A manufacturing method for a joint body having a first metal member and a second metal member joined together by causing a laser oscillation system to irradiate a surface of the second metal member placed on the first metal member with laser light to form a joint portion including a welded portion where the first metal member and the second metal member are joined together includes continuously supplying the second metal member while pressing the second metal member against the first metal member, the second metal member being a hoop material, and causing the laser oscillation system to emit the laser light.

A laser processing apparatus includes a chuck table that holds an SiC ingot on a holding surface, a laser beam irradiation unit that positions the focal point of a laser beam to a depth equivalent to the thickness of a wafer to be produced from a first surface and that irradiates the SiC ingot with the laser beam to form a separation layer arising from separation of SiC into Si and C and extension of cracks along a c-plane. A movement unit relatively moves the chuck table and the laser beam irradiation unit, and a separation layer inspecting unit executes irradiation with inspection light with such a wavelength as to have transmissibility with respect to the SiC ingot and be reflected by the separation layer, and inspects the separation layer from the intensity of reflected light. The holding surface has a color that absorbs the inspection light.

A computer-numerically-controlled (CNC) machine is configured to (i) measure a power of a beam of electromagnetic energy at a location between a source of the electromagnetic energy and a destination in the CNC machine, the beam of electromagnetic energy traveling from the source to the destination being susceptible to one or more interferences, and the one or more interferences being capable of altering the power of the beam of electromagnetic energy by at least diverting, away from an intended path for the beam of electromagnetic energy, at least a portion of the beam of electromagnetic energy, (ii) detect, based at least on the measured power of the beam of electromagnetic energy being less than a threshold value, an interference of the beam of electromagnetic energy, and (iii) in response to detecting the interference of the beam of electromagnetic energy, perform one or more actions.

The present invention relates to a method for manufacturing a domestic appliance at least comprising the following steps:—at least one positioning and/or prefixing step comprising positioning and/or prefixing of at least a first component part (3) of the domestic appliance relative to at least a second component part (2) of the domestic appliance, the first component part (3) comprising a first contour (32), and the second component (2) part comprising a matching second contour (21), respectively, the positioning and/or prefixing comprising positioning and/or prefixing the second contour (21) in a pre-defined arrangement at the first contour (32);—at least one welding step comprising welding together the first and second component parts (3, 2) along at least one of the first and second contour (32, 21); wherein the welding being controlled by a control device and carried out by:—detecting, in particular via a detection device, at least one of a location and course of at least a section of a marking representative for only one of the first and second contour; and—generating a welded seam to join the first and second component along the first and second contour based on the detected location and/or course of the marking.

A processing apparatus is a processing apparatus that processes an object by a processing light from a processing light source, includes a first optical system that condenses the processing light from the processing light source on a condensed plane; and a second optical system that condenses the processing light from the first optical system to irradiate the object with it, a position in the condensed plane through which the processing light passes is changeable, a propagating direction of the processing light propagating from the first optical system to the second optical system changes depending on the position in the condensed plane through which the processing light passes.

A processing system is a processing system that is configured to process an object by irradiating the object with an energy beam, and includes: a placing apparatus on which the object is placed; an irradiation apparatus that is configured to irradiate the object with the energy beam; and a light reception apparatus that includes: a beam passing member having an attenuation area in which the energy beam is attenuated and a plurality of passing areas through each of which the energy beam is allowed to pass; and a light reception part that is configured to optically receive the energy beam that has passed through the plurality of passing areas.

In various embodiments, workpieces are processed, e.g., via welding or cutting, while the shape and/or one or more other parameters of the laser processing beam are altered. The shape and/or one or more other parameters of the laser processing beam may be varied based on one or more characteristics of the workpiece.

A protective film applying apparatus includes a protective film forming and cleaning unit for forming a protective film on a surface of a wafer and cleaning the protective film away. A coverage state detector detects a coverage state of the protective film, and a controller determines whether or not the protective film has a film thickness falling within a predetermined range. If the controller decides that the thickness of the protective film does not fall in the predetermined range, the controller operates the protective film forming and cleaning unit to clean away the protective film, performs a pretreating process selected depending on the film thickness on the surface, and operates the protective film forming and cleaning unit to form a protective film again on the surface of the wafer.

Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a body including an irradiation end, from which laser light is irradiated, a shaft coupled to the body, and a driver that supplies power to the shaft, the heating unit is swung about an axis of the shaft, and the controller moves the irradiation end of the heating unit to a target location on a substrate by adjusting a rotation angle of the heating unit and a rotation angle of the support unit.

An apparatus for laser materials processing including a laser (4) for generating a laser beam and a laser head (5) which is movable along at least one spatial direction and is connected to the laser via a light guide, and which emits a laser beam (7) capable of processing a material. The present invention also relates to an apparatus for selective laser melting or selective laser sintering having an apparatus for laser materials processing.