A laser processing system includes a laser oscillator that forms a fusion zone in a workpiece by irradiating a fusion-scheduled region of a processing target surface of the workpiece with a laser beam, a photometer that measures intensity of light from the fusion zone of the workpiece, and a jig disposed on the processing target surface of the workpiece not to overlap the fusion-scheduled region in order to press the workpiece. The jig has a reflection surface inclined in a manner that the reflection surface is further away from the fusion-scheduled region as the reflection surface is further away from the processing target surface in a normal direction of the processing target surface of the workpiece.

The present invention relates to apparatuses and methods for laser treatment, more particularly laser roughening, of surfaces.

An NC device 20 determines, in a case where a size of an opening forming region in a predetermined direction is smaller than a predetermined maximum value, that the opening forming region is a first opening forming region, and determines, in a case where the size of the opening forming region in the predetermined direction is larger than a predetermined minimum value, that the opening forming region is an opening forming region where a scrap interfering with a laser head 16 is formed. In a case where the size of the opening forming region in the predetermined direction is smaller than the predetermined maximum value and larger than the predetermined minimum value, the device determines that the opening forming region in an interference width added region obtaining by adding a predetermined interference width to the opening forming region is a second opening forming region, and processes the second opening forming region prior to processing of the first opening forming region.

An NC device 20 determines, in a case where a size of an opening forming region in a predetermined direction is smaller than a predetermined maximum value, that the opening forming region is a first opening forming region, and determines, in a case where the size of the opening forming region in the predetermined direction is larger than a predetermined minimum value, that the opening forming region is an opening forming region where a scrap interfering with a laser head 16 is formed. In a case where the size of the opening forming region in the predetermined direction is smaller than the predetermined maximum value and larger than the predetermined minimum value, the device determines that the opening forming region in an interference width added region obtaining by adding a predetermined interference width to the opening forming region is a second opening forming region, and processes the second opening forming region prior to processing of the first opening forming region.

A system and method for laser cutting a plurality of parts, for example metal chassis components, using a plurality of laser cutting apparatuses is provided. The system includes a plurality of the laser cutting apparatuses disposed in a single enclosed cell for simultaneously trimming multiple parts. The system also includes at least one inner chamber and at least one set of double doors for transferring the parts in and out of the enclosed cell without any light escaping the cell. The parts are conveyed through the first door to the inner chamber while the second door is closed, and through the second door to the enclosed cell while the first door is closed. The system also includes robots continuously preloading and unloading the parts to maximize the laser trimming time.

A system and method for laser cutting a plurality of parts, for example metal chassis components, using a plurality of laser cutting apparatuses is provided. The system includes a plurality of the laser cutting apparatuses disposed in a single enclosed cell for simultaneously trimming multiple parts. The system also includes at least one inner chamber and at least one set of double doors for transferring the parts in and out of the enclosed cell without any light escaping the cell. The parts are conveyed through the first door to the inner chamber while the second door is closed, and through the second door to the enclosed cell while the first door is closed. The system also includes robots continuously preloading and unloading the parts to maximize the laser trimming time.

An additive manufacturing system includes one or more processors configured to determine one or more geometrical characteristics of each of multiple segments of a build part at a candidate position of the build part relative to an additive manufacturing instrument. The one or more geometrical characteristics include an angle of incidence between a beam line extending from an electromagnetic energy source of the additive manufacturing instrument and a surface normal of a respective skin of the corresponding segment proximate to the beam line. The one or more processors are configured to determine, based on one or more geometrical characteristics of the segments at the candidate position, one or more locations of support material to be formed adjacent the build part during a build process of the build part.

An additive manufacturing system includes one or more processors configured to determine one or more geometrical characteristics of each of multiple segments of a build part at a candidate position of the build part relative to an additive manufacturing instrument. The one or more geometrical characteristics include an angle of incidence between a beam line extending from an electromagnetic energy source of the additive manufacturing instrument and a surface normal of a respective skin of the corresponding segment proximate to the beam line. The one or more processors are configured to determine, based on one or more geometrical characteristics of the segments at the candidate position, one or more locations of support material to be formed adjacent the build part during a build process of the build part.

A laser processing apparatus includes: a support portion configured to move along a first direction; a first moving portion configured to move along a second direction orthogonal to the first direction; a first attachment portion configured to move along a third direction orthogonal to the first direction and the second direction; a first laser processing head attached to the first attachment portion; a light source unit; and a first mirror attached to the first moving portion. The first laser processing head includes a first entrance portion and a first condensing portion. The light source unit includes a first emission portion. The first mirror is attached to the first moving portion to face the first emission portion in the second direction and face the first entrance portion in the third direction.

A laser processing apparatus includes: a support portion configured to move along a first direction; a first moving portion configured to move along a second direction orthogonal to the first direction; a first attachment portion configured to move along a third direction orthogonal to the first direction and the second direction; a first laser processing head attached to the first attachment portion; a light source unit; and a first mirror attached to the first moving portion. The first laser processing head includes a first entrance portion and a first condensing portion. The light source unit includes a first emission portion. The first mirror is attached to the first moving portion to face the first emission portion in the second direction and face the first entrance portion in the third direction.