Laser cleaning equipment and a cleaning method for a shaft component are provided. The equipment includes: a supporting base assembly; two driving wheel structures on the supporting base assembly, driving wheels of each of which is configured for being close to or away from each other, and the shaft component to be cleaned is placed between the two driving wheel structures; a friction wheel structure that is tangent to driving wheel structure(s) and uses a friction force thereof to drive driving wheel structure(s) to rotate; a connection shaft assembly that coaxially passes through the friction wheel structure; a power driving mechanism, one end of which that faces toward the connection shaft assembly is in drive connection with the connection shaft assembly and is configured to drive the connection shaft assembly to rotate; and a laser cleaning mechanism configured for performing laser cleaning on the shaft component to be cleaned.

A boring device includes: a rotatable body, which has a workpiece holder, a valve seat receiver and a debris passage portion; a laser emitter; a pump and a control unit. The workpiece holder can hold a nozzle body. The valve seat receiver contacts a valve seat of the nozzle body that is held by the workpiece holder. The laser emitter emits a laser beam to an outer wall of the nozzle body to bore injection holes at the nozzle body. The debris passage portion includes a debris passage that is placed on a radially inner side of the valve seat receiver and guides debris formed at the time of boring the injection holes with the laser beam. The pump vacuums the debris through the debris passage. The control unit controls a laser output power of the laser emitter and a suction force of the pump.

The present disclosure provides a substrate treating apparatus. The substrate treating apparatus includes a support unit that supports a substrate, and a laser unit that irradiates a laser beam to the substrate supported by the support unit, the laser unit includes an irradiation member that irradiates the laser beam, a lens disposed on a travel path of the laser beam irradiated by the irradiation member to be rotatable, and a reflection member having an inclined surface for changing the travel path of the laser beam that passed through the lens.

A method for large-scale, real-time simultaneous additive and subtractive manufacturing is described. The apparatus used in the method includes a build unit and a machining mechanism that are attached to a positioning mechanism, a rotating platform, and a rotary encoder attached to the rotating platform. The method involves rotating the build platform; determining the rotational speed; growing the object and the build wall through repetitive cycles of moving the build unit(s) over and substantially parallel to multiple build areas within the build platform to deposit a layer of powder at each build area, leveling the powder, and irradiating the powder to form a fused additive layer at each build area; machining the object being manufactured; and cutting and removing the build wall. The irradiation parameters are calibrated based on the determined rotational speed.

A wafer producing method for producing a hexagonal single crystal wafer from a hexagonal single crystal ingot includes a separation start point forming step of setting the focal point of a laser beam inside the ingot at a predetermined depth from the upper surface of the ingot, which depth corresponds to the thickness of the wafer to be produced, and next applying the laser beam to the upper surface of the ingot while relatively moving the focal point and the ingot to thereby form a modified layer parallel to the upper surface of the ingot and cracks extending from the modified layer, thus forming a separation start point. In the separation start point forming step, the laser beam is applied to the ingot plural times with the focal point of the laser beam set at the modified layer previously formed, thereby separating the cracks from the modified layer.

An apparatus for manufacturing an axi-symmetric part. The apparatus includes a vessel configured to contain the powder. The vessel is also configured to receive a part such that at least a portion of the part contacts the powder contained within the vessel. A first energy source is configured to generate a first beam of energy. The first beam of energy is configured to melt the powder at a first predetermined location such that the melted powder fuses to the part.

A wafer is produced from an ingot by confirming whether or not an inclined c-axis of the ingot and a second orientation flat of the ingot are perpendicular to each other, and detecting a processing feed direction perpendicular to the direction in which the c-axis is inclined. The method includes performing sampling irradiation of the ingot with a laser beam, along a direction parallel to the second orientation flat and a plurality of directions inclined clockwise and counterclockwise by respective predetermined angles from the second orientation flat, thereby forming a plurality of sampled reduced strength areas in the ingot; measuring the number of nodes which exist per unit length on each of the sampled reduced strength areas, and determining a direction in which the sampled reduced strength area where the measured number of nodes is zero extends as a processing feed direction.

A welding method for an outer joint member of a constant velocity universal joint includes constructing a cup section having track grooves, which engage with torque transmitting elements, formed along an inner periphery thereof and a shaft section that is formed on a bottom portion of the cup section by two or more separate members, joining a cup member forming the cup section and a shaft member forming the shaft section, and melt-welding end portions of the cup member and the shaft member. The cup member and the shaft member are shaped so that a sealed hollow cavity portion is formed when the end portions of the cup member and the shaft member are brought into abutment against each other, the melt-welding of the end portions being performed when the sealed hollow cavity portion is under atmospheric pressure or lower.

In a device for separating a longitudinally-extended cylindrical workpiece, which has a diameter in the sub-millimeter range, into individual segments, the workpiece is guided in a clamping device. The clamping device includes a first and a second clamping jaw and a feed opening for the workpiece. The feed opening is fitted between the clamping jaws on the side facing the other clamping jaw and a longitudinal groove which defines a direction of advancement of the workpiece for receiving and guiding the workpiece between the clamping jaws. The clamping device has a passage for a laser beam and a cutting gas, which passage defines a working zone, disrupts the longitudinal groove and runs parallel thereto. A cutter head is arranged in the working zone and has an outlet opening for the laser beam and the cutting gas, which outlet opening is aligned with the passage.

A workpiece having a first plate-shaped part and a second plate-shaped part connected to the first plate-shaped part in a direction to cross the first plate-shaped part is cut with a laser beam. A cutting line across the first plate-shaped part and the second plate-shaped part is set. In the second plate-shaped part, a notch portion that opens to a tip end portion of the second plate-shaped part and is along the cutting line is formed by cutting with the laser beam so that a cutout piece that is cut out by forming the notch portion is divided into a tip end portion and a base portion. The first plate-shaped part is cut along the cutting line by irradiation with the laser beam from one direction.