Systems and methods are provided for laser heating in a fluid environment (30). Such a system may include a laser generator (12) and a laser output sub (16) separate from one another via an optical fiber (18). The laser generator may generate a heating laser pulse over the optical fiber. The laser output sub may emit the heating laser pulse to heat a substrate (22) in the fluid environment (30). To enable the heating laser pulse to pass between the laser output sub (16) and the substrate (22), the laser output sub may dispense a laser-transmissive optical grease or a laser-transmissive magnetic fluid, or may generate a vacuum cavitation bubble in the fluid between the laser output sub (16) and the substrate (22).

Systems and methods are provided for laser heating in a fluid environment (30). Such a system may include a laser generator (12) and a laser output sub (16) separate from one another via an optical fiber (18). The laser generator may generate a heating laser pulse over the optical fiber. The laser output sub may emit the heating laser pulse to heat a substrate (22) in the fluid environment (30). To enable the heating laser pulse to pass between the laser output sub (16) and the substrate (22), the laser output sub may dispense a laser-transmissive optical grease or a laser-transmissive magnetic fluid, or may generate a vacuum cavitation bubble in the fluid between the laser output sub (16) and the substrate (22).

Provided are a micro-hole array capable of accurately holding optical fibers or the like and a method for manufacturing a micro-hole array by which micro-holes having high shape accuracy can be formed. A micro-hole array has thirty or more through holes 3 formed per cm.sup.2 in a glass plate 2 with a thickness of 0.5 mm to 5 mm, both inclusive, the through holes 3 each having a cylindrical portion 5 having a cylindricity of 5% or less of a hole diameter d.sub.1 of the through hole 3.

Provided are a micro-hole array capable of accurately holding optical fibers or the like and a method for manufacturing a micro-hole array by which micro-holes having high shape accuracy can be formed. A micro-hole array has thirty or more through holes 3 formed per cm.sup.2 in a glass plate 2 with a thickness of 0.5 mm to 5 mm, both inclusive, the through holes 3 each having a cylindrical portion 5 having a cylindricity of 5% or less of a hole diameter d.sub.1 of the through hole 3.

The present disclosure provides examples of a laser-based material processing system for liquid-assisted, ultrashort pulse (USP) laser micromachining An example material processing application includes drilling thru-holes or blind holes in a nearly transparent glass workpiece (substrate) using parallel processing with an n×m array of focused laser beams. Methods and systems are disclosed herein which provide for formation of high aspect ratio holes with low taper in fine pitch arrangements.

The present invention provides a single-beam double-physical-effect coordinating and distributing method applicable to uniform laser shock and application thereof, and belongs to the technical field of laser shock effect control. The present invention does not stipulate the specific adjusting and distributing mean, and only provides a coordinating principle and method. The present invention gives a universal and systematic method for setting absorption layer feature parameters applicable to mass laser shock uniform peening under a liquid constraint condition, so as to facilitate the relevant technician to quickly obtain the liquid constraint laser shock processing technology conforming to a distribution proportion of its double physical effects, thereby being beneficial to development and application of the laser shock peening treatment, and therefore having the good actual application value.

The present invention provides a single-beam double-physical-effect coordinating and distributing method applicable to uniform laser shock and application thereof, and belongs to the technical field of laser shock effect control. The present invention does not stipulate the specific adjusting and distributing mean, and only provides a coordinating principle and method. The present invention gives a universal and systematic method for setting absorption layer feature parameters applicable to mass laser shock uniform peening under a liquid constraint condition, so as to facilitate the relevant technician to quickly obtain the liquid constraint laser shock processing technology conforming to a distribution proportion of its double physical effects, thereby being beneficial to development and application of the laser shock peening treatment, and therefore having the good actual application value.

A process for growing a substrate (24) as a melt pool (28) solidifies beneath a molten slag layer (30). An energy beam (36) is used to melt a powder (32) or a hollow feed wire (42) with a powdered alloy core (44) under the slag layer. The slag layer is at least partially transparent (37) to the energy beam, and it may be partially optically absorbent or translucent to the energy beam to absorb enough energy to remain molten. As with a conventional ESW process, the slag layer insulates the molten material and shields it from reaction with air. A composition of the powder may be changed across a solidification axis (A) of the resulting component (60) to provide a functionally graded directionally solidified product.

A process for growing a substrate (24) as a melt pool (28) solidifies beneath a molten slag layer (30). An energy beam (36) is used to melt a powder (32) or a hollow feed wire (42) with a powdered alloy core (44) under the slag layer. The slag layer is at least partially transparent (37) to the energy beam, and it may be partially optically absorbent or translucent to the energy beam to absorb enough energy to remain molten. As with a conventional ESW process, the slag layer insulates the molten material and shields it from reaction with air. A composition of the powder may be changed across a solidification axis (A) of the resulting component (60) to provide a functionally graded directionally solidified product.

The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.