The present invention includes: an ultrasonic horn (14) to which two ultrasonic vibrations can be input to excite a capillary (15) mounted to a front end with different frequencies in a Y-direction and an X-direction; and a control unit (50) which adjusts the respective magnitude of the two ultrasonic vibrations. The Y-direction is a direction in which the ultrasonic horn (14) extends. The control unit (50) adjusts the respective magnitude of the two ultrasonic vibrations to adjust a ratio (ΔY/ΔX) of amplitude of the capillary (15) in the Y-direction and the X-direction. Thus, degradation in the quality of the joining between wires and leads is suppressed.

A bonding tool includes a wedge tool that presses a bonding wire against a principal plane of a structure such as an electrode to which the bonding wire is to be bonded. A groove formed in an end portion of a wedge tool body of the wedge tool is inclined along a longitudinal direction of the bonding wire so that a heel side of the groove is closer to the principal plane of the structure than a toe side of the groove. As a result, the wedge tool is inclined at a tilt angle and the bonding wire fits the groove in the end portion of the wedge tool body along the longitudinal direction of the bonding wire. Thus, a corner portion of the wedge tool does not contact the electrode.

In a terminal-attached electric wire applied to a wire harness, a metal terminal includes: an electric wire connection portion to which the electric wire is connected; a box-shaped portion that is formed into a box shape by a bottom body coupled to the electric wire connection portion and a pair of wall bodies formed by protruding individually from both ends of the bottom body in a width direction, and enables a counterpart terminal to be inserted into a terminal insertion space portion in an inside thereof along an axial direction intersecting the width direction; and a spring contact portion that is located inside the terminal insertion space portion, is elastically deformably supported in the box-shaped portion in a cantilever manner, and forms a contact with the counterpart terminal, and wherein the box-shaped portion has a displacement regulating portion that regulates a relative displacement between the pair of the wall bodies.

A wire bonding system has a bonding tool and a wire guide for guiding a bonding wire to a tip of the bonding tool for conducting wire bonding operations. A wire biasing tool is located adjacent to the wire guide, and a rotary actuator is operatively connected to the wire biasing tool by a linkage mechanism. The rotary actuator is operable to move the wire biasing tool along a predetermined travel path to apply a biasing force onto a length of bonding wire extending from the tip of the bonding tool.

An ultrasonic metal welding device for welding electrical conductors using a compression chamber that is adjustable at least n height and that is delimited on opposite sides by a section of a sonotrode as a first delimiting surface and by at least one section of a counter electrode (156) as a second delimiting surface, wherein for welding, the counter electrode and the sonotrode are displaced relative to one another. The counter electrode used is one that comprises sections (152, 154) of geometrically different working surfaces or is composed of at least two sections that are displaceable relative to one another.

A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).

A workpiece is described, and includes a substrate, a cable, and a cover piece. A portion of the cable is joined to the substrate employing a vibration welding tool, and the cover piece is interposed between the portion of the cable and the vibration welding tool during the joining.

A bonding apparatus is provided. This bonding apparatus uses images captured by an imaging apparatus and performs a packaging process for a semiconductor chip and additional processes other than the packaging process. The bonding apparatus is provided with: an aperture switching mechanism provided in an optical system of the imaging apparatus and capable of switching between a first aperture and a second aperture that has an aperture hole diameter greater than that of the first aperture; and a control unit which controls the aperture switching mechanism to switch to either the first aperture or the second aperture. The control unit performs the packaging process using an image captured by switching to the first aperture and performs the additional processes using an image captured by switching to the second aperture.

The invention relates to a bonding arrangement comprising a bonding tool including a tool shank, which is designed as elongated in a tool longitudinal direction, and including a tool tip, which adjoins the tool shank, and comprising a light guide designed to conduct a laser beam, the light guide being provided in a longitudinal recess of the bonding tool, the longitudinal recess extending from an end face of the bonding tool opposite the tool tip in the direction of the tool tip, a functional recess being formed on the lateral surface of the bonding tool, and the longitudinal recess being made to extend up to the functional recess. The invention further relates to a bonding tool having a functional application as well as the use of the bonding arrangement according to the invention and/or the bonding tool for ultrasonic bonding.

A bonding apparatus according to the present disclosure includes a bonding tool that bonds a wire to a terminal, a guide member that guides the wire, a clamp made of a conductive material and capable of fixing the wire, and an electrical property measurement unit electrically connected to the clamp. The clamp is configured to be electrically connected to the wire when the wire is fixed. After the wire is bonded to the terminal using the bonding tool, the bonding apparatus carries out a tensile test for fixing the wire using the clamp and pulling the wire bonded to the terminal with a predetermined load and an electrical property test for measuring an electrical resistance of a junction between the wire and the terminal using the electrical property measurement unit.