Provided is a semiconductor module including: a layered substrate on which a semiconductor chip is provided; and a connection terminal including a connection portion connected to the layered substrate, wherein the connection portion includes at least one ultrasonic connection section, and at least one laser-welded section, at least a portion of which is provided at a location other than a location at which the ultrasonic connection section is provided. The at least one ultrasonic connection section may be provided to be closer to the leading end of the connection portion than the at least one laser-welded section is.

Provided is a semiconductor module including: a layered substrate on which a semiconductor chip is provided; and a connection terminal including a connection portion connected to the layered substrate, wherein the connection portion includes at least one ultrasonic connection section, and at least one laser-welded section, at least a portion of which is provided at a location other than a location at which the ultrasonic connection section is provided. The at least one ultrasonic connection section may be provided to be closer to the leading end of the connection portion than the at least one laser-welded section is.

A temperature sensor provided with: an element that comprises a resistor which has a resistance value that changes with temperature thereof, and a lead wire; a signal wire that is bonded to the lead wire by welding; and a cover that covers the element and a welded part between the lead wire and the signal wire, where the lead wire comprises a material in which oxide particles are dispersed in platinum or platinum alloy; and the welded part has a welded part interface region along an interface with the lead wire or the signal wire, and a welded part main region inside thereof, and a volume ratio of the oxide particles occupying the welded part interface region is larger than a volume ratio of the oxide particles occupying the welded part main region.

A temperature sensor provided with: an element that comprises a resistor which has a resistance value that changes with temperature thereof, and a lead wire; a signal wire that is bonded to the lead wire by welding; and a cover that covers the element and a welded part between the lead wire and the signal wire, where the lead wire comprises a material in which oxide particles are dispersed in platinum or platinum alloy; and the welded part has a welded part interface region along an interface with the lead wire or the signal wire, and a welded part main region inside thereof, and a volume ratio of the oxide particles occupying the welded part interface region is larger than a volume ratio of the oxide particles occupying the welded part main region.

A case includes a first member and a second member configured in such a way that a closed space is formed between the first and second members in a state where the first and second members abut against each other. The first member includes a shaft portion extending toward the second member. The second member includes a shaft support portion including a circumferential wall portion that surrounds one end portion of the shaft portion. The shaft portion includes an enlarged-diameter portion that is the one end portion melted in such a way as to be enlarged in diameter.

A case includes a first member and a second member configured in such a way that a closed space is formed between the first and second members in a state where the first and second members abut against each other. The first member includes a shaft portion extending toward the second member. The second member includes a shaft support portion including a circumferential wall portion that surrounds one end portion of the shaft portion. The shaft portion includes an enlarged-diameter portion that is the one end portion melted in such a way as to be enlarged in diameter.

An electromagnetic radiation system (100) for directing an electromagnetic radiation beam at a target (130). The electromagnetic radiation system comprises an electromagnetic radiation source (110) for providing the electromagnetic radiation beam, a head (120) for projecting the electromagnetic radiation beam on to the target (130); and an umbilical assembly (140) connecting the electromagnetic radiation source (110) to the head (120) and configured to transmit the electromagnetic radiation beam to the head. The electromagnetic radiation system further comprises an optical isolator (150) positioned between the electromagnetic radiation source (110) and the umbilical assembly (140).

The invention relates to a method for welding a plurality of strands (33) of one or more electrical conductors (22), comprising at least the following steps: (a) preparing the strands (33) to be welded such that at least the free ends (22a) of adjacent strands are axially offset by a non-zero distance d. (b) melting the free ends (22a) of the strands thus arranged in order to weld them without addition of material.

A laser processing apparatus includes first and second laser oscillators that emit first and second laser lights (LB1), (LB2) having wavelengths different from each other, an optical fiber that guides first and second laser lights (LB1), (LB2), and laser head (50) configured to condense first and second laser lights (LB1), (LB2), respectively, at predetermined positions of a workpiece. Laser head (50) includes optical path difference generation unit (70) provided inside second housing (51). Optical path difference generation unit (70) is configured to make an optical path length of first laser light (LB1) inside second housing (51) longer than an optical path length of second laser light (LB2).

A laser welding method according to this disclosure is a laser welding method for welding first and second coils (members) to each other by applying a laser beam to the first and second coils in a state where the first and second coils are brought into contact with each other. The laser welding method includes: a first step of forming a weld pool by applying a laser beam to the first coil; and a second step of continuing the application of the laser beam to the first coil until the width of a bridge formed between the first and second coils becomes wider than the width of the laser beam, the bridge being formed such that the weld pool is attached to the second coil by growing.