An assembly is provided. The assembly includes a component, a solder pin arranged on the component, an electrical structural unit, and a soldering point which is arranged on the electrical structural unit and forms an opening, into which the solder pin is insertable along an insertion direction in order to produce a soldered joint. The solder pin has an insertion portion which, on sides of the solder pin that face away from each other, forms insertion walls which are arranged at an acute angle to one another in such a way that the insertion portion tapers in the insertion direction. A part of the insertion portion is arranged outside the opening in such a way that one or more portions of the insertion walls extend inside the opening and one or more portions of the insertion walls extend outside the opening.

A uniform pressure gang bonding device and fabrication method are presented using an expandable upper chamber with an elastic surface. Typically, the elastic surface is an elastomer material having a Young's modulus in a range of 40 to 1000 kilo-Pascal (kPA). After depositing a plurality of components overlying a substrate top surface, the substrate is positioned over the lower plate, with the top surface underlying and adjacent (in close proximity) to the elastic surface. The method creates a positive upper chamber medium pressure differential in the expandable upper chamber, causing the elastic surface to deform. For example, the positive upper chamber medium pressure differential may be in the range of 0.05 atmospheres (atm) and 10 atm. Typically, the elastic surface deforms between 0.5 millimeters (mm) and 20 mm, in response to the positive upper chamber medium pressure differential.

A method of applying a braze component to a honeycomb structure may comprise: applying at least a partial vacuum within a chamber, the chamber defined at least partially by a vacuum device and a cover, the honeycomb structure disposed within the chamber, the braze component disposed between the honeycomb structure and the cover; pulling the cover towards the braze component in response to applying the partial vacuum; and pulling the braze component into a plurality of hexagonal cells defined by the honeycomb structure in response to pulling the cover towards the braze component.

Disclosed are a contactless card manufacturing apparatus and a contactless card manufacturing method. The contactless card manufacturing apparatus comprises: an antenna implantation device, wherein the antenna implantation device is used for implanting a copper wire into a card manufacturing base material; a chip fixing device, wherein the chip fixing device is used for placing a chip at a fixed position on the card manufacturing base material; a pin welding device, wherein the pin welding device is used for respectively welding two ends of a wire to a pin of the chip and to the copper wire; and a transmission device, wherein the transmission device is used for transmitting the card manufacturing base material between the antenna implantation device, the chip fixing device and the pin welding device. According to the contactless card manufacturing apparatus and the contactless card manufacturing method, by means of the transmission device transmitting the card manufacturing base material, the card manufacturing base material is transmitted between the devices corresponding to various processing links, and with the card manufacturing base material as a reference, a required chip and antenna are disposed on the surface of the card manufacturing base material, such that a contactless card is manufactured in a more automated and standardized manner, and the labor costs for the manufacturing are reduced.

Selective soldering system for selective wave soldering of circuit boards, including a solder pot, a solder nozzle which can be detachably arranged on the solder pot, wherein the solder nozzle has a nozzle base and a nozzle neck, wherein at the free end of the nozzle neck a nozzle opening is provided, the solder pot being arranged on a moving unit, which can be moved along an x and y axis in a horizontal plane and along a z axis in the vertical direction, and a control unit for controlling the moving unit.

A laser soldering system is disclosed. The laser soldering system has a moving system, a gripper mounted on the moving system, a presser mounted on the moving system and having a transparent member, and a laser. The gripper grips an object and places the object at a target location on a product to be soldered. The transparent member presses the object against the product. The laser emits a laser beam through the transparent member to solder the object to the target location while the object is pressed against the product.

A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The bonding tool also includes a standoff extending from the body portion, and configured to contact the substrate during at least a portion of the bonding process.

A heat exchanger brazing fixture including a baseplate including a first surface and a second surface located opposite the first surface and a first post including a first end and a second end located opposite the first end. The first post is operably associated with the first surface of the baseplate at the first end. The A heat exchanger brazing fixture further including a top plate operably connected to the first post and separated from the first surface of the baseplate by a selected distance. The top plate being configured to move in a first direction along the first post when a heat exchanger resting upon the first surface of the baseplate expands during a brazing process.

Systems and methods for moving a substrate to a vision system using a robot; using the vision system to determine where a braze material is to be applied to the substrate; moving the substrate to a braze dispenser using the robot; applying a braze material to the substrate using the braze dispenser based on the determination from the vision system; and using the vison system to determine whether to apply additional braze to the substrate, including for the substrate of a component for gas turbine engine, such as configured for use in an aircraft.

A pressure collet that operably engages with a die in which the pressure collet is configured to land on predetermined positions of the die without damaging said die, a perform, or a heat spreader during a reflow process. The pressure collet further comprises a plate that has a mounting surface and a plurality of contact pads that operably engages with the mounting surface of the plate. The plurality of contact pads is configured to apply pressure to predetermined positions of a die without the mounting surface of the plate contacting the die during a reflow process. The plate of the pressure collet is also formed of a first material and the plurality of contact pads are formed of a second material different than the first material.