A mold is used to form a solder joint to join the distal end of the guidewire to a wire coil. The mold has a cavity that can have different configurations so that the solder joint can be any of bullet shaped, micro-J shaped, cone shaped, truncated cone shaped, or have a textured surface.

Provided is a tabbing device for manufacturing a solar battery module, which is capable of preventing over-soldering and under-soldering from occurring in the tabbing device for performing soldering during manufacture of a solar battery module, wherein the tabbing device for manufacturing a solar battery module includes: a solar battery module cell transported by cell unit along conveyor transport equipment; a soldering head provided on an upper side of the solar battery module cell and having embedded therein a heat source configured to provide heat to solder flux coated on the solar battery module cell being transported; a cooling unit installed to be positioned outside the soldering head, and configured to discharge cooling fluid to a lower position of the soldering head and cool the soldering head; and a control unit configured to control operations of the cooling unit and the soldering head in a case where transportation of the solar battery module cell is stopped, wherein, when the transportation of the solar battery module cell is stopped, the control unit operates the cooling unit to provide the cooling fluid and when restarting, stops the operation of the cooling unit and controls the temperature of the heat source to be increased to a predetermined temperature until all of the solar battery module cells in the offset section pass through the lower part of the soldering head.

A desoldering equipment includes a carrier, a conveying assembly, a supporting assembly, a pressing assembly, a laser heating member, and a grabbing assembly. The carrier is configured to position a connecting board and a mainboard. The conveying assembly is configured to convey the carrier to a desoldering position along a first direction. The supporting assembly is arranged under the conveying assembly and configured to position the carrier at the desoldering position. The pressing assembly is arranged above the conveying assembly and configured to press down the mainboard in the carrier at the desoldering position. The laser heating member is configured to heat the connecting board in the carrier at the desoldering position. The grabbing assembly is configured to grab the connecting board on the mainboard pressed down by the pressing assembly and remove the connecting board. The desoldering equipment can remove the connecting board without damaging the mainboard.

A semiconductor processing apparatus includes a process chamber that defines an enclosure. The enclosure includes a substrate support configured to support a substrate and rotate the substrate about a central axis of the process chamber. The substrate support is also configured to move vertically along the central axis and position the substrate at multiple locations in the enclosure. The apparatus also includes one or more UV lamps configured to irradiate a top surface of the substrate supported on the substrate support.