A machine for separative machining of a plate-shaped workpiece that has: a first movement unit for moving the workpiece in a first direction (X); a second movement unit for moving a machining head for the separative machining in a second direction (Y); and two workpiece bearing faces for bearing the workpiece. A gap that extends along the second direction (Y) is formed between the workpiece bearing faces. The machine has a push-out unit having a push-out element, wherein the push-out element is movable at least in the second direction (Y) within the gap so as to press, at a predefined push-out position (AP), against a workpiece part that was cut free from the workpiece during separative machining. The disclosure further relates to methods for pushing out a workpiece part which, in particular, was cut free on such a machine.

A processing apparatus includes a delivery unit for delivering a workpiece between a cassette placed on a cassette rest and a chuck table and a measuring unit for measuring a thickness of the workpiece. The delivery unit includes a base having a non-contact-type suction holder for ejecting air to develop a negative pressure to attract and hold the workpiece under suction out of contact therewith, and a moving unit for moving the base. The height of the non-contact-type suction holder is adjusted according to the thickness of the workpiece measured by the measuring unit to place the non-contact-type suction holder in a position that is spaced from a face side of the workpiece by a distance in a predetermined range while the workpiece is being delivered by the delivery unit.

A processing apparatus processes an object by irradiating the object with a processing light, and includes: a combining optical system that combines an optical path of the processing light from the processing light source and an optical path of a first measurement light from a measurement light source; an irradiation optical system that irradiates the object with processing light and the first measurement light through the combining optical system; a position change apparatus that changes a position of the irradiation optical system relative to the object; an imaging apparatus a position of which is changed together with the irradiation optical system and which captures an image of the object; and a detection apparatus that detects, through the irradiation optical system and the combining optical system, a second measurement light generated from the object due to the first measurement light with which the object is irradiated through the irradiation optical system.

A peeling method at low cost with high mass productivity is provided. A silicon layer having a function of releasing hydrogen by irradiation with light is formed over a formation substrate, a first layer is formed using a photosensitive material over the silicon layer, an opening is formed in a portion of the first layer that overlaps with the silicon layer by a photolithography method and the first layer is heated to form a resin layer having an opening, a transistor including an oxide semiconductor in a channel formation region is formed over the resin layer, a conductive layer is formed to overlap with the opening of the resin layer and the silicon layer, the silicon layer is irradiated with light using a laser, and the transistor and the formation substrate are separated from each other.

Methods, devices, and systems for welding optical fibers and perforated elements by pulsed laser beam are provided. In one aspect, a method includes focusing a pulsed laser beam onto a region of a joining surface formed by an outer circumference of an optical fiber and an inner circumference of a hole of a perforated element, a beam direction of the pulsed laser beam running in an axial direction of the joining surface, and moving a laser focus of the pulsed laser beam in the region axially in or counter to the beam direction to produce at least one weld seam in the region. The optical fiber and the perforated element are locally melted in the region by the pulsed laser beam focused into a material of the optical fiber and a material of the perforated element and are thereby welded to one another.

Apparatus and methods of cleaning a sealing head (23) of a capsule filling line, comprising operating an ablation unit (10) to irradiate the sealing head (23) to ablate a residue off the sealing head (23).

A laser cutting head includes a controllable collimator with movable collimator lenses for controlling beam diameter and/or focal point location. The laser cutting head may be used in a laser cutting system with a control system for controlling the position of the movable collimator lenses. The lenses may be moved, for example, to adjust the beam spot size for cutting different types of material or material thicknesses. The lenses may also be moved to adjust a focal point back to the workpiece after changing the distance of the laser cutting head relative to the workpiece.

A laser processing machine including: a laser source that emits a laser beam; a polarization rotator unit; a beam rotator unit; a lens; and a controller, which apply the laser beam to a workpiece, the polarization rotator unit includes a wave plate and first actuator that rotates the wave plate, the beam rotator unit includes an optical system that adjusts an irradiation angle of the laser beam to the workpiece by making an incident laser beam eccentric to output and making the laser beam incident on the lens at a position eccentric from a central axis, a second actuator rotates the optical system, the lens condenses the laser beam on the workpiece, the controller controls a rotational speed ratio between the first actuator and the second actuator, and adjusts a polarized state of the laser beam by controlling the rotational speed ratio.

A laser processing apparatus emits a laser light with a part of a focusing region being on an object to form a modified region along a virtual plane inside the object. The laser processing apparatus includes a support portion, an emission portion that emits the laser light onto the object, a moving mechanism that moves at least one of the support portion and the emission portion so that the part of the focusing region moves along the virtual plane inside the object, and a controller. The emission portion includes a shaping portion that shapes the laser light such that the shape of the part of the focusing region in a plane perpendicular to an optical axis of the laser light has a longitudinal direction. The longitudinal direction is a direction intersecting the direction of movement of the part of the focusing region.

A method of joining a razor blade to a blade support to form a razor blade assembly, the method including: directing a laser beam having an adjustable power output at an upper surface of the razor blade; and while advancing the laser beam along the razor blade: a) applying the laser beam at a first power output to the razor blade; b) reducing the first power output of the laser beam to a second power output; and c) applying the laser beam at the second power output to the razor to form a weld area joining the razor blade to the blade support. The weld area may be elongated and may include (i) a ratio of depth:width that is greater than about 2:1, and/or (ii) a ratio of length:width that is greater than about 5:1.