A skid state determination device is a skid state determination device for determining a state of a plurality of skids for supporting a workpiece to be processed by a laser processing machine, with a supporting surface formed by top points of a plurality of protrusions, and includes: imaging means configured to be able to image at least a part of a skid table provided with the plurality of skids; and state determination means configured to determine the state of the skids based on image information obtained by imaging the skid table with the imaging means, and the state determination means executes: first determination processing for determining the state of the skids based on the image information obtained by imaging the skid table with the imaging means, before the workpiece is carried onto the skid table; and second determination processing for determining the state of the skids based on the image information obtained by imaging the skid table with the imaging means, after the workpiece is carried out from the laser processing machine but before a product obtained by processing the workpiece is carried out from the skid table.

A skid state determination device is a skid state determination device for determining a state of a plurality of skids for supporting a workpiece to be processed by a laser processing machine, with a supporting surface formed by top points of a plurality of protrusions, and includes: imaging means configured to be able to image at least a part of a skid table provided with the plurality of skids; and state determination means configured to determine the state of the skids based on image information obtained by imaging the skid table with the imaging means, and the state determination means executes: first determination processing for determining the state of the skids based on the image information obtained by imaging the skid table with the imaging means, before the workpiece is carried onto the skid table; and second determination processing for determining the state of the skids based on the image information obtained by imaging the skid table with the imaging means, after the workpiece is carried out from the laser processing machine but before a product obtained by processing the workpiece is carried out from the skid table.

A device (1) for applying light (4) to an inner surface (2) of a cylinder (3), comprising a homogenizer (14), into which light (4) can enter and from which the light (4) can exit, wherein the homogenizer (14) has a cylindrical internal surface (15), on which the light (4) can be reflected after entering and before exiting, and also comprising ways for introducing light (4) into the homogenizing means (14), and focusing arrangements, which can focus light (4) exiting from the homogenizer (14) onto the inner surface (2) of the cylinder (3) to which light (4) is to be applied.

A high power laser drilling system utilizing an electric motor laser bottom hole assembly. A high power laser beam travels within the electric motor for performing a laser operation. A system includes a down hole electrical motor having a hollow rotor for conveying a high power laser beam having a wavelength less than 1060 nm through the electrical motor.

A high power laser drilling system utilizing an electric motor laser bottom hole assembly. A high power laser beam travels within the electric motor for performing a laser operation. A system includes a down hole electrical motor having a hollow rotor for conveying a high power laser beam having a wavelength less than 1060 nm through the electrical motor.

Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.

Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.

A method of laser welding a workpiece stack-up includes directing a laser beam at a top surface of a first metal workpiece to form a key-hole that entirely penetrates the workpiece stack-up, including an underlying second metal workpiece, so that the keyhole reaches a bottom surface of the second metal workpiece. A zone of negative pressure established under the bottom surface of the second metal workpiece extracts vapors that are produced by the laser beam. The vapors, in particular, are extracted from the bottom surface of the second metal workpiece through the keyhole. A bottom workpiece holder that supports the bottom metal workpiece during laser welding may be constructed to establish the zone of negative pressure.

A method of laser welding a workpiece stack-up includes directing a laser beam at a top surface of a first metal workpiece to form a key-hole that entirely penetrates the workpiece stack-up, including an underlying second metal workpiece, so that the keyhole reaches a bottom surface of the second metal workpiece. A zone of negative pressure established under the bottom surface of the second metal workpiece extracts vapors that are produced by the laser beam. The vapors, in particular, are extracted from the bottom surface of the second metal workpiece through the keyhole. A bottom workpiece holder that supports the bottom metal workpiece during laser welding may be constructed to establish the zone of negative pressure.

A laser welding machine includes: an elevator that is capable of sliding an elevating platform; a pressing actuator that is fixed to the elevating platform at a base part of the pressing actuator and has a tip slidably connected to the base part and pressing a conductive upper terminal toward a conductive lower terminal; a laser oscillator; a machining optical device that is fixed to the elevating platform and has a lens to focus the laser light emitted from the laser oscillator; a position detector that detects a vertical positioning of the pressing actuator; a counter that receives an output of the position detector and delivers position information; and a control circuit that controls, based on the received signal from the counter, the elevator, the pressing actuator, and the machining optical device, and controls operation of the laser oscillator.