A method for manufacturing a display panel includes providing a mother substrate that includes a display area and a non-display area, and includes a first substrate, a second substrate facing the first substrate, and a sealant provided between the first substrate and the second substrate, generating a crack on the sealant through irradiation of laser onto the sealant between the first substrate and the second substrate, and cutting a part of the second substrate and a part of the sealant at a position corresponding to the crack.

An improved metal drinking straw is provided. The improved metal drinking straw includes an outer wall provided with a rough surface, an inner wall formed as a smooth mirror surface, and one end formed as a guiding structure. The guiding structure includes at least one first recess and at least one first protrusion. The first recess and the first protrusion are alternately connected.

A computer-implemented method for generating laser engraving instructions for performing a patterning process on a workpiece surface includes receiving a first input value indicating a first laser-pulse pattern and a second input value for a laser parameter associated with a laser-engraving system; and generating a machine-command sequence for the laser-engraving system based on the first input value and the second input value.

A computer-implemented method for generating laser engraving instructions for performing a patterning process on a workpiece surface includes receiving a first input value indicating a first laser-pulse pattern and a second input value for a laser parameter associated with a laser-engraving system; and generating a machine-command sequence for the laser-engraving system based on the first input value and the second input value.

This invention provides a method for manufacturing decorated-parts of high design-quality and reliability, since the exposed surface of the base coat-layer is not bulged, and thus the color of said coat-layer is distinct. The method for manufacturing decorated-parts of this invention comprises a base coat-layer-forming process, a surface coat-layer-forming process and a laser-decorating process. In the base coat-layer-forming process, a resin-base material of a highly light color at a lightness-level of 70 or more or a clear and colorless resin base-material is formed. In the surface coat-layer forming process, the surface coat-layer of a less-bright color at a lightness-level of 20 or less is formed on the base coat-layer. In the laser-decorating process, the first laser-processed groove penetrating the surface coat-layer and exposing partially the base coat-layer is made by irradiating the infrared laser onto such surface coat-layer, thus providing a fine decoration onto the surface of said decorated-part.

This invention provides a method for manufacturing decorated-parts of high design-quality and reliability, since the exposed surface of the base coat-layer is not bulged, and thus the color of said coat-layer is distinct. The method for manufacturing decorated-parts of this invention comprises a base coat-layer-forming process, a surface coat-layer-forming process and a laser-decorating process. In the base coat-layer-forming process, a resin-base material of a highly light color at a lightness-level of 70 or more or a clear and colorless resin base-material is formed. In the surface coat-layer forming process, the surface coat-layer of a less-bright color at a lightness-level of 20 or less is formed on the base coat-layer. In the laser-decorating process, the first laser-processed groove penetrating the surface coat-layer and exposing partially the base coat-layer is made by irradiating the infrared laser onto such surface coat-layer, thus providing a fine decoration onto the surface of said decorated-part.

A laser beam irradiation unit of a laser processing apparatus includes a pulse laser oscillator, a condenser which converges and irradiates a pulse laser beam upon a workpiece held on a chuck table, a dichroic mirror disposed between the pulse laser oscillator and the condenser, a strobo flash irradiation unit which irradiates light on a route of the dichroic mirror and the condenser, a beam splitter disposed between the strobo flash irradiation unit and the dichroic mirror, and an image pickup unit disposed on the route of the light split by the beam splitter. A control unit renders the strobo flash irradiation unit and the image pickup unit operative in a timed relationship with the pulse laser beam oscillated from the pulse laser beam oscillator and irradiated upon the workpiece and detects a processed state on the basis of an image signal from the image pickup unit.

A laser beam irradiation unit of a laser processing apparatus includes a pulse laser oscillator, a condenser which converges and irradiates a pulse laser beam upon a workpiece held on a chuck table, a dichroic mirror disposed between the pulse laser oscillator and the condenser, a strobo flash irradiation unit which irradiates light on a route of the dichroic mirror and the condenser, a beam splitter disposed between the strobo flash irradiation unit and the dichroic mirror, and an image pickup unit disposed on the route of the light split by the beam splitter. A control unit renders the strobo flash irradiation unit and the image pickup unit operative in a timed relationship with the pulse laser beam oscillated from the pulse laser beam oscillator and irradiated upon the workpiece and detects a processed state on the basis of an image signal from the image pickup unit.

A device for inscribing identification units, each identification unit including an identification plate or connected single-piece identification plates, each identification plate having an inscription surface, and the inscription surface or a plurality of the inscription surfaces of each identification unit spanning an inscription plane, includes a housing; an inscription device that is arranged in the housing, particularly a laser inscription device; a drop shaft which is arranged in the housing, is accessible via an inlet opening in the housing, is designed for conveying individual identification units to the inscription device, and is delimited by at least one chute for the identification units, the chute being at an incline relative to the horizontal and vertical lines; a support surface which is arranged at the lower end of the drop shaft and spans a support plane in order to support an edge of the identification units; a stopping block that protrudes upwards over the support plane or is arranged over the support plane; and a counter holder that can move towards and away from the stopping block in a feed direction, in order to press identification units that are supported on the support surface against the stopping block, in an inscription position.

Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits involves forming a mask above the semiconductor wafer, the mask composed of a layer covering and protecting the integrated circuits. The mask is then patterned with a rotating laser beam laser scribing process to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then plasma etched through the gaps in the patterned mask to singulate the integrated circuits.