B23K20/233

METHOD FOR BONDING SUBSTRATES TOGETHER, AND SUBSTRATE BONDING DEVICE
20170221856 · 2017-08-03 · ·

A production of voids between substrates is prevented when the substrates are bonded together, and the substrates are bonded together at a high positional precision while suppressing a strain. A method for bonding a first substrate and a second substrate includes a step of performing hydrophilization treatment to cause water or an OH containing substance to adhere to bonding surface of the first substrate and the bonding surface of the second substrate, a step of disposing the first substrate and the second substrate with the respective bonding surfaces facing each other, and bowing the first substrate in such a way that a central portion of the bonding surface protrudes toward the second substrate side relative to an outer circumferential portion of the bonding surface, a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate at the respective central portions, and a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate across the entirety of the bonding surfaces, decreasing a distance between the outer circumferential portion of the first substrate and an outer circumferential portion of the second substrate with the respective central portions abutting each other at a pressure that maintains a non-bonded condition.

METHODS AND PROCESS FLOWS FOR DIFFUSION BONDING AND FORMING METALLIC SHEETS
20170216958 · 2017-08-03 ·

Methods and process flows for diffusion bonding and forming metallic sheets are disclosed herein. The methods include stacking a first metallic sheet and a second metallic sheet to define a sheet stack. The methods further include creating a pneumatic seal between the first metallic sheet and the second metallic sheet to define a sealed sheet stack that defines a pneumatically isolated region. The methods also include increasing a surface area of the sealed sheet stack to define an expanded sheet stack. The methods further include compressing at least a portion of the expanded sheet stack to form a diffusion bond between a corresponding portion of the first metallic sheet and an opposed portion of the second metallic sheet thereby defining a diffusion bonded sheet stack.

Bonding head and a bonding apparatus having the same

A bonding head for performing a thermal compression process including a base body. A bonding heater is disposed on the base body that generates a melting heat. A bonding tool is disposed on the bonding heater that compresses a bonding object against a bonding base while transferring the melting heat to the bonding object to thereby bond the bonding object to the bonding base by the thermal compression process. A heat controller is disposed at the bonding tool, and a thermal conductivity of the heat controller is less than a thermal conductivity of the bonding tool.

Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate

A power module substrate includes a circuit layer, an aluminum layer arranged on a surface of an insulation layer, and a copper layer laminated on one side of the aluminum layer. The aluminum layer and the copper layer are bonded together by solid phase diffusion bonding.

Golf club face plates with internal cell lattices and related methods

Embodiments of golf club face plates with internal cell lattices are presented herein. Other examples and related methods are also disclosed herein.

Golf club face plates with internal cell lattices and related methods

Embodiments of golf club face plates with internal cell lattices are presented herein. Other examples and related methods are also disclosed herein.

RFeB-based magnet and method for producing RFeB-based magnet
09818513 · 2017-11-14 · ·

Provided is a combined type RFeB-based magnet, including: a first unit magnet; a second unit magnet; and an interface material that bonds the first unit magnet and the second unit magnet, in which the first unit magnet and the second unit magnet are RFeB-based magnets containing a light rare earth element R.sup.L that is at least one element selected from the group consisting of Nd and Pr, Fe, and B, in which the interface material contains at least one compound selected from the group consisting of a carbide, a hydroxide, and an oxide of the light rare earth element R.sup.L, and in which an amount of a heavy rare earth element R.sup.H that is at least one element selected from the group consisting of Dy, Tb and Ho in the second unit magnet is more than that in the first unit magnet.

RFeB-based magnet and method for producing RFeB-based magnet
09818513 · 2017-11-14 · ·

Provided is a combined type RFeB-based magnet, including: a first unit magnet; a second unit magnet; and an interface material that bonds the first unit magnet and the second unit magnet, in which the first unit magnet and the second unit magnet are RFeB-based magnets containing a light rare earth element R.sup.L that is at least one element selected from the group consisting of Nd and Pr, Fe, and B, in which the interface material contains at least one compound selected from the group consisting of a carbide, a hydroxide, and an oxide of the light rare earth element R.sup.L, and in which an amount of a heavy rare earth element R.sup.H that is at least one element selected from the group consisting of Dy, Tb and Ho in the second unit magnet is more than that in the first unit magnet.

Aluminium Composite Material with AlMgSi Core Layer

The invention relates to a strip consisting of an aluminum material for producing components with improved bending behavior and exacting shaping requirements, a method for producing the strip and the use of sheets produced from the strip according to the invention. The strip has a core layer of an AlMgSi alloy and at least one outer aluminum alloy layer arranged on one or both sides, made from a non-hardenable aluminum alloy, wherein the at least one outer aluminum layer has a lower tensile strength in the (T4) state than the AlMgSi layer, wherein the strip has a uniform strain (A.sub.g) in the (T4) state of more than 23% transverse to the rolling direction and, at a thickness of 1.5 mm-1.6 mm, achieves a bending angle of less than 40° in a bending test.

BONDING MATERIAL AND BONDING METHOD USING SAME

There is provided an inexpensive bonding material, which can be easily printed on articles to be bonded to each other and which can suppress the generation of voids in the bonded portions of the articles to be bonded to each other, and a bonding method using the same. In a bonding material of a copper paste which contains a copper powder containing 0.3% by weight or less of carbon and having an average particle diameter of 0.1 to 1 μm, and an alcohol solvent, such as a monoalcohol, a diol, a triol or a terpene alcohol, the content of the copper powder is in the range of from 80% by weight to 95% by weight, and the content of the alcohol solvent is in the range of from 5% by weight to 20% by weight.