A plate heat exchanger has two metal plates brought into abutment, with a solder material between the plates. The plates are heated up to a first temperature. The plates are placed into a mold, the mold surfaces of which have cavities for envisaged channel structures. Channel structures are formed by local internal pressure forming of at least one plate under pressurization by the tool. The plates are heated up to a second temperature. The plates are solder bonded at the abuted surfaces. A plate heat exchanger has two metal plates, wherein channel structures have been formed in at least one plate and the plates are bonded to one another by soldering away from the channel structures. Eutectic microstructures having a longest extent of less than 50 micrometers are formed in the solder layer.

A laser bonding system which improves bonding between a semiconductor chip and a substrate is provided. A laser bonding system comprises a laser bonding apparatus; and a controller configured to control the laser bonding apparatus, wherein the laser bonding apparatus includes a stage which supports a substrate including a pad, and a semiconductor chip including a connection terminal; a pressurizer which moves up and down above the stage; a temperature measuring sensor configured to measure a temperature of the semiconductor chip and generate a temperature value; and a laser radiation apparatus configured to bond a pad of the substrate and a connection terminal of the semiconductor chip, using a laser beam passing through the pressurizer, and the controller lifts the pressurizer in response to the temperature value.

A heat exchanger includes tubes, a pair of tanks, and a connector. The tubes are stacked with each other in a stacking direction. The pair of tanks are disposed at both ends of the tubes and a longitudinal direction of the tanks extends along the stacking direction. At least one of the tanks is a connecting tank. The connector is disposed in a side portion of the connecting tank to fluidly connect a pipe to the connecting tank. The connecting tank has a tubular shape and includes a flat surface on the side portion. The connector includes a facing surface facing the flat surface. The facing surface is joined to the flat surface such that at least a portion of the facing surface extends beyond the flat surface in a lateral direction of the connecting tank.

A uniform pressure gang bonding device and fabrication method are presented using an expandable upper chamber with an elastic surface. Typically, the elastic surface is an elastomer material having a Young's modulus in a range of 40 to 1000 kilo-Pascal (kPA). After depositing a plurality of components overlying a substrate top surface, the substrate is positioned over the lower plate, with the top surface underlying and adjacent (in close proximity) to the elastic surface. The method creates a positive upper chamber medium pressure differential in the expandable upper chamber, causing the elastic surface to deform. For example, the positive upper chamber medium pressure differential may be in the range of 0.05 atmospheres (atm) and 10 atm. Typically, the elastic surface deforms between 0.5 millimeters (mm) and 20 mm, in response to the positive upper chamber medium pressure differential.

A jaw assembly includes an electrically-conductive tissue-engaging structure, a jaw member including a support base, and a non-electrically conductive member including a first portion configured to engage the electrically-conductive tissue-engaging structure and a second portion configured to engage the support base of the jaw member. The non-electrically conductive member adapted to electrically isolate the electrically-conductive tissue-engaging structure from the jaw member. The electrically-conductive tissue-engaging structure and the non-electrically conductive member cooperatively define a longitudinally-oriented knife channel therethrough.

The disclosure discloses a manufacturing method of tempered vacuum glass, comprising the following steps: (1) manufacturing metalized layers, and performing tempering or thermal enhancement on the glass substrates; (2) placing a metal solder on the metalized layers; (3) superposing the glass substrates to form a tempered glass assembly; (4) heating the tempered glass assembly to 60-230° C.; (5) keeping the tempered glass assembly within the heating temperature range of step (4) in a vacuum chamber, and vacuumizing the vacuum chamber to a preset vacuum degree; and (6) hermetically sealing the metalized layers by adopting a metal brazing process. By adopting the manufacturing method of the disclosure, the stress when the two glass substrates are sealed can be greatly reduced, and the connection strength can be increased; moreover, when gas is exhausted within the temperature range, the exhaust efficiency is high, and the exhaust effect is better, vacuum glass with high vacuum degree can be obtained, and the service life of the vacuum glass is prolonged. The disclosure further discloses a tempered vacuum glass production line based on the above mentioned manufacturing method.

A device for inductively soldering at least one ferromagnetic contact element to at least one conductor structure on a nonmetallic plate, includes a system for fastening a plate during the soldering operation, at least one soldering tool having at least one induction loop or induction coil suitable for emitting a magnetic field, a system for mutually positioning the soldering tool and the contact element such that the switched-on magnetic field of the soldering tool reliably heats the ferromagnetic contact element and thus the solder joint, a generator that is suitable for generating an alternating voltage with a frequency of up to 1500 kHz and that can be connected to the induction loop or induction coil.

A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The bonding tool also includes a standoff extending from the body portion, and configured to contact the substrate during at least a portion of the bonding process.

A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be on a non-diffusable type, such as aluminum nitride, alumina, beryllium oxide, and zirconia, and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

The present application provides an apparatus for preventing solder paste dripping, comprising: a working platform support apparatus; a working platform connected in a fixed manner to one end of the working platform support apparatus, the working platform being used to bear a solder paste tub comprising a housing, with a solder paste nozzle being accommodated in the housing, the solder paste nozzle being mounted on the working platform, so that the solder paste tub is borne in an inverted manner on the working platform by means of the solder paste nozzle, with the housing being capable of moving relative to the solder paste nozzle so as to extrude solder paste accommodated in the solder paste tub from the solder paste nozzle; and a holder, the holder being connected to the housing of the solder paste tub and located above the working platform, and the holder being slidably connected to the working platform support apparatus, so that the holder can move downward as the amount of solder paste in the solder paste tub decreases, to adjust the relative position of the solder paste nozzle and the housing.