A bonded body is formed to configured to join a ceramic member formed of a Si-based ceramic and a copper member formed of copper or a copper alloy, in which, in a joint layer formed between the ceramic member and the copper member, a crystalline active metal compound layer formed of a compound including an active metal is formed on the ceramic member side.

A bonding material having a first layer containing Sn as a main component thereof and a second layer containing a metal having a higher melting point than that of Sn as a main component thereof, wherein the first layer and the second layer are laminated on each other, and an amount of Sn in the first layer is larger than a stoichiometric amount of Sn that forms an intermetallic compound between the Sn and the metal.

The present invention consists in a method of welding a nickel strength lug with a bronze connecting pin and a brass contact ring in an accelerometer sensor, the strength lug being interleaved between the connecting pin and the contact ring, the welding being effected electrically with the strength lug pressed simultaneously against the connecting pin and the contact ring. Before welding, the strength lug undergoes deformation of its external surface at least on each of two portions of the surface respectively facing the connecting pin and the contact ring, the surface deformation creating on each of the portions asperities intended to come into local contact with the connecting pin and the contact ring, respectively.

Methods disclosed herein include using additive manufacturing to create a joint between a first metallic material and a second metallic material that is different from the first metallic material, wherein the porosity of the joint is less than about 0.1 percent by volume measured according to ASTM B-962. The additive manufacturing can be performed such that no intermetallic brittle phase forms between the first metallic material and the second metallic material.

A method of attaching a first metal object to a second metal object is presented. The first metal object and the second metal object are dissimilar materials. The first metal object comprises an upper surface and a lower surface. The method comprises: positioning the first metal object in intimate contact with the second metal object such that the second metal object is in contact with the lower surface of the first metal object; identifying at least one attachment location on the upper surface of the first metal object where the first metal object is in intimate contact with the second metal object; adding a powdered metal on the upper surface of the first metal object at the at least one attachment location; and firing a heat source at the powdered metal to melt the powdered metal and drive the melted powdered metal through the first metal object and into the second metal object.

A cladded article may include a first metallic layer, a clad layer, and a first solid-state welding interface region positioned between the clad layer and the first metallic layer. The clad layer may include a first clad layer region having a first clad layer thickness in a thickness direction of the clad layer and a second clad layer region having a second clad layer thickness in the thickness direction of the clad layer. The second clad layer thickness may be greater than the first clad layer thickness.

A solder alloy for joining a Cu pipe and/or a Fe pipe has an alloy composition comprising in mass %: Sb: 5.0% to 15.0%; Cu: 0.5% to 8.0%; Ni: 0.025% to 0.7%; and Co: 0.025% to 0.3%, with a balance being Sn. The alloy composition satisfies the relationship of 0.07Co/Ni6, where Co and Ni represent contents of Co and Ni in mass %, respectively.

A ceramic circuit substrate according to the present invention includes a ceramic substrate, a copper circuit made of a copper-based material bonded, via a bonding layer, to a surface of the ceramic, and a copper heat sink made of the copper-based material bonded, via a bonding layer, to the other surface of the ceramic. The bonding layers each include a brazing material component including two or more kinds of metals, such as Ag, and an active metal having a predetermined concentration. The bonding layers each include a brazing material layer including the brazing material component, and an active metal compound layer containing the active metal. A ratio of a bonding area of the active metal compound layer in a bonding area of each of the bonding layers is 88% or more.

A method produces at least one defined connecting layer between two components, wherein the first component is produced from a first metallic material and the second component is produced from a second metallic material and the first and/or second component has a coating of a third metallic material, the melting temperature of which is lower than the melting temperature of the first and second materials. In this case, the coating of at least one of the components is heated locally to a connecting temperature, which lies above the melting temperature of the third material and lies below the melting temperature of the first material and below the melting temperature of the second material, and is cooled down in order to form a defined connecting layer when the coating solidifies.

The present invention relates to an intermediate product for joining and coating by brazing comprising a base metal and a blend of boron and silicon, said base metal having a solidus temperature above 1040 C., and the intermediate product has at least partly a surface layer of the blend on the base metal, wherein the boron in the blend is selected from a boron source, and the silicon in the blend is selected from a silicon source, and wherein the blend comprises boron and silicon in a ratio of boron to silicon within a range from about 3:100 wt/wt to about 100:3 wt/wt. The present invention relates also to a stacked intermediate product, to an assembled intermediate product, to a method of brazing, to a brazed product, to a use of an intermediate product, to a pre-brazed product, to a blend and to paint.