B23K20/233

STABILIZED TRANSIENT LIQUID PHASE METAL BONDING MATERIAL FOR HERMETIC WAFER LEVEL PACKAGING OF MEMS DEVICES
20170283255 · 2017-10-05 ·

In described examples, a transient liquid phase (TLP) metal bonding material includes a first substrate and a base metal layer. The base metal layer is disposed over at least a portion of the first substrate. The base metal has a surface roughness (Ra) of between about 0.001 to 500 nm. Also, the TLP metal bonding material includes a first terminal metal layer that forms an external surface of the TLP metal bonding material. A metal fuse layer is positioned between the base metal layer and the first terminal metal layer. The TLP metal bonding material is stable at room temperature for at least a predetermined period of time.

Method of riveting

A method of inserting a rivet into a workpiece comprises moving the rivet and workpiece relative to one another, along a longitudinal axis of the rivet, so as to drive the rivet into the workpiece. The rivet is rotated about its longitudinal axis, relative to the workpiece, for at least part of the time during which it is in contact with the workpiece. The speed of said rotation, or the speed of movement along the longitudinal axis of the rivet, is altered at least once before driving of the rivet into the workpiece is complete. One axial end of the rivet has a tip for piercing the workpiece, and the rivet has a substantially cylindrical shank extending longitudinally from the tip. The shank has one or more surface irregularities.

Welding light metal workpieces by reaction metallurgy

Aluminum alloy workpieces and/or magnesium alloy workpieces are joined in a solid state weld by use of a reactive material placed, in a suitable form, at the joining surfaces. Joining surfaces of the workpieces are pressed against the interposed reactive material and heated. The reactive material alloys or reacts with the workpiece surfaces consuming some of the surface material in forming a reaction product comprising a low melting liquid that removes oxide films and other surface impediments to a welded bond across the interface. Further pressure is applied to expel the reaction product and to join the workpiece surfaces in a solid state weld bond.

Welding light metal workpieces by reaction metallurgy

Aluminum alloy workpieces and/or magnesium alloy workpieces are joined in a solid state weld by use of a reactive material placed, in a suitable form, at the joining surfaces. Joining surfaces of the workpieces are pressed against the interposed reactive material and heated. The reactive material alloys or reacts with the workpiece surfaces consuming some of the surface material in forming a reaction product comprising a low melting liquid that removes oxide films and other surface impediments to a welded bond across the interface. Further pressure is applied to expel the reaction product and to join the workpiece surfaces in a solid state weld bond.

Bonding method
09731377 · 2017-08-15 · ·

A method of bonding a first article to a second article, each article having a respective bond surface. The method comprises interposing a porous interlayer region between the bond surfaces of the first and second articles and subsequently using electrical resistance heating to locally heat the interlayer region under contact pressure to a bonding temperature below the melting temperature of the interlayer and the first and second articles to thereby bond the interlayer to the first and second articles to form a bonded article. The interlayer has a porosity of between approximately 10% and 30%.

Bonding method
09731377 · 2017-08-15 · ·

A method of bonding a first article to a second article, each article having a respective bond surface. The method comprises interposing a porous interlayer region between the bond surfaces of the first and second articles and subsequently using electrical resistance heating to locally heat the interlayer region under contact pressure to a bonding temperature below the melting temperature of the interlayer and the first and second articles to thereby bond the interlayer to the first and second articles to form a bonded article. The interlayer has a porosity of between approximately 10% and 30%.

PROCESS FOR ELECTRICALLY CONNECTING CONTACT SURFACES OF ELECTRONIC COMPONENTS

A process for electrically connecting contact surfaces of electronic components by capillary wedge bonding a round wire of 8 to 80 μm to the contact surface of a first electronic component, forming a wire loop, and stitch bonding the wire to the contact surface of a second electronic component, wherein the wire comprises a wire core having a silver or silver-based wire core with a double-layered coating comprised of a 1 to 50 nm thick inner layer of nickel or palladium and an adjacent 5 to 200 nm thick outer layer of gold.

WELDING ELECTRODES AND METHODS OF MANUFACTURING SAME
20170225261 · 2017-08-10 ·

The present disclosure provides a welding electrode and methods of manufacturing the same. The welding electrode can include a composite body having a tip portion and an end portion. The composite body can include a shell defining a cavity through the end portion, the shell comprising a first metal that includes one or more of the following: a precipitation hardened copper alloy, copper alloy, and carbon steel. The composite body can also include a core within the shell, the core extending through the shell from the tip portion to the cavity, the core comprising a second metal that includes dispersion strengthened copper. The core and the shell have a metallurgical bond formed from co-extrusion.

REPAIR METHOD FOR TURBINE BLADES

Disclosed is a repair method for guide blades of a gas turbine. The method comprises: providing at least one guide blade to be maintained; capturing the actual geometry of the guide blade to be maintained with application of at least one measuring method; comparing the actual geometry captured by the contactless measuring method to a predetermined desired geometry for a corresponding guide blade type; calculating a target geometry for the guide blade to be maintained, which corresponds as much as possible to the desired geometry, such that using optimization parameters, the desired geometry of the guide blade to be maintained is approximated at least in sections along its flow contour; applying material and removing material by machine on the guide blade, such that the calculated target geometry is produced.

TAPERED MICRO-ELECTRONIC MICRO-CONNECTION DEEP-CAVITY WELDING CAPILLARY

A micro-electronic micro-connection deep-cavity welding capillary, comprising a cylindrical capillary body, one end of the capillary body is a frustoconical welding end, a stepped unfilled corner on an end face of the welding end in the lengthwise direction, the remaining end face of the welding end is a welding end face, a spherical segment-shaped through groove in the welding end face, a columnar first wire threading hole facing the interior of the capillary body in the other end face of the capillary body in the lengthwise direction, a columnar second wire threading hole that is coaxial with the first wire threading hole in a first side surface, not adjacent to the welding end face, of the unfilled corner, and a transition hole that connects the first wire threading hole to the second wire threading hole and has an isosceles-trapezoid-like cross section inside the capillary body.