A method for refining a magnetic domain of a grain-oriented electrical steel strip is provided, including a steel strip supporting roll position adjusting step of controlling a position of the steel strip in a vertical direction while supporting the steel strip proceeding along a production line, a laser irradiating step of forming a groove on a surface of the steel strip by irradiating a laser beam onto the surface of the steel strip to melt the steel strip, and a detecting step of detecting a defect in the groove formed on the surface of the steel strip while the steel strip proceeds, so as to be able to detect whether the groove is defective by confirming a machining state of a magnetic domain refined groove formed on the surface of the steel strip in a working process.

A method for refining a magnetic domain of a grain-oriented electrical steel strip is provided, including a steel strip supporting roll position adjusting step of controlling a position of the steel strip in a vertical direction while supporting the steel strip proceeding along a production line, a laser irradiating step of forming a groove on a surface of the steel strip by irradiating a laser beam onto the surface of the steel strip to melt the steel strip, and a detecting step of detecting a defect in the groove formed on the surface of the steel strip while the steel strip proceeds, so as to be able to detect whether the groove is defective by confirming a machining state of a magnetic domain refined groove formed on the surface of the steel strip in a working process.

Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.

Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.

Methods and devices for producing a composite pane having a functional coating are presented. The functional coating is applied to part of a surface of a base pane, and a first pane is cut out from the base pane while introducing a frame-shaped peripheral coating-free region into the functional coating having an inner region that is not adjacent a side edge of the first pane. The surface of the first pane with the functional coating is then bonded via a thermoplastic intermediate layer to a surface of a second pane.

Methods and devices for producing a composite pane having a functional coating are presented. The functional coating is applied to part of a surface of a base pane, and a first pane is cut out from the base pane while introducing a frame-shaped peripheral coating-free region into the functional coating having an inner region that is not adjacent a side edge of the first pane. The surface of the first pane with the functional coating is then bonded via a thermoplastic intermediate layer to a surface of a second pane.

A method is provided for producing a glass or glass ceramic article that includes: providing a sheet-like glass or glass ceramic substrate having two opposite faces, which in the visible spectral range from 380 nm to 780 nm exhibits light transmittance of at least 1% for visible light that passes from one face to the opposite face; providing an opaque coating on one face where the coating exhibits light transmittance of not more than 5% in the visible spectral range from 380 nm to 780 nm; and directing a pulsed laser beam onto the opaque coating and locally removing the coating by ablation down to the surface of the glass or glass ceramic article, repeatedly at different locations, thereby producing a pattern of a multitude of openings defining a perforated area in the opaque coating, so that the opaque coating becomes semi-transparent in the area.

The present application describes a method for laser scribing first and second transparent electrically conductive layers (14, 14′) deposited on respective opposing first and second surfaces (12, 13) of a transparent substrate (11), the method comprising: directing a first laser beam (21) through one or more lenses (22) to a focal spot on or closely adjacent to the first surface (12) of the substrate (11), such that the focusing laser beam (21) passes through the second electrically conductive layer (14′) and the second surface (13) of the substrate (11); initiating relative movement between the first laser beam (21) and the substrate (11) in two axes in a plane orthogonal to the axis of the first laser beam (21) to scribe a first pattern in the first electrically conductive layer (14); directing a second laser beam (21′) through one or more lenses (22′) to a focal spot on or closely adjacent to the second surface (13) of the substrate (11), such that the focusing laser beam (21′) passes through the first electrically conductive layer (14) and the first surface (12) of the substrate (11), initiating relative movement between the second laser beam (21′) and the substrate (11) in two axes in a plane orthogonal to the axis of the second laser beam (21′) to scribe a second pattern in the second electrically conductive layer (14′).

The present application describes a method for laser scribing first and second transparent electrically conductive layers (14, 14′) deposited on respective opposing first and second surfaces (12, 13) of a transparent substrate (11), the method comprising: directing a first laser beam (21) through one or more lenses (22) to a focal spot on or closely adjacent to the first surface (12) of the substrate (11), such that the focusing laser beam (21) passes through the second electrically conductive layer (14′) and the second surface (13) of the substrate (11); initiating relative movement between the first laser beam (21) and the substrate (11) in two axes in a plane orthogonal to the axis of the first laser beam (21) to scribe a first pattern in the first electrically conductive layer (14); directing a second laser beam (21′) through one or more lenses (22′) to a focal spot on or closely adjacent to the second surface (13) of the substrate (11), such that the focusing laser beam (21′) passes through the first electrically conductive layer (14) and the first surface (12) of the substrate (11), initiating relative movement between the second laser beam (21′) and the substrate (11) in two axes in a plane orthogonal to the axis of the second laser beam (21′) to scribe a second pattern in the second electrically conductive layer (14′).

A system for the treatment of a region of an object adjacent to a substrate. The system includes a source of an incident laser beam delivering a focused laser beam. The wavelength of the incident laser beam is greater than the sum of 500 nm and of the wavelength associated with the bandgap of the material forming the substrate and smaller than the sum of 2,500 nm and of this wavelength. The system includes an optical device associating a digital aperture greater than 0.3 and means for correcting the spherical aberrations appearing during the crossing of the substrate for a given thickness of the substrate and a given distance between the substrate and the optical device. The processing being performed on the region through the substrate, and including the physical, chemical, or physico-chemical modification or the ablation of said region.