Provided is a solder alloy that contains 0.01 mass % or more and 0.1 mass % or less of Fe, 0.005 mass % or more and less than 0.02 mass % of Co, 0.1 mass % or more and 4.5 mass % or less of Ag, 0.1 mass % or more and 0.8 mass % or less of Cu, and the balance being Sn.

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

A lead-free solder alloy includes 2.0% by mass or more and 4.0% by mass or less of Ag, 0.3% by mass or more and 0.7% by mass or less of Cu, 1.2% by mass or more and 2.0% by mass or less of Bi, 0.5% by mass or more and 2.1% by mass or less of In, 3.0% by mass or more and 4.0% by mass or less of Sb, 0.001% by mass or more and 0.05% by mass or less of Ni, 0.001% by mass or more and 0.01% by mass or less of Co, and the balance being Sn.

The disclosure describes techniques for joining a first component comprising a first metal or alloy and a second component comprising a second metal or alloy to each other. The techniques may include positioning the first and second component adjacent to each other to define a joint region between adjacent portions of the first component and the second component. The techniques also may include positioning a pre-sintered preform (PSP) braze material in the joint region, heating the PSP braze material to form a molten braze alloy, and cooling the molten braze alloy to join the first and second components. The PSP braze material may include a wide gap braze material.

A method for joining a first part formed of an aluminum material to a second part formed of a steel material by metal inert gas welding and cold metal transfer is provided. An aluminum filler material forms a fillet joint between the parts and provides a structure for automotive body applications, such an aluminum bumper extrusion joined to a steel crush box connection. The first part includes a notch for hiding the start and end of the joint. A transition plate formed of a mixture of aluminum material and steel material can be disposed between the first part and the second part to provide the notch. The second part can include a mechanical fastener further joining the parts together. In another embodiment, the second part includes a plurality of dimples and is welded to the first part along the dimples.

In one aspect, methods of making freestanding metal matrix composite articles and alloy articles are described. A method of making a freestanding composite article described herein comprises disposing over a surface of the temporary substrate a layered assembly comprising a layer of infiltration metal or alloy and a hard particle layer formed of a flexible sheet comprising organic binder and the hard particles. The layered assembly is heated to infiltrate the hard particle layer with metal or alloy providing a metal matrix composite, and the metal matrix composite is separated from the temporary substrate. Further, a method of making a freestanding alloy article described herein comprises disposing over the surface of a temporary substrate a flexible sheet comprising organic binder and powder alloy and heating the sheet to provide a sintered alloy article. The sintered alloy article is then separated from the temporary substrate.

A soldering material (1) for active soldering, in particular for active soldering of a metallization (3) to a carrier layer (2) comprising ceramics, wherein the soldering material comprises copper and is substantially silver-free.

A method for manufacturing a heat exchanger (1) includes joining an inner fin (3) to a hollow structure (20) formed from at least two clad plates (200a, 200b) by heating and brazing a filler metal layer (B). Each clad plate has a core layer (A) composed of an aluminum alloy that contains Mg: 0.40-1.0 mass %. The filler metal layer is composed of an aluminum alloy that contains Si: 4.0-13.0 mass %, and further contains Li: 0.0040-0.10 mass %, Be: 0.0040-0.10 mass %, and/or Bi: 0.01-0.30 mass %. The inner fin is composed of an aluminum alloy that contains Si: 0.30-0.70 mass % and Mg: 0.35-0.80 mass %. A flux (F) that contains cesium (Cs) is applied along a contact part (201), and the vicinity thereof, of the at least two clad plates prior to the heating. A heat exchanger (1) may be manufactured according to this method.

The present invention relates to a sealing lid for a package containing an optical element. For the sealing lid, a translucent material such as glass that can transmit light such as visible light is used. The present invention includes a lid main body made of the translucent material. The lid main body includes a joining region having a frame shape corresponding to an outer circumferential shape of the lid main body. A plurality of pieces of brazing material made of a eutectic alloy are fused on the joining region of the lid main body. An arrangement state of the brazing material includes aligning spherical pieces of brazing material continuously to form a frame shape along the joining region.

A Pb-free solder alloy contains 4-12 wt% of Zn, 0.5-4 wt% of Bi, 0.5-5 wt% of In, 0.005-0.5 wt% of P, 0.001-0.5 wt% of Zr and at least one selected from: 0-0.1 wt% of Y, 0-0.2 wt% of Ge, 0-0.05 wt% of Mg, 0-0.02 wt% of B, 0-0.05 wt% of Al, 0-0.2 wt% of Ni and 0-0.3 wt% of Ag. A balance of the Pb-free solder alloy is Sn.