A composite panel having a plurality of carbon plies, a perforated metallic foil comprising several apertures and being directly secured to the plurality of carbon plies, and a protective layer made from resin reinforced with fibers which is secured to the metallic foil. The perforated metallic foil is embedded in the protective layer through its apertures. A free surface of the protective layer forms a top side of the composite panel. The thickness of the protective layer between the top side of the composite panel and the perforated metallic foil is at least 15 micrometers and the perforated metallic foil has a thickness of not more than 30 micrometers. The plurality of apertures in the aggregate defines an open area of not more than 40% of the surface area and a maximum distance between two opposed points in a perimeter of an aperture is equal to or less than 3 mm.

A method for cutting workpieces of different thicknesses includes providing at least one unprocessed laser beam, selectively forming a processing laser beam from the at least one unprocessed laser beam in accordance with a thickness of the workpiece, and cutting the workpiece with the processing laser beam. Forming the processing laser beam includes selectively coupling one or more unprocessed laser beams into one or more of a plurality of parallel, non-concentric fibers of a compound fiber, the plurality of fibers of the compound fiber having different cross-sectional shapes. A laser beam characteristic of the processing laser beam exiting the compound fiber differs depending upon which fibers of the compound fiber receive the at least one unprocessed laser beam, the laser beam characteristic of the processing laser beam differing depending on the thickness.

A method for cutting workpieces of different thicknesses includes providing at least one unprocessed laser beam, selectively forming a processing laser beam from the at least one unprocessed laser beam in accordance with a thickness of the workpiece, and cutting the workpiece with the processing laser beam. Forming the processing laser beam includes selectively coupling one or more unprocessed laser beams into one or more of a plurality of parallel, non-concentric fibers of a compound fiber, the plurality of fibers of the compound fiber having different cross-sectional shapes. A laser beam characteristic of the processing laser beam exiting the compound fiber differs depending upon which fibers of the compound fiber receive the at least one unprocessed laser beam, the laser beam characteristic of the processing laser beam differing depending on the thickness.

A driver circuit includes: a current-controlling switching element electrically connected to a light emitting element; a differential amplifier circuit including: an output terminal electrically connected to the current-controlling switching element, a first input terminal configured to receive a reference signal as a reference for radiating light with a desired intensity from the light emitting element, and a second input terminal configured to receive a detection signal corresponding to a detection result of a current flowing in the light emitting element, wherein the differential amplifier circuit is configured to control the current flowing in the light emitting element and the current-controlling switching element based on a voltage of the first input terminal and a voltage of the second input terminal; and an adjustment part configured to adjust an overshoot amount of a rising edge of the current flowing in the light emitting element.

A driver circuit includes: a current-controlling switching element electrically connected to a light emitting element; a differential amplifier circuit including: an output terminal electrically connected to the current-controlling switching element, a first input terminal configured to receive a reference signal as a reference for radiating light with a desired intensity from the light emitting element, and a second input terminal configured to receive a detection signal corresponding to a detection result of a current flowing in the light emitting element, wherein the differential amplifier circuit is configured to control the current flowing in the light emitting element and the current-controlling switching element based on a voltage of the first input terminal and a voltage of the second input terminal; and an adjustment part configured to adjust an overshoot amount of a rising edge of the current flowing in the light emitting element.

A method for manufacturing a display device including a display panel having a folding area to be folded along a virtual folding axis and first and second non-folding areas adjacent to both sides of the folding area, and a window disposed on the display panel, the method including preparing a mother substrate having an effective area and a non-effective area divided by a cutting line, performing a first laser process along a first cutting line disposed in the first non-folding area, performing a second laser process along a second cutting line disposed in the second non-folding area, and performing a third laser process along a third cutting line disposed in the folding area, in which one end of the third cutting line overlaps a first end of the first cutting line, and the other end of the third cutting line overlaps a first end of the second cutting line.

A method for manufacturing a display device including a display panel having a folding area to be folded along a virtual folding axis and first and second non-folding areas adjacent to both sides of the folding area, and a window disposed on the display panel, the method including preparing a mother substrate having an effective area and a non-effective area divided by a cutting line, performing a first laser process along a first cutting line disposed in the first non-folding area, performing a second laser process along a second cutting line disposed in the second non-folding area, and performing a third laser process along a third cutting line disposed in the folding area, in which one end of the third cutting line overlaps a first end of the first cutting line, and the other end of the third cutting line overlaps a first end of the second cutting line.

A machining apparatus for laser machining a work-piece, in particular for laser cutting, is provided, having a device for generating a machining laser beam, for rough machining the work-piece, in particular for producing cuts with cut edges in the workpiece, and having a device for splitting the machining laser beam into at least two energy intensity ranges, wherein a first energy intensity range for rough machining of the workpiece has a greater time-integrated radiation energy than at least one second energy intensity range for at least partially fine machining a cut edge. Further provided is a method a for laser machining a workpiece.

A machining apparatus for laser machining a work-piece, in particular for laser cutting, is provided, having a device for generating a machining laser beam, for rough machining the work-piece, in particular for producing cuts with cut edges in the workpiece, and having a device for splitting the machining laser beam into at least two energy intensity ranges, wherein a first energy intensity range for rough machining of the workpiece has a greater time-integrated radiation energy than at least one second energy intensity range for at least partially fine machining a cut edge. Further provided is a method a for laser machining a workpiece.

A processing apparatus includes a reinforcing portion removing mechanism. The reinforcing portion removing mechanism includes a laser beam irradiating unit configured to form a cutting groove by applying a laser beam to a base of a ring-shaped reinforcing portion formed on a periphery of a wafer, a first raising and lowering table configured to hold and raise a frame unit temporarily placed on a temporary placement table, and position the frame unit at the laser beam irradiating unit, and a separating unit configured to separate the ring-shaped reinforcing portion from the cutting groove. The separating unit includes an ultraviolet ray irradiating unit, a second raising and lowering table, a separator, and a discarding unit.