A soldering tool may include a tool body comprising circuitry configured to interface with a controller, and a tip portion including a tip that is heated to melt solder and a handpiece that is graspable by an operator. The tip portion includes a heater and a sensor disposed in the tip. The tip portion includes a tip memory device disposed at the handpiece. The tip memory device is configured to store parametric data. The tip memory device is configured to exchange data with the controller.

A method for continuously applying hardbanding to an oil and gas tubular or building up a worn oil and gas tubular that includes low heat input welding without compromising the mechanical properties of the tubular. The method includes preparation of the surface of the oil and gas tubular and applying a consumable wire to the surface. The consumable wire may be hardbanding or buildup material with a hardness that is similar to the hardness of the oil and gas tubular.

A radiating structure assembly system includes a movable conveyor that supports fixtures. Work stations are spaced about the conveyor such that the fixtures are moved sequentially to position the fixtures at the plurality of work stations. A first work station includes a loading assembly for loading the radiating elements on the fixtures. A second work station includes a first automated vertical assembly machine for mounting a first printed circuit board to the radiating element. A third work station includes a second automated vertical assembly machine for mounting a second printed circuit board to the radiating element to create a dipole assembly. A holding device is movable with the conveyor aligns and supports the first and second printed circuit boards relative to the radiating element. A fourth work station includes an unloading assembly for removing the dipole assembly from the conveyor.

The present invention relates to a turntable-type probe pin laser bonding apparatus. More particularly, a dual laser optic module of the turntable-type probe pin bonding apparatus of the present invention provides an integrated dual laser optic module that is overlappingly irradiated on a co-focus by improving the conventional first and second laser optic modules that have been completely separated and arranged independently with different focal points. During laser bonding of probe pins, which are getting miniaturized day by day, the power and density of the first and second laser beams overlappingly irradiated from the integrated dual laser optic module can be precisely controlled so that a turntable-type probe pin laser bonding apparatus of the present invention can significantly improve the bonding defect rate, as well as contribute to high integration and high precision of the apparatus.

A vibration drive device that suppresses an increase in the number of component parts and can be easily downsized. Vibration is excited in a vibration element in pressure contact with a driven element to thereby rotationally move the driven element relative to the vibration element. A bearing rotatably supports the driven element. A first and a second bearing portions are joined to the driven element. The second and a third bearing portions are pressed against each other via rolling elements in a direction along the axis of the bearing. The rolling elements are brought into pressure contact with the first raceway surface of the first bearing portion, the second raceway surface of the second bearing portion, and the third raceway surface of the third bearing portion. One of the second and third bearing portions is integrally formed with the driven element from the same material.

A fixture assembly includes a first fixture portion, a second fixture portion that interfaces with the first fixture portion, and a sub-fixture movably mounted to the first fixture portion. A multiple of actuators selectively move the sub-fixture toward the second fixture portion. A method of manufacturing a fan blade includes deploying the sub-fixture from the first fixture portion to effectuate a peripheral diffusion bond to join the blade body and the cover of the fan blade.

Systems and methods are disclosed herein relating to eliminating solder bridges between adjacent leads of small-pitch through-hole electrical components soldered to circuit boards using wave-soldering techniques. Several wave solder pallet insert patterns are disclosed. Each wave solder insert may include an insert pattern of peeling members is intended to eliminate solder bridges from various small-pitch component lead layouts.

An apparatus and method for soldering an electrical component to a circuit board includes a stage positioning the circuit board and electrical component in alignment with a solder tip along an axis. A first spring-loaded compression mechanism maintains contact between the circuit board and the electrical component, and a second spring-loaded compression mechanism brings the soldering tip into thermal contact with the circuit board and the electrical component such that solder disposed adjacent to the circuit board and the electrical component melts. When the second spring-loaded compression mechanism removes its applied force such that the soldering tip comes out of contact with the circuit board, the first spring-loaded compression mechanism maintains the contact between the circuit board and the electrical component while the solder cools and solidifies.

A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.

A brazing method for brazing a material without using a flux includes performing brazing in an inert gas atmosphere, in a state in which the material to be brazed is covered with a cover member formed of an upper cover portion covering the whole upper portion of the material to be brazed and side cover portions covering at least some of the side portions of the material to be brazed, with the upper cover portion contacting the upper portion of the material to be brazed, and the material to be brazed and the cover member are held with a heat transmission promoting member formed of an upper heat transmission promoting portion and a lower heat transmission promoting portion, with the upper heat transmission promoting portion contacting the upper cover portion, and with the lower heat transmission promoting portion contacting the lower portion of the material to be brazed.