Patent classifications
B23K35/007
Coating concept
The present invention relates to composition comprising a blend of at least one boron source and at least one silicon source, and the composition further comprises particles selected from particles having wear resistance properties, particles having surface enhancing properties, particles having catalytic properties or combinations thereof, wherein the blend comprises boron and silicon in a weight ratio boron to silicon within a range from about 3:100 wt:wt to about 100:3 wt:wt, wherein silicon and boron are present in the blend in at least 25 wt %, and wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the blend is a mechanical blend of particles in and the particles have an average particle size less than 250 m. The present invention relates further to a method for providing a coated product and a coated product obtained by the method.
Solder alloy and joint thereof
A silver electrode joint having a high joint strength obtained by actively minimizing the particle size of a silver-zinc intermetallic compound at the solidification point. A joint obtained by joining an article to be joined, the joint including silver at least as the surface layer thereof, using a solder alloy which comprises 2-9 wt % of zinc, 0.0001-0.1 wt % of manganese and the balance consisting of tin, the solder joint having a joint interface wherein the particle size of a silver-zinc intermetallic compound, which is formed by silver being the surface layer of the article to be joined and zinc in the solder alloy, is 5 m or less.
ENGINEERED MATERIALS FOR ELECTRONICS ASSEMBLY
A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.
CERAMIC CIRCUIT SUBSTRATE AND METHOD FOR PRODUCING CERAMIC CIRCUIT SUBSTRATE
A ceramic circuit substrate according to the present invention includes a ceramic substrate, a copper circuit made of a copper-based material bonded, via a bonding layer, to a surface of the ceramic, and a copper heat sink made of the copper-based material bonded, via a bonding layer, to the other surface of the ceramic. The bonding layers each include a brazing material component including two or more kinds of metals, such as Ag, and an active metal having a predetermined concentration. The bonding layers each include a brazing material layer including the brazing material component, and an active metal compound layer containing the active metal. A ratio of a bonding area of the active metal compound layer in a bonding area of each of the bonding layers is 88% or more.
Bonding sheet and bonded structure
A bonding sheet includes a copper foil and sinterable bonding films formed on both faces of the copper foil. The bonding films each contain copper particles and a solid reducing agent. The bonding sheet is used to bond to a target object to be bonded having at least one metal selected from gold, silver, copper, and nickel on a surface thereof. A bonded structure includes: a bonded object having at least one metal selected from gold, silver, copper, and nickel on a surface thereof; a copper foil; and a bonding layer including a sintered structure of copper particles; and the bonded object and the copper foil are electrically connected to each other via the bonding layer.
COMPOSITE MATERIAL
A composite material includes: a first member containing tungsten as a primary component; a second member containing copper as a primary component, the second member being joined to the first member; and a metal containing at least one metal selected from a group consisting of titanium, zirconium, and hafnium, the metal being present in the second member, wherein a concentration of the metal is more than 0 atomic % and less than or equal to 5.0 atomic % at a location of 5 ?m from a joining interface between the first member and the second member toward the second member side.
REPAIR METHOD AND REPAIR MATERIAL
A repair method that includes covering a damaged part of a member to be repaired with a repair material, and heating the repair material to a predetermined temperature to form an alloy layer. At least the surface of the member to be repaired is a first metal such as Cu. The repair material includes a second metal such as Sn. By the heating, the surface of the member to be repaired is integrally joined with a layer of an intermetallic compound and an alloy having a melting point higher than a melting point of either of the first metal or the second metal.
Method for producing a metal-ceramic substrate
The present invention relates to a method for producing a metal-ceramic substrate. The method has the following steps: providing a stack containing a ceramic body, a metal foil, and a solder material in contact with the ceramic body and the metal foil, wherein the solder material has: a metal having a melting point of at least 700? C., a metal having a melting point of less than 700? C., and an active metal; and heating the stack, wherein at least one of the following conditions is satisfied: the high temperature heating duration is no more than 60 min; the peak temperature heating duration is no more than 30 min; the heating duration is no more than 60 min.
Method and device for producing a component of a turbomachine
A method for producing a component of a turbomachine is disclosed. The method includes a) layer-by-layer deposition of a powder component material onto a component platform in a region of a buildup and joining zone, where the deposition takes place in accordance with layer information of the component to be produced; b) local layer-by-layer fusion or sintering of the powder component material by energy supplied in the region of the buildup and joining zone, where the buildup and joining zone is heated to a temperature just below a melting point of the powder component material; c) layer-by-layer lowering of the component platform by a predefined layer thickness; and d) repetition of steps a) to c) until the component is finished. A device for producing a component of a turbomachine is also disclosed.
Method for joining metal parts
A method for joining a first metal part (11) with a second metal part (12), the metal parts (11,12) having a solidus temperature above 1100 QC. The method comprises: applying a melting depressant composition (14) on a surface (15) of the first metal part (11), the melting depressant composition (14) comprising a melting depressant component that comprises at least 25 wt % boron and silicon for decreasing a melting temperature of the first metal part (11); bringing (202) the second metal part (12) into contact with the melting depressant composition (14) at a contact point (16) on said surface (15); heating the first and second metal parts (11,12) to a temperature above 1100 QC; and allowing a melted metal layer (210) of the first metal component (11) to solidify, such that a joint (25) is obtained at the contact point (16). The melting depressant composition and related products are also described.