The present disclosure relates to the field of Chemical Vapor Deposition (CVD) diamonds and their processing after fabrication. In particular, the present disclosures provides a method for coring and slicing a CVD diamond product, wherein the CVD diamond product comprises a CVD diamond and graphitized material covering several side-faces of the diamond. The method is carried out by an apparatus that provides a laser beam coupled into a fluid jet. The method comprises, for the coring, cutting the product with the laser beam to remove the graphitized material from the side-faces of the diamond. Further, the method comprises, for the slicing, cutting off one or more slices from the diamond with the laser beam.

The present disclosure relates to the field of Chemical Vapor Deposition (CVD) diamonds and their processing after fabrication. In particular, the present disclosures provides a method for coring and slicing a CVD diamond product, wherein the CVD diamond product comprises a CVD diamond and graphitized material covering several side-faces of the diamond. The method is carried out by an apparatus that provides a laser beam coupled into a fluid jet. The method comprises, for the coring, cutting the product with the laser beam to remove the graphitized material from the side-faces of the diamond. Further, the method comprises, for the slicing, cutting off one or more slices from the diamond with the laser beam.

In a method for laser fusion cutting in particular a plate-shaped workpiece, preferably with a thickness D of at least 1 mm, a laser beam and a cutting gas, in particular nitrogen, at a cutting gas pressure are directed at the workpiece surface by a convergent cutting nozzle. The laser power is at least 6 kW and the cutting nozzle has a nozzle end face on the workpiece side. A distance A between the nozzle end face and the workpiece surface during the cutting operation is 2 to 8 mm. The cutting nozzle has a nozzle channel with a diameter d.sub.D at the nozzle end face on the workpiece side of 1.5 to 4 mm. The cutting gas pressure before emergence from the cutting nozzle is 15 to 30 bar. This makes it possible to achieve high productivity along with a reduced risk of collision, i.e. higher process reliability.

In a method for laser fusion cutting in particular a plate-shaped workpiece, preferably with a thickness D of at least 1 mm, a laser beam and a cutting gas, in particular nitrogen, at a cutting gas pressure are directed at the workpiece surface by a convergent cutting nozzle. The laser power is at least 6 kW and the cutting nozzle has a nozzle end face on the workpiece side. A distance A between the nozzle end face and the workpiece surface during the cutting operation is 2 to 8 mm. The cutting nozzle has a nozzle channel with a diameter d.sub.D at the nozzle end face on the workpiece side of 1.5 to 4 mm. The cutting gas pressure before emergence from the cutting nozzle is 15 to 30 bar. This makes it possible to achieve high productivity along with a reduced risk of collision, i.e. higher process reliability.

A method for stripping a rod-shaped conductor using laser radiation is provided. The rod-shaped conductor includes an electrically conductive core and a coating that is at least partially transparent to the laser radiation. The method includes traversing the conductor for a first time with at least one laser beam to at least partially reduce transparency of the coating, and traversing the conductor for a second time with the at least one laser beam to at least partially reduce adhesion of the coating.

A method for stripping a rod-shaped conductor using laser radiation is provided. The rod-shaped conductor includes an electrically conductive core and a coating that is at least partially transparent to the laser radiation. The method includes traversing the conductor for a first time with at least one laser beam to at least partially reduce transparency of the coating, and traversing the conductor for a second time with the at least one laser beam to at least partially reduce adhesion of the coating.

According to the present disclosure, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, so as to contribute in improving the safety property of the secondary battery. The manufacturing method of the electrode plate herein disclosed includes a precursor preparing step for preparing an electrode precursor 20A including an active substance provided area A1 in which an electrode active substance layer 24 is provided on a surface of the electrode substrate 22 and including a substrate exposed area A2 in which the electrode active substance layer 24 is not provided and the electrode substrate 22 is exposed, an active substance provided area cutting step for cutting the active substance provided area A1 by a pulse laser, and a substrate exposed area cutting step for cutting the substrate exposed area A2 by the pulse laser. Then, the frequency of the pulse laser in the substrate exposed area cutting step is made to be larger than the frequency of the pulse laser in the active substance provided area cutting step, and the lap rate of the pulse laser in the substrate exposed area cutting step is made to be equal to or more than 90%. According to the manufacturing method of the electrode plate as described above, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, and thus it is possible to contribute in improving the safety property of the secondary battery.

A laminated device wafer forming method includes a laminating step of laminating a first device wafer and a second device wafer to each other, the laminating step including a position adjusting step of imaging, by an imaging unit, a first predetermined line formed on a peripheral portion on the front surface side of the first device wafer and located outside rectangular regions corresponding to devices and a second predetermined line formed on a peripheral portion on the front surface side of the second device wafer and located outside the rectangular regions corresponding to the devices, and adjusting relative positions of the first device wafer and the second device wafer by using the first predetermined line and the second predetermined line.

A laminated device wafer forming method includes a laminating step of laminating a first device wafer and a second device wafer to each other, the laminating step including a position adjusting step of imaging, by an imaging unit, a first predetermined line formed on a peripheral portion on the front surface side of the first device wafer and located outside rectangular regions corresponding to devices and a second predetermined line formed on a peripheral portion on the front surface side of the second device wafer and located outside the rectangular regions corresponding to the devices, and adjusting relative positions of the first device wafer and the second device wafer by using the first predetermined line and the second predetermined line.

The present disclosure relates to a system for manufacturing a hybrid component including a first thermal supplier configured to heat a steel plate, a rolling roll for undercut configured to pressurize the steel plate heated by the first thermal supplier, and to form an undercut on one surface of the steel plate, a first molding roll configured to pressurize the steel plate formed with the undercut to mold the steel plate in a shape of a component to be manufactured, a composite material feeder configured to supply a composite material tape to be seated on one surface of the steel plate formed with the undercut through the first molding roll, and a composite material pressurization roll configured to pressurize the steel plate on which the composite material tape is seated.