A system includes a fixture, a laser assembly, and a positioning assembly. The fixture is configured to hold (i) a substrate of a distal-end assembly of a catheter and (ii) a lead placed on a given solder pad disposed on the substrate, the laser assembly is configured to emit a laser beam, and the positioning assembly is configured to move the fixture, with the substrate and the lead, relative to the laser assembly, so as to mark a soldering position, at which the lead is to be attached to the given solder pad, with a laser spot of the laser beam.

There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The method of manufacturing a head chip according to an embodiment of the present disclosure is a method of manufacturing a head chip having an actuator plate adapted to apply pressure to liquid so as to jet the liquid. Forming the actuator plate includes forming a plurality of grooves on a surface of a piezoelectric substrate having one end and the other end so as to extend from the one end side toward the other end side, forming a conductive film on the surface of the piezoelectric substrate provided with the plurality of grooves, forming a laser processing area in the conductive film between the grooves adjacent to each other by performing laser processing from a start point on the one end side of the piezoelectric substrate to an end point on the other end side, and forming a surface removal area in at least a part including the start point and the end point out of the surface of the piezoelectric substrate by performing surface removal processing in a direction crossing the direction in which the laser processing is performed.

There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The method of manufacturing a head chip according to an embodiment of the present disclosure is a method of manufacturing a head chip having an actuator plate adapted to apply pressure to liquid so as to jet the liquid. Forming the actuator plate includes forming a plurality of grooves on a surface of a piezoelectric substrate having one end and the other end so as to extend from the one end side toward the other end side, forming a conductive film on the surface of the piezoelectric substrate provided with the plurality of grooves, forming a laser processing area in the conductive film between the grooves adjacent to each other by performing laser processing from a start point on the one end side of the piezoelectric substrate to an end point on the other end side, and forming a surface removal area in at least a part including the start point and the end point out of the surface of the piezoelectric substrate by performing surface removal processing in a direction crossing the direction in which the laser processing is performed.

The inventive concept provides a mask treating method. The mask treating method includes treating a mask by supplying a liquid to the mask, and irradiating a laser to a region of the mask on which a specific pattern is formed while the liquid remains on the mask; moving an optical module including a laser unit configured to irradiate the laser between a process position for treating the substrate and a standby position deviating from the process position; and adjusting a state of the optical module at an inspection port provided at the standby position to a set condition before the optical module is moved to the process position.

The inventive concept provides a mask treating method. The mask treating method includes treating a mask by supplying a liquid to the mask, and irradiating a laser to a region of the mask on which a specific pattern is formed while the liquid remains on the mask; moving an optical module including a laser unit configured to irradiate the laser between a process position for treating the substrate and a standby position deviating from the process position; and adjusting a state of the optical module at an inspection port provided at the standby position to a set condition before the optical module is moved to the process position.

A method for stripping ceramic from a component includes applying a liquid to a ceramic coating of an outer surface of the component. The method also includes directing a plurality of laser pulses at the ceramic coating with the applied liquid in order to spall the ceramic coating from the component.

A method for stripping ceramic from a component includes applying a liquid to a ceramic coating of an outer surface of the component. The method also includes directing a plurality of laser pulses at the ceramic coating with the applied liquid in order to spall the ceramic coating from the component.

A display apparatus includes a light source, a display panel, a light guide member, and an optical member. The light source is configured to generate light. The display panel is configured to display an image. The light guide member includes at least one surface adjacent to the light source. The optical member is between the light guide member and the display panel. The optical member includes a low refractive layer, a first cover layer, and a light conversion layer. The low refractive layer is on a light output surface of the light guide member and includes side surfaces. The first cover layer is on the low refractive layer and surrounds at least a portion of the side surfaces of the low refractive layer. The light conversion layer is on the first cover layer and is configured to covert a wavelength band of incident light.

Disclosed is a method for an all-laser hybrid additive manufacturing. After a matrix is obtained by means of selective laser melting forming, a subtractive forming is carried out on the matrix by means of a pulse laser to form a cavity, and the cavity is then packaged to obtain a forming material with an internal cavity structure. A laser precision packaging method is used in the method based on the melting of the laser selective region. Also disclosed is the apparatus, comprising a laser unit (2), a control unit (4) and a forming unit (6). The laser unit is in light path connection with the forming unit, and the control unit is electrically connected with the laser unit and the forming unit respectively. The laser unit comprises a first laser light source to and a second laser light source. The forming unit comprises a welding unit (68), and the welding unit is controlled by the control unit and is matched with the laser unit for the additive manufacturing.

Disclosed is a method for an all-laser hybrid additive manufacturing. After a matrix is obtained by means of selective laser melting forming, a subtractive forming is carried out on the matrix by means of a pulse laser to form a cavity, and the cavity is then packaged to obtain a forming material with an internal cavity structure. A laser precision packaging method is used in the method based on the melting of the laser selective region. Also disclosed is the apparatus, comprising a laser unit (2), a control unit (4) and a forming unit (6). The laser unit is in light path connection with the forming unit, and the control unit is electrically connected with the laser unit and the forming unit respectively. The laser unit comprises a first laser light source to and a second laser light source. The forming unit comprises a welding unit (68), and the welding unit is controlled by the control unit and is matched with the laser unit for the additive manufacturing.