causes the solder structures to melt and flow into the recessed openings.

The disclosure describes techniques for joining a first part including a ceramic or a CMC and a second part including a ceramic or a CMC using brazing. A technique may include positioning a filler material in a joint region between the first and second parts and a metal or alloy on a bulk surface of the filler material. The metal or alloy may be locally heated to melt the metal or alloy, which may infiltrate the filler material. A constituent of the molten metal or alloy may react with a constituent of the filler material to join the first and second parts. Another technique may include depositing a powder that includes the filler material and the metal or alloy in the joint region. Substantially simultaneously with depositing the powder, the powder may be locally heated. A constituent of the molten metal or alloy may react with a constituent of the filler material to join the first and second parts.

A screen printing machine configured to print solder onto a surface of a circuit board using a screen mask. The screen printing machine is provided with: a screen mask arranged at a top side of the circuit board; a box member arranged at an underside of the circuit board including a space that is closed by the circuit board; a negative pressure generator connected to the space of the box member and configured to create negative pressure inside the space; a sensor configured to detect a pressure inside the space; and a control device configured to control the negative pressure generator based on the pressure detected by the sensor.

Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

A mold is used to form a solder joint to join the distal end of the guidewire to a wire coil. The mold has a cavity that can have different configurations so that the solder joint can be any of bullet shaped, micro-J shaped, cone shaped, truncated cone shaped, or have a textured surface.

The invention relates to a method (S) for attaching an SMD to a printed circuit (10), comprising the following steps: applying an insulating layer (20) (S1) onto the printed circuit (10), forming a cavity (22) in the insulating layer (20) above the conductive layer (12) (S2) of the printed circuit, filling the cavity (22) with a solder paste (3), positioning the SMD over the cavity (22) (S4), and applying a heat treatment (S5) to the printed circuit (10).

A soldering assembly and a method of manufacturing a soldering assembly is disclosed. The soldering assembly includes at least one nozzle for directing solder during a soldering operation. The at least one nozzle includes an inlet for receiving a supply of solder; an outlet for dispensing solder therefrom; and at least one channel fluidly coupling the inlet to the outlet. The at least one nozzle comprises a plurality of stacked layers of stainless steel or titanium, provided so as to at least partially define the at least one channel. The at least one nozzle is at least partially diffusion coated with chromium carbide so as to protect the stacked layers from corrosion.

A soldering nozzle (100) for selectively soldering assemblies by means of molten solder supplied through a soldering nozzle (100) from a solder bath. The soldering nozzle (100) is designed as a deep-drawn part. A method for the production of a soldering nozzle (100) is specified as well, including the provision of a blank (401); the drawing of the blank (401) through at least one female die (411, 421) by means of at least one male die (413, 422, 431) to produce an oblong shape (439) of locally annular or substantially annular cross-section, with a first end (436) corresponding to an action point of the male die (413, 422, 431) and a second end (437) corresponding to an introduction cross-section of the male die (413, 422, 431), the cross-section preferably increasing from the first end (436) towards the second end (437); and the formation of an opening (446) at the tip end (436).

A microwave heating method using a microwave, including: controlling a frequency of the microwave, to form a single-mode standing wave; disposing an object to be heated in a magnetic field region where a strength of a magnetic field formed by the single-mode standing wave is uniform and maximum; and heating the object to be heated by magnetic heat generation by magnetic loss caused by an action of the magnetic field of the magnetic field region, and/or induction heating by an induced current generated in the object to be heated due to the magnetic field of the magnetic field region.