The invention relates to an ultrasonic metal welding device and a method for welding electrical conductors using a compression chamber that is adjustable at least in height and that is delimited on opposite sides by a section of a sonotrode as a first delimiting surface and by at least one section of a counter electrode (156) as a second delimiting surface, wherein for welding, the counter electrode and the sonotrode are displaced relative to one another. The counter electrode used is one that comprises sections (152, 154) of geometrically different working surfaces or is composed of at least two sections that are displaceable relative to one another.

A metal wiring bonding structure 100 comprises contacts 753 of connection FPC 75 and heater lands 46 of a sheet heater 30 to be bonded by a solder bonding member 766. A connection FPC 75 includes contact opposed lands 754 famed of metal and disposed at positions respectively opposed to the plurality of contacts 753 on a surface of a support layer 751 opposite from a surface on which metal wires 750 are provided, and through holes 755 penetrating the contact opposed lands 754, the support layer 751, and contacts 753. Solder bonding members 756 cover surfaces of contact opposed lands 754 and are filled inside through holes 755 and in a bonding space C.

The inventors experimentally demonstrated NO.sub.2 gas sensing performance of multilayer black phosphorous (BP) field effect transistors. The BP sensors were sensitive to NO.sub.2 concentration down to 5 ppb making them comparable in sensitivity to the best 2D material based sensors. Raman spectroscopy comparison revealed no apparent change in the spectra before and after exposure to NO.sub.2, which shows that thick BP flakes can maintain their relative stability after sensing. Moreover, the BP device sensing performance fitted well with the Langmuir Isotherm for molecules adsorbed on a surface, which confirms charge transfer as the dominant mechanism for sensing. The systematic increase in conductance with increasing NO.sub.2 concentrations suggests NO.sub.2 molecules withdraw electrons and dope BP flakes with holes. These results lay the ground work for BP to be applied to various sensing applications including chemical, gas, and bio-sensors.

A calibration method for a bonder. Characteristics of a force actuator of the bonder are measured and stored in such a way that the force actuator can be controlled optimally during production operation of the bonder on the basis of the measured data. Further, a device for fully automatic or partially automatic bonding force calibration.

A method for compensating teaching positions which includes: generating a compensation start point and a compensation end point in positions where each of a number of teaching positions is sandwiched between the compensation start point and the compensation end point in a direction crossing a welding path, the number of teaching positions being set along the welding path of a welding base material; detecting a profile of the welding base material along a detection path by performing touch sensing while a welding torch is being moved along the detection path from the generated compensation start point toward the generated compensation end point, a welding wire protruding from the welding torch; and compensating each of the teaching positions based on the detected profile.

The present invention relates to a magnet wire bonding method and a bonding structure, and more particularly to a new improvement for ultrasonically bonding a longitudinal outer peripheral surface of a magnet wire having no entangling part to a flat surface of a flat part of a terminal pin. A magnet wire bonding method and structure, comprising: using a terminal pin (11) having a flat plate part (40) provided in a pin part (11a) as a terminal pin holding part (3); placing a magnet wire (13) in a longitudinally spread state on a flat surface (40a) of the flat plate part (40) without being entangled; and ultrasonically bonding an outer peripheral surface (13E) of the magnet wire (13) onto the flat surface (40a) with an ultrasonic horn (50).

A ribbon bonding tool is provided. The ribbon bonding tool includes a body portion including a tip portion, the tip portion defining a working surface. The ribbon bonding tool includes a group of four protrusions extending from the working surface, wherein the working surface defines four quadrants in a horizontal plane by extending an imaginary line at a midpoint along each of a length and a width of the working surface. Each of the four protrusions is arranged in one of four quadrants.

A method of operating a wire bonding machine is provided. The method includes the steps of: (a) supporting a substrate on a material handling system of the wire bonding machine; (b) changing a bend profile of the substrate; and (c) securing, after step (b), the substrate against a support structure of the wire bonding machine using a clamping element of the wire bonding machine, the support structure for supporting the substrate during a wire bonding operation, and the clamping element for securing the substrate to the support structure during the wire bonding operation.

A workpiece is described, and includes a substrate, a cable, and a cover piece. A portion of the cable is joined to the substrate employing a vibration welding tool, and the cover piece is interposed between the portion of the cable and the vibration welding tool during the joining.

A bonding apparatus has a bonding tool for bonding a wire to a bonding surface, a bonding tool retainer configured to releasably retain the bonding tool, a bonding tool holder configured to hold at least one bonding tool, a bonding tool manipulator configured to transfer said bonding tool between said bonding tool holder and said bonding tool retainer, and a bonding tool guide configured to guide said bonding tool to be received by said bonding tool retainer during transfer by said bonding tool manipulator.