Provided is a process for producing an aluminum member, including irradiating a surface of an aluminum raw material member including, as a component, aluminum or aluminum alloy and unavoidable impurities with a top-hat laser beam at an intensity of from 110 MW/cm2 to 320 MW/cm2, wherein the aluminum member includes, in sequence, a base layer containing, as a component, aluminum or aluminum alloy and having unavoidable impurities; an oxide layer containing an aluminum oxide; and a porous layer containing a porous aggregate of aluminum metal particles.

A method for cutting a workpiece includes cutting the workpiece along a predefined cutting contour to separate a workpiece part from a scrap part, and checking whether the workpiece part has been fully separated from the scrap part during the cutting. The workpiece is re-cut along an additional cutting contour laterally offset from the predefined cutting contour if it is found during the checking that the workpiece part has not been fully separated from the scrap part. The disclosure also relates to an associated machine for cutting a workpiece.

A cutting method includes: forming a reformed region in a workpiece; and after forming the reformed region in the workpiece, cutting the workpiece along an intended cut line. In the cutting the workpiece, a dry etching process is performed from a front surface toward a rear surface of the workpiece while the workpiece is fixed on a support member at least under its own weight or by suction, to form a groove from the front surface to reach the rear surface of the workpiece.

A method for producing a component by means of an additive manufacturing method using a laser is proposed, the method comprising the following steps: (a) providing a metal powder, (b) applying a powder layer (18) of the metal powder to a build platform (14) of a process chamber (12), (c) introducing a first process gas into the process chamber (12), (d) melting a first selected region (36) of the applied powder layer (18) by means of a laser in a first atmosphere which includes the first process gas, (e) introducing a second process gas into the process chamber (12), wherein the second process gas differs from the first process gas at least in terms of its composition and/or its pressure, and (f) melting a second selected region (38) of the applied powder layer (18) by means of the laser in a second atmosphere which includes the second process gas, wherein the second selected region (38) differs from the first selected region (36).

A manufacturing process is provided. During this process, material is solidified together within a chamber to form an object using an additive manufacturing device. At least a portion of the solidified material is conditioned within the chamber using a material conditioning device.

A laser machining method able to effectively satisfy cutting quality required on one side of a cutting spot of a workpiece. A laser machining method for cutting a workpiece W by using a machining head able to emit a laser beam and an assist gas coaxially and non-coaxially includes: preparing a machining program specifying, for the workpiece W, a cutting line, and a first region and a second region on both sides of the cutting line where cutting quality requirements are different; and maintaining a state in which a center axis of the assist gas is shifted from an optical axis of the laser beam toward the first region in response to the difference in the cutting quality requirements during the cutting between the first region and the second region along the cutting line in accordance with the machining program.

A dry cleaning apparatus includes a chamber, a substrate support supporting a substrate within the chamber, a shower head arranged in an upper portion of the chamber to supply a dry cleaning gas toward the substrate, the shower head including an optical window transmitting a laser light therethrough toward the substrate support, a plasma generator generating plasma from the dry cleaning gas, and a laser irradiator irradiating the laser light on the substrate through the optical window and the plasma to heat the substrate.

An interposer for electrical connection between a CPU chip and a circuit board is provided. The interposer includes a board-shaped base substrate made of glass having a coefficient of thermal expansion ranging from 3.110.sup.6/K to 3.410.sup.6/K. The interposer further includes a number of holes having diameters ranging from 20 m to 200 m. The number of holes ranging from 10 to 10,000 per square centimeter. Conductive paths running on one surface of the board extend right into respective holes and therethrough to the other surface of the board in order to form connection points for the chip.

A method for treating a raw-material powder includes forming a layer of the raw-material powder and removing oxide film formed on a surface of the raw-material powder from which the layer has been formed.

A laser processing apparatus according to the present disclosure includes a placement base on which a processing receiving object is placed, an optical system that guides laser light to the processing receiving object, a gas supply port via which a gas is supplied to a laser light irradiated region of the processing receiving object, a gas recovery port via which the supplied gas is recovered, a mover that moves the irradiated region, and a controller that controls, in accordance with the moving direction of the irradiated region, the direction of the flow of the gas flowing from the gas supply port to the gas recovery port, and the controller changes the direction of the gas flow in response to a change in the moving direction of the irradiated region in such a way that the gas flows in the direction opposite the moving direction of the irradiated region.