A fixture assembly includes a first fixture portion, a second fixture portion that interfaces with the first fixture portion, and a sub-fixture movably mounted to the first fixture portion. A multiple of actuators selectively move the sub-fixture toward the second fixture portion. A method of manufacturing a fan blade includes deploying the sub-fixture from the first fixture portion to effectuate a peripheral diffusion bond to join the blade body and the cover of the fan blade.

A pressing area set on a main surface of a plate-shaped holding jig is arranged on contact parts. The contact parts are pressed against a multilayer board while heating the multilayer board and the pressing area of the holding jig is inclined with a warp of the multilayer board. In this way, when pressing for bonding the contact parts is performed, even if the multilayer board is warped by the heating and the contact parts are shifted, the contact parts are pressed against the multilayer board without fail.

A jaw assembly includes an electrically-conductive tissue-engaging structure, a jaw member including a support base, and a non-electrically conductive member including a first portion configured to engage the electrically-conductive tissue-engaging structure and a second portion configured to engage the support base of the jaw member. The non-electrically conductive member adapted to electrically isolate the electrically-conductive tissue-engaging structure from the jaw member. The electrically-conductive tissue-engaging structure and the non-electrically conductive member cooperatively define a longitudinally-oriented knife channel therethrough.

A bonding device (100) bonds at least one component (C) to a substrate (B) using a metal material (M). The bonding device (100) includes a wall section (20), at least one pressing section (40), and a rotational shaft (30). The rotational shaft (30) is fixed to the wall section (20). Each pressing section (40) has an arm (42) and a presser (43) or a substrate supporting member (90). The arm (42) extends from the rotational shaft (30). The arm (42) pivots about the rotational shaft (30). The presser (43) presses the component (C). The substrate supporting member (90) is disposed on a reference surface (142). The substrate supporting member (90) supports the substrate (B). The component (C) is bonded to the substrate (B) through point contact of the presser (43) with the component (C) or point contact of the substrate supporting member (90) with the reference surface (142).

A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The bonding tool also includes a standoff extending from the body portion, and configured to contact the substrate during at least a portion of the bonding process.

A robotic wire termination system for efficiently and accurately connecting a plurality of wires to an electrical connector having a plurality of connector pins with corresponding wire receptacles. The system generally includes a housing, a removable alignment plate, a robotic positioner, a heating device, a touch responsive display, and a control unit. The alignment plate removably holds a selected electrical connector in a specific position and orientation with the connector pins exposed in the housing and the wire receptacles exposed outside. The display provides a visual representation of the connector pins and selections of the connector pins. The control unit receives inputs indicating the pin selections and controls the robotic positioner to sequentially move the heating device along three orthogonal longitudinal axes to a series of heating positions relative to the selected connector pins to provide heat for melting solder to connect wires to the wire receptacles.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an electronic component at a first printing unit, and the electronic component is subsequently placed onto a substrate with the portions of viscous material between the electronic component and the substrate. Optionally, a printing unit which prints the dots of material onto the electronic component includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the electronic component by the printing unit. The system may also include imaging units to aid in the overall process.

A soldering fixture for coupling surface-mount leads of an edge connector to corresponding pads on a PCB includes a base for positioning over the edge connector. A threaded mounting shaft is connected to the base and rotatable relative thereto. An alignment shaft is threadably engaged with the threaded mounting shaft and connected to the base such that rotation of the threaded mounting shaft causes longitudinal movement of the alignment shaft relative to the threaded mounting shaft and the base. An adjustment device is connected to the threaded mounting shaft for rotating the threaded mounting shaft to move threads on the alignment shaft into engagement with the leads to move the leads into alignment with the pads.

A screen printing machine configured to print solder onto a surface of a circuit board using a screen mask. The screen printing machine is provided with: a screen mask arranged at a top side of the circuit board; a box member arranged at an underside of the circuit board including a space that is closed by the circuit board; a negative pressure generator connected to the space of the box member and configured to create negative pressure inside the space; a sensor configured to detect a pressure inside the space; and a control device configured to control the negative pressure generator based on the pressure detected by the sensor.

Device for thermal joining of a heat exchanger for a motor vehicle. The device has a first and a second locating elements and at least one heat source. The locating elements are designed with at least one thermal insulation and with mutually aligned contact surfaces for joining an object between them. At least one locating element is designed movably in relation to the other locating element. At least the first locating element has at least one thermal mass, which is heatable by means of the heat source. The second locating element has a support element with a contact surface for the object, while at least a first thermal mass of the first locating element has a contact surface for heating the object via heat conduction.

Method for thermal joining with the device. The use of the method for manufacturing a heat exchanger of plate elements for a motor vehicle.