A device includes a first laser emitter, a second laser emitter, and a separating portion. The first laser emitter is configured to emit, in an outer circumferential portion of a bonded substrate including a first substrate and a second substrate bonded to each other, a first laser beam into the first substrate from a side of the first substrate to form a modified layer. The second laser emitter is configured to emit a second laser beam to a material layer that is arranged between the first substrate and the second substrate and is provided on the second substrate from a side of the second substrate, to cause peeling between the second substrate and the material layer. The separating portion is configured to separate an outer circumferential portion of the first substrate and an outer circumferential portion of the material layer from the outer circumferential portion of the bonded substrate.

A device includes a first laser emitter, a second laser emitter, and a separating portion. The first laser emitter is configured to emit, in an outer circumferential portion of a bonded substrate including a first substrate and a second substrate bonded to each other, a first laser beam into the first substrate from a side of the first substrate to form a modified layer. The second laser emitter is configured to emit a second laser beam to a material layer that is arranged between the first substrate and the second substrate and is provided on the second substrate from a side of the second substrate, to cause peeling between the second substrate and the material layer. The separating portion is configured to separate an outer circumferential portion of the first substrate and an outer circumferential portion of the material layer from the outer circumferential portion of the bonded substrate.

In a method of processing a substrate, in a second step, only some of a plurality of altered portions are exposed from an opening portion of a mask, and the remaining portions are not exposed. In this case, at the time of etching in a third step, an etching rate may be made different between the altered portions exposed from the opening portion of the mask and the altered portions which are not exposed. Accordingly, it becomes easier to obtain a desired processed shape by adjusting the altered portions exposed from the opening portion of the mask and the altered portions which are not exposed.

The invention relates to a method for welding a first workpiece (11) to a second workpiece (12) by means of a laser. It is an object of the invention to provide a reliable, repeatable and reproducible approach for laser welding of two workpieces one of which consists of a semiconductor material. The method proposed by the invention comprises the following steps: Irradiating the first workpiece (11) with a beam of pulsed laser radiation, wherein the first workpiece (11) consists of a semiconductor material which is transparent at the wavelength of the laser radiation, so that the beam enters the first workpiece (11) through an entrance surface and leaves it through an exit surface, the geometric focus of the beam being positioned in the plane of the exit surface; determining a delocalization of the focus caused by nonlinear interaction of the laser radiation with the semiconductor material; placing the second workpiece (12) against the first workpiece (11); and, again, irradiating the first workpiece (11) with the laser beam of pulsed laser radiation, the focus of the laser radiation being positioned along the beam direction taking into account the determined delocalization so that the intensity maximum is located in the plane of the exit surface forming the interface of the two workpieces (11, 12), whereby the first workpiece (11) is welded to the second workpiece (12). Moreover, the invention relates to a system for welding a first workpiece (11) to a second workpiece (12).

According to one embodiment, a laser lift-off apparatus (1) which irradiates with laser light (16) from a side of a substrate (11) an interface between the substrate (11) and a separating layer (12) of a workpiece (10) including the substrate (11) and the separating layer (12) formed over the substrate (11), and separates the separating layer (12) from the substrate (11) includes: an injection unit (22) which blows a gas (35) onto the workpiece (10) and blows away dusts existing on a surface of the workpiece (10), and a dust collecting unit (23) which includes an opening (52) at a position meeting an irradiation position of the laser light (16), and sucks and collects the blown dusts through the opening (52).

Methods and systems of using a laser beam to weld an object with a non-flat surface, including curved surfaces, are described, where at least one piece of the object is transparent. An optical guide with a flat surface and an interface surface is placed on a piece of an object to welded. The interface surface is fabricated to form-fit the non-flat surface of the object to be welded, and is opposite the flat surface. A liquid optical medium is applied between the non-flat surface and the interface surface, filling any gaps or surface defects. The laser beam is then transmitted through the optical guide, liquid optical medium, and into the object to be welded, to a location to be welded. The laser beam then welds the object to be welded at pre-determined points.

A fabrication method of transparent material is a method of processing a thermosetting transparent material including a disposing step of disposing an uncured thermosetting transparent material, a laser beam irradiation step of irradiating the disposed uncured thermosetting transparent material with a laser beam so that cavitation bubbles are generated in the uncured thermosetting transparent material, and a curing step of performing a curing process on the uncured thermosetting transparent material in which the cavitation bubbles are generated.

A fabrication method of transparent material is a method of processing a thermosetting transparent material including a disposing step of disposing an uncured thermosetting transparent material, a laser beam irradiation step of irradiating the disposed uncured thermosetting transparent material with a laser beam so that cavitation bubbles are generated in the uncured thermosetting transparent material, and a curing step of performing a curing process on the uncured thermosetting transparent material in which the cavitation bubbles are generated.

A workpiece-separating device includes: a holding member which detachably holds one of the workpiece and the supporting body; a laser irradiation part which irradiates the separating layer with the laser beam through the other of the supporting body and the workpiece of the laminated body being held by the holding member; and a controlling part which controls an operation of the laser irradiation part, wherein the laser irradiation part has a laser scanner which moves the spot like laser beam along the laminated body, an entire irradiated face of the separating layer in an area of the laser beam irradiated from the laser scanner toward the laminated body is divided into a plurality of irradiation areas each having a band shape that is elongated in one of two directions intersecting a light irradiation direction from the laser irradiation part.

A workpiece-separating device includes: a holding member which detachably holds one of the workpiece and the supporting body; a laser irradiation part which irradiates the separating layer with the laser beam through the other of the supporting body and the workpiece of the laminated body being held by the holding member; and a controlling part which controls an operation of the laser irradiation part, wherein the laser irradiation part has a laser scanner which moves the spot like laser beam along the laminated body, an entire irradiated face of the separating layer in an area of the laser beam irradiated from the laser scanner toward the laminated body is divided into a plurality of irradiation areas each having a band shape that is elongated in one of two directions intersecting a light irradiation direction from the laser irradiation part.