Patent classifications
B23K26/361
Systems for laser trimming dental aligners
A system includes an orientation determination system comprising a camera where the camera is configured to capture an image of an orientation feature of a physical dental model of a dental arch of a customer with material thermoformed thereon. The orientation determination system is configured to identify an offset of the physical dental model with respect to a fixture plate during positioning or before or after the physical dental model is positioned on the fixture plate by determining an actual orientation of the physical dental model based on the orientation feature. The system also includes a laser trimming system configured to cut the material along a trim line based on the identified offset while the fixture plate is moved about at least two axes to produce a dental aligner specific to the customer and being configured to reposition one or more teeth of the customer.
Systems for laser trimming dental aligners
A system includes an orientation determination system comprising a camera where the camera is configured to capture an image of an orientation feature of a physical dental model of a dental arch of a customer with material thermoformed thereon. The orientation determination system is configured to identify an offset of the physical dental model with respect to a fixture plate during positioning or before or after the physical dental model is positioned on the fixture plate by determining an actual orientation of the physical dental model based on the orientation feature. The system also includes a laser trimming system configured to cut the material along a trim line based on the identified offset while the fixture plate is moved about at least two axes to produce a dental aligner specific to the customer and being configured to reposition one or more teeth of the customer.
Thin-film devices and fabrication
Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.
Thin-film devices and fabrication
Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.
LASER CLEANING BATTERY COMPONENTS
A battery pack including a supporting structure, a battery cell housed within the supporting structure, a sleeve partially surrounding the battery cell, a bus bar, and a wire. The sleeve extends over a portion of a first end of the battery cell and has a laser-cut cutaway portion exposing a laser-cleaned first bonding area of the first end of the battery cell. The laser-cleaned first bonding area is positioned adjacent to an outer perimeter of the first end of the battery cell. The bus bar has a laser-cleaned second bonding area. The wire is bonded to the first and second laser-cleaned bonding areas to electrically connect the battery cell to the bus bar.
LASER CLEANING BATTERY COMPONENTS
A battery pack including a supporting structure, a battery cell housed within the supporting structure, a sleeve partially surrounding the battery cell, a bus bar, and a wire. The sleeve extends over a portion of a first end of the battery cell and has a laser-cut cutaway portion exposing a laser-cleaned first bonding area of the first end of the battery cell. The laser-cleaned first bonding area is positioned adjacent to an outer perimeter of the first end of the battery cell. The bus bar has a laser-cleaned second bonding area. The wire is bonded to the first and second laser-cleaned bonding areas to electrically connect the battery cell to the bus bar.
Method for laser stripping a moving metal product and plant for the execution thereof
A laser descaling device and process includes a first laser sending a ray to the product to be descaled, reflected rays being intercepted by sensors that send collected information into a processing unit that calculates the absorption of the ray by the surface of the product, deduces the emissivity of the oxidized surface in the direction of the reflected rays, and correlates this emissivity with reference information prerecorded inside the processing unit; a second laser sends a ray onto the surface of the product, the spots of the rays covering the entire surface to be descaled, the second laser being controlled by a control unit receiving information provided by the processing unit making it possible to determine the operating parameters to be imposed on the second laser to obtain the descaling of the surface of the product, compared with experimental results prerecorded in the control unit.
Method for laser stripping a moving metal product and plant for the execution thereof
A laser descaling device and process includes a first laser sending a ray to the product to be descaled, reflected rays being intercepted by sensors that send collected information into a processing unit that calculates the absorption of the ray by the surface of the product, deduces the emissivity of the oxidized surface in the direction of the reflected rays, and correlates this emissivity with reference information prerecorded inside the processing unit; a second laser sends a ray onto the surface of the product, the spots of the rays covering the entire surface to be descaled, the second laser being controlled by a control unit receiving information provided by the processing unit making it possible to determine the operating parameters to be imposed on the second laser to obtain the descaling of the surface of the product, compared with experimental results prerecorded in the control unit.
Method for manufacturing diamond single crystal cutting tool using laser pulses
A method for manufacturing a cutting tool according to one embodiment is a method for manufacturing a cutting tool, the cutting tool including a base material and a diamond single crystal material fixed to the base material, the diamond single crystal material having a rake face, a flank face continuous with the rake face, and a cutting edge formed by a ridgeline serving as a boundary between the rake face and the flank face. The method for manufacturing a cutting tool according to one form of the present disclosure includes a flank face irradiation step of applying a laser to the diamond single crystal material along the cutting edge from a side of the flank face. The laser has a pulse width of 1×10.sup.−12 seconds or less and a peak output of less than 1 W in the flank face irradiation step.
Method for manufacturing diamond single crystal cutting tool using laser pulses
A method for manufacturing a cutting tool according to one embodiment is a method for manufacturing a cutting tool, the cutting tool including a base material and a diamond single crystal material fixed to the base material, the diamond single crystal material having a rake face, a flank face continuous with the rake face, and a cutting edge formed by a ridgeline serving as a boundary between the rake face and the flank face. The method for manufacturing a cutting tool according to one form of the present disclosure includes a flank face irradiation step of applying a laser to the diamond single crystal material along the cutting edge from a side of the flank face. The laser has a pulse width of 1×10.sup.−12 seconds or less and a peak output of less than 1 W in the flank face irradiation step.