Patent classifications
B23K26/0869
Method and device for etching patterns inside objects
Systems and methods for etching complex patterns on an interior surface of a hollow object are disclosed. A method generally includes positioning a laser system within the hollow object with a focal point of the laser focused on the interior surface, and operating the laser system to form the complex pattern on the interior surface. Motion of the laser system and the hollow object is controlled by a motion control system configured to provide rotation and/or translation about a longitudinal axis of one or both of the hollow object and the laser system based on the complex pattern, and change a positional relationship between a reflector and a focusing lens of the laser system to accommodate a change in distance between the reflector and the interior surface of the hollow object.
LIQUID ENHANCED LASER STRIPPING
A method for stripping ceramic from a component includes applying a liquid to a ceramic coating of an outer surface of the component. The method also includes directing a plurality of laser pulses at the ceramic coating with the applied liquid in order to spall the ceramic coating from the component.
Method for producing an axle housing of a vehicle axle, and axle housing of a vehicle axle
The invention relates to a method for producing an axle housing of a vehicle axle, by means of integrally connecting an axle tube (1) to an axle shaft (2) which is positioned on the longitudinal axis (L) of the axle tube, is equipped with bearing surfaces (3) for mounting a vehicle wheel, and has a tube cross-section facing said axle tube (1) which is substantially the same as the tube cross-section of the axle tube. In order to develop a welding method for the production of an axle housing that consists of an axle tube and an axle shaft secured thereto, which method is optimised in terms of the dynamic loads to which the axle housing is typically subjected in a driving operation, the method comprises the following steps: •—arranging the axle tube (1) and the axle shaft (2), with the abutting surfaces of their tube cross-sections positioned coaxially to one another, in a workpiece receiving portion of a welding installation (10), said welding installation additionally comprising an arc welding device (11) and a laser welding device (12) which is operated in parallel, •—continuously miming a weld seam (20) in the peripheral direction of the tube cross-sections, both welding devices (11, 12) being directed, actively and from the outside, onto substantially the same peripheral section of the abutting surfaces, wherein the laser beam (S) meets the outside (14) of the tube at right angles, and intersects the longitudinal axis (L) of the axle tube (1), and •—stopping running the weld seam (20) once this has passed over a peripheral angle of at least 360°. A corresponding axle housing is also disclosed.
Super charger components
A pulley assembly having a body, a shaft mount and a plurality of bolts is disclosed. The body is aligned to the shaft mount by providing a tight tolerance between a shoulder portion of the bolt and a neck portion of a counter sunk hole formed in the body. Additionally, an outer surface of the body may have a pattern of friction lines or patches formed by fusing particulate matter to the outer surface with heat generated by a laser beam.
LAYERED MANUFACTURING OF SINGLE CRYSTAL ALLOY COMPONENTS
A method of making a component includes: depositing a metallic powder on a workplane; directing a beam from a directed energy source to fuse the powder in a pattern corresponding to a cross-sectional layer of the component; repeating in a cycle the steps of depositing and fusing to build up the component in a layer-by layer fashion; and during the cycle of depositing and melting, using an external heat control apparatus separate from the directed energy source to maintain a predetermined temperature profile of the component, such that the resulting component has a directionally-solidified or single-crystal microstructure.
WAFER MANUFACTURING METHOD AND GRINDING APPARATUS
In both a case where a workpiece is a regular workpiece having a first residual peeling layer on one surface thereof and a case where the workpiece is an adjustment workpiece not having the first residual peeling layer, a wafer having a predetermined thickness is manufactured by grinding opposite surfaces of the workpiece. That is, in the present invention, because the opposite surfaces of the workpiece are ground, wafers can be manufactured from two kinds of workpieces irrespective of whether or not the first residual peeling layer is present on the one surface of the workpiece. Hence, even when two kinds of workpieces are housed in a mixed manner in a first cassette, wafers having the predetermined thickness can be manufactured easily from these workpieces.
Laser cutting method
A laser cutting method and a laser cutting apparatus cut a metallic work with a laser beam of a one-micrometer waveband. The method and apparatus carry out the laser cutting of the work with a ring beam RB passed through a focus position of a condenser lens 13 and having inner and outer diameters that tend to expand. The outer diameter of the ring beam is in a range of 300 μm (micrometers) to 600 μm, an inner diameter ratio of the same is in a range of 30 % to 70 %, and a focal depth of the condenser lens is in a range of 2 mm to 5 mm.
LASER MARKING HEAD AND LASER MARKING MACHINE
A laser marking head and a laser marking machine are disclosed. The laser marking head includes: a laser generator, the laser generator being configured to emit laser; a first guide rail; a first sliding device, the first sliding device being sleeved on and being capable of sliding on the first guide rail; a first reflector, the first reflector being positioned on the first sliding device; a second guide rail, the second guide rail being fixed on the first sliding device and being perpendicular to the first guide rail; a second sliding device, the second sliding device being sleeved on and being capable of sliding on the second guide rail; and a second reflector, the second reflector being positioned on the second sliding device.
METHOD FOR OPERATING AND CONTROLLING A LASER DEVICE FOR ENGRAVING, MARKING, LETTERING AND/OR CUTTING A PREFERABLY FLAT WORKPIECE
The present disclosure relates to a method for creating a job from a central operator software for various laser types, in particular a laser plotter or a galvo marking laser, for engraving, marking, lettering and/or cutting a preferably flat workpiece, in which at least one beam source in the form of a laser is used in a housing of the laser device for processing the workpiece. The workpiece is deposited in a defined manner in a processing chamber on a processing table and a laser beam emitted by the beam source is sent via deflecting elements to at least one focusing unit, by which the laser beam is deflected in the direction of the workpiece and positioned accordingly. The control is effected via control software running in a control unit, in which software a so-called job is processed.
METHOD FOR OPERATING AND CONTROLLING A LASER DEVICE FOR ENGRAVING, MARKING, LETTERING AND/OR CUTTING A PREFERABLY FLAT WORKPIECE
The present disclosure relates to a method for operating and controlling a laser device for engraving, marking, lettering and/or cutting a flat workpiece, in which at least one beam source in the form of a laser is used in a housing of the laser device. The workpiece is deposited in a defined manner on a processing table in the processing chamber of the housing and a laser beam emitted by the beam source is sent via deflecting elements to at least one focusing unit, from which the laser beam is deflected in the direction of the workpiece and focused for processing. Control is effected by means of control software which runs in a control unit and in which a so-called job is processed, so that the workpiece is processed line by line by adjustment of a movement system.