A soldering jig assembly for soldering conductors together includes a plate that may be positioned on a support surface. A pair of gripping units is provided. Each of the gripping units is coupled to the plate and each of the gripping units is selectively manipulated. Each of the gripping units engages an associated one of a pair of conductors.

A method for continuously applying hardbanding to an oil and gas tubular or building up a worn oil and gas tubular that includes low heat input welding without compromising the mechanical properties of the tubular. The method includes preparation of the surface of the oil and gas tubular and applying a consumable wire to the surface. The consumable wire may be hardbanding or buildup material with a hardness that is similar to the hardness of the oil and gas tubular.

A precision soldering fixture provides a way to align and hold wires in place for soldering. The precision soldering fixture comprises a support member and a clamping assembly. The support member includes one or more elongated channels and may include a connector notch for holding and soldering wires. The clamping assembly comprises a nut and bolt base mechanism including clamping bars to hold the wires and preferably knurled fingers nuts, tightening the clamping bars, and thus the wires, in place. There can also be attachments secured to the support member to facilitate use. One such attachment may be a vise block fastened to the support member when securing the precision soldering fixture in a vise. Additionally, an alligator clip may be secured between the support member and the vise block, clipping the precision soldering fixture for soldering wires in situ. Further, a base with a magnet may be attached.

Disclosed are a contactless card manufacturing apparatus and a contactless card manufacturing method. The contactless card manufacturing apparatus comprises: an antenna implantation device, wherein the antenna implantation device is used for implanting a copper wire into a card manufacturing base material; a chip fixing device, wherein the chip fixing device is used for placing a chip at a fixed position on the card manufacturing base material; a pin welding device, wherein the pin welding device is used for respectively welding two ends of a wire to a pin of the chip and to the copper wire; and a transmission device, wherein the transmission device is used for transmitting the card manufacturing base material between the antenna implantation device, the chip fixing device and the pin welding device. According to the contactless card manufacturing apparatus and the contactless card manufacturing method, by means of the transmission device transmitting the card manufacturing base material, the card manufacturing base material is transmitted between the devices corresponding to various processing links, and with the card manufacturing base material as a reference, a required chip and antenna are disposed on the surface of the card manufacturing base material, such that a contactless card is manufactured in a more automated and standardized manner, and the labor costs for the manufacturing are reduced.

A soldering tool may include a tool body comprising circuitry configured to interface with a controller, and a tip portion including a tip that is heated to melt solder and a handpiece that is graspable by an operator. The tip portion includes a heater and a sensor disposed in the tip. The tip portion includes a tip memory device disposed at the handpiece. The tip memory device is configured to store parametric data. The tip memory device is configured to exchange data with the controller.

A solder reflow apparatus includes a vapor generating chamber configured to accommodate a heat transfer fluid and to accommodate saturated vapor generated by heating the heat transfer fluid; a heater configured to heat the heat transfer fluid accommodated in the vapor generating chamber; a substrate stage configured to be movable upward and downward within the vapor generating chamber, the substrate stage including a seating surface; vapor passages penetrating the substrate stage and configured to allow the vapor to move therethrough; and suction passages penetrating the substrate stage to be open to the seating surface and in which at least a partial vacuum is generated.

The present industrial property right relates to a method for producing a cooling plate, to the cooling plate as such and to a battery system and an electric vehicle. According the method for the production of the cooling plate at least two flat metal sections are interconnected by laser beam welding.

A soldering apparatus and solder nozzle module thereof are provided. In one embodiment, the soldering apparatus includes a rectangular base; a plurality of columns disposed on edges of the base; a lower heating module vertically disposed through the base; a spooling mechanism disposed on both the base and the lower heating module; a belt conveyor mechanism disposed on the base and under the spooling mechanism; a movement mechanism moveably disposed on the columns at one side of the base and the columns at the other side of the base; and a solder nozzle module having two sides supported by the movement mechanism and disposed through the spooling mechanism to be disposed on the lower heating module.

Provided are a flip chip laser bonding apparatus and a flip chip laser bonding method, and more particularly, to an apparatus and method for flip chip laser bonding, in which a semiconductor chip in a flip chip form is bonded to a substrate by using a laser beam. According to the flip chip laser bonding apparatus and the flip chip laser bonding method, even a semiconductor chip that is bent or is likely to bend may also be bonded to a substrate without contact failure of solder bumps by bonding the semiconductor chip to the substrate by laser bonding while pressurizing the semiconductor chip.

A component having electrical connector elements for making contact with a circuit board, optionally having additional securing elements for mechanical stability after soldering or positioning devices for supporting components with an unfavourable center of gravity or supporting elements which can optionally be removed after the soldering process. The positioning devices or supporting elements serve to position components with different forms on a circuit board and to keep them in the correct orientation for the soldering process. Fitting takes place in a force-free manner and thus favours automation and the use of for example pick-and-place robots which take hold of and move the particular component via the positioning device connected thereto, engaging with and/or around either a contact element or a supporting element. The support of the positioning device allows a stable state during the soldering process. In a corresponding manner, methods for carrying out the soldering processes are specified.