A soldering apparatus includes a reflow oven, a transmission mechanism, and a controlling unit. The reflow oven includes an inlet and an output mechanism. The output mechanism includes two guide rails and two link belts. An end of a first guide rail has a first alignment structure. The two link belts are movably disposed on the guide rails for outputting a printed wiring board. A distance between the guide rails is previously adjusted to be equal to a width of the printed wiring board. The transmission mechanism includes two tracks and two conveyor belts. An end of a first track has a second alignment structure. The two conveyor belts are movably disposed on the two tracks for transporting the printed wiring board. The controlling unit controls a movement of the first track, so that the first alignment structure and the second alignment structure are automatically aligned with each other.

The present disclosure relates to a brazing tooling for the manufacture of a part, and in particular to a tooling adapted for brazing a set of metallic parts, in particular a composite panel, in an enclosure of a brazing furnace. The tooling includes a first mold element and a second mold element clasped together and a bearing device. The first and the second mold elements respectively include a first material and a second material, the first material having an expansion coefficient greater than the expansion coefficient of the material of the set of parts, and the second material having an expansion coefficient lower than the expansion coefficient of the material of the set of parts. At the brazing temperature, constraining of the set of parts between the bearing device of the first and second mold elements is provided.

The invention relates to an apparatus for especially thermally joining micro-electromechanical parts (2, 3) in a process chamber (8), comprising a bottom support plate (11) for holding at least one first (2) of the parts (2, 3) to be joined, and a pressing device (15) for applying pressure to at least one second (3) of the parts (2, 3) to be joined in relation to the at least one first part (2). The pressing device (15) is equipped with an expandable membrane (19) provided for entering in contact with the at least one second part (3). Fluid pressure, in particular gas pressure, can be applied to said membrane (19) on the side thereof facing away from the parts (2, 3) to be joined.

A method includes placing a first package component over a vacuum boat, wherein the vacuum boat comprises a hole, and wherein the first package component covers the hole. A second package component is placed over the first package component, wherein solder regions are disposed between the first and the second package components. The hole is vacuumed, wherein the first package component is pressed by a pressure against the vacuum boat, and wherein the pressure is generated by a vacuum in the hole. When the vacuum in the hole is maintained, the solder regions are reflowed to bond the second package component to the first package component.

A laser assembly is disclosed. The laser assembly includes a carrier for mounting a semiconductor laser diode (LD) and a capacitor thereon. The carrier provides, in a top surface thereof, a metal pattern having a die area for mounting the LD through a brazing material, a mounting area, and an auxiliary area for absorbing a surplus brazing material. The capacitor is mounted on the mounting area closer to the LD through another brazing material.

A soldering jig for double-faced cooling power modules is provided. The soldering jig prevents thermal deformation of a substrate during a soldering process. The soldering jig is used to fix the position of an upper substrate and a lower substrate when a semiconductor chip is disposed and soldered between the upper and lower substrates. The soldering jig includes a lower jig plate that is disposed under the lower substrate and fixes the position of lower substrate, an upper jig plate that is disposed over the upper substrate and compresses the upper substrate toward the lower substrate. Additionally, a connector which couples the lower jig plate and the upper jig plate, and an insert is installed on the connector and is disposed between the upper substrate and the lower substrate to maintain a constant distance between the upper substrate and the lower substrate during a soldering process.

A method for manufacturing a ceramic heater-type glow plug that includes: a ceramic heater; a metallic outer cylinder that holds the ceramic heater at one end and has the other end inserted in and fixed to a metallic housing; and lead wire that is connected to the ceramic heater and electrifies the ceramic heater, the method for manufacturing a ceramic heater-type glow plug includes the steps of: forming a metalized layer in a region of the ceramic heater that is connected to the lead wire; press-inserting at least the metalized layer of the ceramic heater in a connection fitting that connects the ceramic heater and the lead wire; and heating the ceramic heater and the connection fitting at a temperature at which a material for forming the metalized layer is brought into a semi-molten state and joining by mass transfer between the connection fitting and a solid layer of the metalized layer.

A paste dispensing transfer system of a stencil printer is configured to print an assembly material on an electronic substrate. The transfer system includes a paste cartridge mechanism coupled to a print head assembly of the stencil printer, and a rotary indexing mechanism coupled to a frame of the stencil printer. The paste dispensing transfer system is configured to transfer a used paste cartridge from the print head assembly to the rotary indexing mechanism supported by the frame and to transfer a new paste cartridge from the rotary indexing mechanism to the print head assembly.

A collet for attachment to distal portion (16) of a die-transporting shank (17), which comprises: a body (13) having a through hole (2) in its centre; said hole (2) consisting of three sections (3, 6, 7); first section (3) adjacent the proximal end (4) of the body (13), shaped to receive a protrusion on the shank distal portion (16); second section (6) adjacent the first section (3), linking the first section (3) to third section (7); said third section (7) opening to distal end (11) of the body (13); and an insert (14) having a through hole (10) in its centre, fitted into the third section (7); said insert hole (10) being smaller in diameter than that of the second section (6); distal portions of the body (13) and the insert (14) being of frusto-conical shape, having a flat-ended insert portion (12) extending beyond the distal end (11) of the body (13).

A soldering block for holding two electrical components in contact or proximity to facilitate their connection, such as by soldering. The soldering block utilizes a pair of fixation elements, such as spring tensioned clamps, to hold the first and second electrical elements in place, conveniently acting as a third hand for the electrician. The soldering block is especially well suited to connecting wires to the terminals of LED tape strip.