A ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion includes a working surface between a front edge of the tip portion and a back edge of the tip portion. The working surface includes a region defining at least one of a plurality of recesses and a plurality of protrusions. The working surface also defines at least one of (a) a first planar portion between the region and the front edge of the tip portion, and (b) a second planar portion between the region and the back edge of the tip portion.

This wire clamp apparatus calibration method comprises: a step for driving a driving piezoelectric element by applying a predetermined frequency that causes a pair of arm portions to vibrate in an opening/closing direction; a step for detecting whether or not end portions of the pair of arm portions collide with each other on the basis of an output current outputted from the driving piezoelectric element when the pair of arm portions are vibrating in the opening/closing direction; a step for calculating, on the basis of the detection result, reference voltages in a state where the pair of arm portions are closed; and a step for performing calibration of a drive voltage to be applied to the driving piezoelectric element on the basis of the reference voltages. Accordingly, accuracy improvement and stabilization in an opening/closing operation of the wire clamp apparatus can be achieved.

A ball forming device 50 for forming a ball 43 at a tip of a wire 42 by producing discharge between a torch electrode 48 and the tip of the wire 42, the device includes: a current supply unit 54 configured to supply a ball-forming current between the torch electrode 48 and the tip of the wire 42; and a current control unit 57 configured to control the current supply unit 54, so that a signal of the ball-forming current for a predetermined period includes a first period in which the signal takes a predetermined current value and a second period including a triangle wave. With this, it is possible to provide a ball forming device, a wire-bonding apparatus, and a ball formation method that are capable of suppressing formation of deformed balls.

A bonding method for a conductor of an electric wire including a conductor formed of a plurality of strands and a sheath covering the conductor such that the conductor is exposed to a predetermined length. The bonding method includes bonding the strands to each other, the strands being spaced apart from the sheath by a predetermined length. An outer diameter of a middle portion of the conductor between a bonded portion and a portion covered with the sheath gradually decreases toward the bonded portion. A maximum value of an intersection angle between an upper surface of the bonded portion or a longitudinal direction of the electric wire and the strands of the middle portion is smaller than a predetermined angle. The predetermined angle is an angle at which breakage of the strands is prevented when the bonding is performed.

A bonding apparatus according to the present disclosure includes a bonding tool that bonds a wire to a terminal, a guide member that guides the wire, a clamp made of a conductive material and capable of fixing the wire, and an electrical property measurement unit electrically connected to the clamp. The clamp is configured to be electrically connected to the wire when the wire is fixed. After the wire is bonded to the terminal using the bonding tool, the bonding apparatus carries out a tensile test for fixing the wire using the clamp and pulling the wire bonded to the terminal with a predetermined load and an electrical property test for measuring an electrical resistance of a junction between the wire and the terminal using the electrical property measurement unit.

An ultrasonic welding device includes a sonotrode, an anvil, a touching element, a lateral slide, a stop element and a receiving chamber in which joining partners are received and which is defined by bordering components of the ultrasonic welding device. The receiving chamber is defined on a first side by the sonotrode and on a second side by the anvil. The receiving chamber is further defined on a third side by the touching element and on a fourth side by the lateral slide. The receiving chamber is further defined on a fifth side, extending transverse to the first to fourth sides, by the stop element. The first stop element is electrically conductive on its surface directed toward the receiving chamber in order to form a first electrode.

A ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion including a working surface, the tip portion including two side wall portions on either side of the working surface wherein a ribbon path is defined between the side wall portions.

In a described example, an electrical apparatus includes a substrate having a first surface and lead pads on the first surface of the substrate for surface mounting components. A ribbon wire bond is provided having open ends and a central portion between the open ends, the open ends of the ribbon wire bond connected to the lead pads. An electrical component is bonded to the central portion of the ribbon wire bond. The central portion of the ribbon wire bond and the electrical component are spaced from the first surface of the substrate.

A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).

A display device includes a plurality of pixels, a plurality of data lines connected to the pixels, an inspection circuit unit connected to the data lines, a driving circuit unit connected or configured to be connectable to the data lines, a bonding region comprising a first pad, a second pad, a third pad, and a fourth pad, the first pad and the second pad being electrically connected to each other through a first conductor, and the third pad and the fourth pad being electrically connected to each other through a second conductor, a first wire connected to the driving circuit unit and the third pad, a second wire connected to the driving circuit unit and the inspection circuit unit and a third wire connected to the inspection circuit unit and the first pad, where the second pad and the fourth pad are electrically connected to each other.