A method for continuously applying buildup material to an oil and gas tubular using low heat input welding without compromising the mechanical properties of the tubular. The method includes preparation of the surface of the oil and gas tubular and applying a consumable wire to the surface. The consumable wire may be a buildup material with a hardness that is similar to the hardness of the oil and gas tubular. The method may include removal of a defect prior to restoring wall thickness to the tubular. The method may include restoring the tubular so that a surface feature, such as taper, may be recut in a different location.

A method of using a processing oven may include disposing at least one substrate in a chamber of the oven and activating a lamp assembly disposed above them to increase their temperature to a first temperature. A chemical vapor may be admitted into the chamber above the at least one substrate and an inert gas may be admitted into the chamber below the at least one substrate. The temperature of the at least one substrate may then be increased to a second temperature higher than the first temperature and then cooled down.

A brazing apparatus to join a first component and a second component includes a heating element configured to melt a ring located at a joint between the first component and the second component, and a probe configured to contact the ring. A position of the probe is biased toward the ring. The probe is installed at a probe support. The probe is movable along a probe central axis relative to the probe support. A sensor is operably connected to the probe and is configured to determine movement of the probe along the probe central axis. The movement of the probe is indicative of melting of the ring.

A solder reflow apparatus includes a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated when the heat transfer fluid is heated; a heater configured to heat the heat transfer fluid to generate saturated vapor; a substrate stage configured to be moved up and down within the vapor generating chamber and configured to support a substrate on which an electronic component is mounted via solder; a cleaning portion installed in an upper portion of the vapor generating chamber, wherein the cleaning portion is configured to spray a cleaning fluid onto the substrate on the substrate stage, wherein the cleaning fluid includes a material the same as the heat transfer fluid; and a guide structure configured to collect the cleaning fluid sprayed onto the substrate on the substrate stage and to direct the cleaning fluid to a reservoir that contains the heat transfer fluid.

A soldering apparatus includes a soldering chamber having a soldering region. A transfer actuator passes through the soldering region. The transfer actuator is configured to move a substrate on which an electronic component is disposed into and out of the soldering region. A light source is disposed in the soldering chamber and casts light toward the soldering region. A shutter is disposed between the soldering region and the light source, and opens and closes a path of the light cast from the light source toward the soldering region. A controller is connected to the transfer actuator and the shutter and controls an opening and closing operation of the shutter.

A solder removing mechanism 520 is a solder removing mechanism for removing solder from conveyance claws 510 for conveying a substrate 200 to which the solder is supplied. The solder removing comprise an abutment body 530 that can relatively pass through recesses 511 of the conveyance claws 510 or below the conveyance claws 510.

A zone heater assembly of a reflow solder tool includes a gas deflector having a single-layer structure. The single-layer structure may include one or more gas-permeating patterns through which a process gas is to flow from one or more gas outlets to a gas exhaust of the zone heater assembly. The one or more gas-permeating patterns in the single-layer structure promote uniformity of gas flow through the gas exhaust and into a heating zone of the reflow solder tool. The uniformity of the gas flow of the process gas enables convection heat provided by the process gas to be uniformly distributed across the heating zone. In this way, the gas deflector described herein may decrease hot spots and/or cold spots in the heating zone, which enables greater flexibility in placement of semiconductor package substrates on a conveyor device of the reflow solder tool.

According to an aspect of the invention there is provided a reflow soldering method for manufacturing an electronic circuit board including a first component and a second component, wherein the first component has a first thermal mass, the second component has a second thermal mass and wherein the second thermal mass is different to the first thermal mass. The reflow soldering method includes: applying a solder paste to a substrate to be soldered; applying the first component to the substrate; applying the second component to the substrate; providing a heating control means proximal to one or both of the first component and the second component; forming a first solder joint between the first component and the substrate by heating the first component and the substrate; and forming a second solder joint between the second component and the substrate using the heater.

A brazing method for brazing metal pieces together via a brazing material includes the step of, in a heating chamber controlled to a preset oxygen concentration or less, sandwiching a workpiece of which the metal plates are stacked via the brazing material between a first heating plate and a second heating plate in such a manner that the first heating plate and the second heating plate cover the workpiece entirely as viewed in a thickness direction of the workpiece, and heating the workpiece to braze the metal plates together via the brazing material.

A jet soldering apparatus 100 has a storage tank 110 configured to store molten solder; a supply port 125, 135 for supplying the molten solder to a substrate 200; and a cooling unit 310, 330 that is positioned on a downstream side of the supply port 125, 135 in a conveyance direction of the substrate 200, is provided at an upper position of the storage tank 110, and is configured to supply gas.