Systems and methods for moving a substrate to a vision system using a robot; using the vision system to determine where a braze material is to be applied to the substrate; moving the substrate to a braze dispenser using the robot; applying a braze material to the substrate using the braze dispenser based on the determination from the vision system; and using the vison system to determine whether to apply additional braze to the substrate, including for the substrate of a component for gas turbine engine, such as configured for use in an aircraft.

A soldering device includes a laser head for outputting a laser beam and a solder feeder for feeding a thread solder to a path of the laser beam. The soldering device includes a solder receiving member for receiving solder melted by the laser beam and a pouring member for pouring molten solder into a workpiece. The solder receiving member includes a recess part having a shape for retaining the molten solder. The pouring member has a groove part communicating with the recess part and allowing the solder to flow therein.

A soldering apparatus comprises a soldering mechanism and a management unit. The management unit converts operation history of the soldering mechanism into a numerical value, compares the numerical value to a predetermined threshold value, and generates a notifying signal if the numerical value exceeds the predetermined threshold value. The notifying signal may result in cessation of operation of the soldering mechanism. The notifying signal may result in a visual and/or audio reminder to the operator to inspect or replace a part of the soldering mechanism. With the management unit, the operator need not guess or rely on personal experience to determine when to perform an inspection or replacement. Reliance on personal experience can be error prone and lead to inefficiency. The management unit may reduce the possibility of soldering with a degraded soldering tip or other part, which may have an adverse effect on soldering quality.

In an Injection Molded Soldering system, a single, one-layer decal has one or more through hole patterns where each through hole pattern has a plurality of through holes through the decal. A drum with a drum circumference turns while the decal is forced to be adjacent to the drum circumference. The decal passes by a tangent point on the drum circumference where one or more solder-filled through hole patterns align with recessed openings on a substrate at the tangent point of the drum circumference. Applied heat causes the solder structures to melt and flow into the recessed openings.

In a method for joining different type of metals, an Al-based base material (2) made of an Al alloy or pure Al and a Cu-based base material (3) made of a Cu alloy or pure Cu are joined to each other. The Al-based base material (2) and the Cu-based base material (3) are joined to each other by laser welding for melting and solidifying a portion irradiated with laser light using a filler metal (5) made of an Al alloy containing at least one of Si and Cu.

Systems and methods for moving a substrate to a vision system using a robot; using the vision system to determine where a braze material is to be applied to the substrate; moving the substrate to a braze dispenser using the robot; applying a braze material to the substrate using the braze dispenser based on the determination from the vision system; and using the vison system to determine whether to apply additional braze to the substrate, including for the substrate of a component for gas turbine engine, such as configured for use in an aircraft.

The robot apparatus includes a solder pot having a nozzle from which solder flows out, a flux ejection tool for ejecting flux, and a support tool for supporting the solder pot. The robot apparatus includes a table for supporting a workpiece, and a placement member on which the operation tools and the solder pot can be placed. The controller performs a flux application control for coupling the flux ejection tool to the robot and applying flux to the workpiece, a preheating control for coupling the support tool to the robot and arranging the solder pot below the workpiece so as to heat the workpiece, and a supply control for moving the nozzle of the solder pot closer to the workpiece and supplying the solder.

Provided are a logic switching device and a method of manufacturing the same. The logic switching device may include a domain switching layer adjacent to a gate electrode. The domain switching layer may include a ferroelectric material region and an anti-ferroelectric material region. The domain switching layer may be a non-memory element. The logic switching device may include a channel, a source and a drain both connected to the channel, the gate electrode arranged to face the channel, and the domain switching layer provided between the channel and the gate electrode.

An embodiment of the disclosure is directed to a multi-layer contact plate configured to establish electrical bonds to battery cells in a battery module, comprising a first plate section configured with a first set of raised dimples on an inner side of the first plate section, a second plate section configured with a second set of raised dimples on an inner side of the second plate section, a cell terminal connection layer sandwiched between the first and second plate sections, wherein a portion of the cell terminal connection layer is configured to form a set of bonding connectors to provide a direct electrical bond between the multi-layer contact plate and terminals of at least one group of battery cells, and a set of inter-layer connection points arranged between at least the first and second plate sections, each of the set of inter-layer connection points being arranged where raised dimples on the first and second plate sections are aligned with each other.

Provided are a logic switching device and a method of manufacturing the same. The logic switching device may include a domain switching layer adjacent to a gate electrode. The domain switching layer may include a ferroelectric material region and an anti-ferroelectric material region. The domain switching layer may be a non-memory element. The logic switching device may include a channel, a source and a drain both connected to the channel, the gate electrode arranged to face the channel, and the domain switching layer provided between the channel and the gate electrode.