The invention relates to laser equipment, specifically pulsed scanning lasers used to cut brittle substrates. The authors propose a method and device for forming a stressed edge in the substrate for cleaving of the substrate, to which end a track of cavities is formed through optically induced breakdown in the body of tire material during its irradiation with a focused laser beam with a fixed focal distance during the course of angled scanning of the laser beam, with longitudinal movement along the length of the substrate. The technical result is: improved strength parameters of products and better quality of straight and oblique edges formed during substrate cleaving, absence of chips and microcracks, high rate of formation of the stressed cleaving edge, which implies faster laser cutting.

A processing method of a wafer in which a modified layer is formed inside the wafer. In the processing method, irradiation with a first laser beam is executed from a back surface side of the wafer and the modified layer is formed inside the wafer. Then, irradiation with a second laser beam is executed with the focal point thereof positioned to the inside or the front surface of the wafer and reflected light is imaged by an imaging unit. Furthermore, a processing state of the wafer is determined on the basis of a taken image. The second laser beam is shaped in such a manner that a sectional shape thereof in a surface perpendicular to a traveling direction thereof becomes asymmetric across the modified layer.

A method for laser cutting a workpiece includes the steps of guiding a laser beam over the workpiece in a cutting direction so as to produce a cutting kerf with two cutting flanks and melting material on the workpiece at a cutting front that extends between the cutting flanks and adjoins at least one of the cutting flanks at an angle. The laser beam has a non-circular cross section and, at a front of the laser beam in the cutting direction, a continuous cutting beam contour corresponding to the cutting front.

A laser processing apparatus includes: a chuck table for holding a single-crystal SiC ingot on a holding surface thereof; a laser beam applying unit for applying a laser beam to the single-crystal SiC ingot held on the holding surface of the chuck table; and a camera unit configured to capture an image of the single-crystal SiC ingot held on the holding surface of the chuck table. The chuck table includes a porous material making up the holding surface and a glass frame made of a non-porous material and having a recess defined therein and receiving the porous material fitted therein, and a negative pressure transfer path for transferring a negative pressure to the porous material fitted in the recess.

An optical module includes an optical semiconductor chip having a first surface that includes a laser beam irradiation region and a cleavage region, an optical fiber optically coupled to the first surface, and a support member having a second surface bonded to the first surface, and configured to support the optical fiber. The optical semiconductor chip has an optical signal input and output part located in the cleavage region, and the second surface is bonded to the first surface within the cleavage region.

Selective laser solidification apparatus is described that includes a powder bed onto which a powder layer can be deposited and a gas flow unit for passing a flow of gas over the powder bed along a predefined gas flow direction. A laser scanning unit is provided for scanning a laser beam over the powder layer to selectively solidify at least part of the powder layer to form a required pattern. The required pattern is formed from a plurality of stripes or stripe segments that are formed by advancing the laser beam along the stripe or stripe segment in a stripe formation direction. The stripe formation direction is arranged so that it always at least partially opposes the predefined gas flow direction. A corresponding method is also described.

The present disclosure various apparatuses, and systems for 3D printing. The present disclosure provides three-dimensional (3D) printing methods, apparatuses, software and systems for a step and repeat energy irradiation process; controlling material characteristics and/or deformation of the 3D object; reducing deformation in a printed 3D object; and planarizing a material bed.

A laser crystallization device includes: a first solid-state laser generator which generates a first solid-state laser having a first energy intensity; a second solid-state laser generator which generates a second solid-state laser having a second energy intensity lower than the first energy intensity; and a third solid-state laser generator which generates a third solid-state laser having a third energy intensity lower than the first energy intensity.

A method and system for laser metal powder deposition using beam wobbling. The system may include a fiber laser configured to generate a laser beam and a laser head, the laser head configured to receive the laser beam from the fiber laser and including a collimator configured to collimate the laser beam, a wobbler module having first and second movable mirrors, and a focus lens configured to focus the collimated laser beam through a powder nozzle device such that a focal point location of the focused collimated laser beam is positioned below a workpiece surface. The powder nozzle device delivers metal powder to a region on the workpiece surface that is heated by the focused collimated laser beam.

Disclosed is an automatic welding apparatus using an inside steel tube, which includes a connecting seat and a fixing bracket. The fixing bracket is fixedly connected to a rear side of the connecting seat. a roller assembly is provided at one end of the fixing bracket, and a left side and a right side of the connecting seat are respectively fixedly connected with two first mounting brackets, between which a connecting shaft is rotatably connected. The connecting shaft is rotatably connected with a driving wheel, a signal transmission component is arranged on a periphery of the driving wheel, a laser welder is provided on an upper surface of the connecting seat, a laser welding head is provided at one end of the laser welder; and the laser welder is configured to start the laser welding head according to a signal transmitted by the signal transmission component.