B23K26/0869

RAIL APPARATUS, LASER APPARATUS, AND LASER MACHINING DEVICE

A rail apparatus, a laser apparatus, and a laser machining device are provided in the present disclosure. The rail apparatus includes a rail frame assembly and a mounting assembly. The rail frame assembly includes a rail frame and a guide shaft fixed to the rail frame. The mounting assembly includes a mounting base and a pulley. The pulley defines a sliding groove. The sliding groove is slidably connected with the guide shaft. The laser apparatus includes a base, a laser, and a focusing member. The laser is disposed on the base and is configured to emit a laser light. The focusing member is movably disposed on the base and has a focusing end. The laser apparatus is operable in a retracting state and an extending state. The laser machining device includes the rail apparatus and the laser apparatus.

LASER PROCESSING DEVICE, CONTROL METHOD, STORAGE MEDIUM, AND PRODUCT MANUFACTURING METHOD
20230226641 · 2023-07-20 ·

A laser processing device includes an optical scanning unit that scans laser light; a condenser lens that condenses the laser light onto a workpiece; a plasma light sensor that detects plasma light from the workpiece; and a control unit configured to generate processing position data for the laser light for processing the workpiece, wherein the control unit causes the optical scanning unit to scan the laser light and causes the plasma light sensor to acquire a detection result of detecting the plasma light from the workpiece, and the control unit generates the processing position data for the laser light for processing the workpiece on the basis of the detection result.

Surface topography control

Various aspects of the present disclosure are directed toward utilizing pulsed laser light to melt and displace material along a surface. As may be consistent with one or more embodiments, material at respective regions of a surface is melted and displaced using pulsed laser light. The melting and displacement at different ones of the regions is carried out to facilitate different displacement at each region. Such an approach may be used by varying characteristics, such as fluence, of the pulsed laser light at each region. In this contexts, surfaces can be smoothed, and structures can be formed on the surface.

LASER CUTTING METHOD
20230219174 · 2023-07-13 ·

In a method for laser fusion cutting in particular a plate-shaped workpiece, preferably with a thickness D of at least 1 mm, a laser beam and a cutting gas, in particular nitrogen, at a cutting gas pressure are directed at the workpiece surface by a convergent cutting nozzle. The laser power is at least 6 kW and the cutting nozzle has a nozzle end face on the workpiece side. A distance A between the nozzle end face and the workpiece surface during the cutting operation is 2 to 8 mm. The cutting nozzle has a nozzle channel with a diameter d.sub.D at the nozzle end face on the workpiece side of 1.5 to 4 mm. The cutting gas pressure before emergence from the cutting nozzle is 15 to 30 bar. This makes it possible to achieve high productivity along with a reduced risk of collision, i.e. higher process reliability.

LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS

A laser processing method of laser processing a workpiece made of at least one sheet of metallic foil includes: generating laser light by supplying pulsed pumping energy to a laser medium, the laser light including an optical pulse component and a continuous light component that is continuous with the optical pulse component and temporally after the optical pulse component; irradiating a surface of the workpiece with the laser light; and limiting duration of the continuous light component such that a ratio of energy of the continuous light component to energy of the optical pulse component is equal to or less than a predetermined value.

LASER AUTOMATIC FOCUSING EQUIPMENT FOR LASER ENGRAVING MACHINE
20230009595 · 2023-01-12 ·

A laser automatic focusing equipment for a laser engraving machine is provided. It includes a lifting mechanism, a laser assembly disposed at a lower end of a side of the lifting mechanism, and a lifting motor fixedly disposed on an upper end of the side of the lifting mechanism and is in transmission connection with the lifting mechanism. The laser assembly includes a heat sink, a laser disposed in the heat sink, a distance sensor disposed in the heat sink and on a side of the laser, and a contact device disposed in the heat sink and at a bottom of the laser. The whole focusing process is controlled by a program without human intervention, with high accuracy, no manual operation and no laser irradiation risk. It is suitable for focusing of engraving materials with different hardness and different materials by adding the contact device.

Machining device, machining unit, and machining method

Provided are a machining device (10), a machining unit, and a machining method that irradiate a workpiece (8) with a laser beam to perform cutting or boring machining of the workpiece (8). The invention has a laser output device (12), a guiding optical system (14) that guides a laser beam, and an irradiating head (16) that guides a laser beam and irradiates the workpiece (8) with the laser beam. The irradiating head (16) integrally rotates a first prism (52) and a second prism (54) with a rotation mechanism, thereby rotating a light path of the laser beam around a rotational axis of the rotation mechanism and irradiating the workpiece (8) while rotating the position of irradiation to the workpiece. A control device (22) calculates an allowable rotational frequency range of the laser beam on the basis of the relationship between an allowable thickness of a remelted layer of the workpiece (8) and a rotational frequency, or the relationship between an allowable thickness of an oxidization layer of the workpiece and the rotational frequency, determines a rotational frequency included in the allowable rotational frequency range as the rotational frequency of the rotation mechanism, and rotates the rotation mechanism at the determined rotational frequency, thereby enabling high-precision machining to be performed with a simple configuration.

Laser cutting method for plated steel sheet, laser processing head and laser processing device
11691225 · 2023-07-04 · ·

Laser cutting on a plated steel sheet is executed by cutting the plated steel sheet by irradiating the plated steel sheet covered with a plate metal with laser light at a wavelength in a 1 micrometer band; and emitting assist gas onto a cut surface of the plated steel sheet, the cut surface being formed in the step of cutting, to make the plate metal fused by irradiation of the laser light flow to the cut surface so as to cover the cut surface with the plate metal.

Liquid enhanced laser stripping

A method for stripping ceramic from a component includes applying a liquid to a ceramic coating of an outer surface of the component. The method also includes directing a plurality of laser pulses at the ceramic coating with the applied liquid in order to spall the ceramic coating from the component.

Method for the Thermal Processing of a Workpiece with a Thermal Processing Machine
20230001502 · 2023-01-05 ·

A method for thermal processing of a workpiece uses a thermal processing machine. The method includes the following steps carried out in an automated manner: setting up the processing machine by producing contact between the processing tool and the workpiece and recording the spatial position of a workpiece surface, positioning the processing tool at a predetermined first and second distance from the workpiece surface and recording the associated signal values of the distance sensor as first and second measured values, and calibrating the distance controller which includes determining a height derivative of the distance sensor signal and an amplification factor for the signal of the distance sensor taking in account the first measured value, the second measured value, the first distance and the second distance; positioning the processing tool at a predetermined working distance from the workpiece surface with the inclusion of the amplification factor; and thermally processing the workpiece.