With the increasing density of in-vehicle electronic circuits, not only conventional cracks at bonding interfaces such as between the substrate and the solder attachment site or a component and the solder attachment site but also novel cracking problems of cracks occurring in the Sn matrix in the interior of the bonded solder have appeared. To solve the above problem, a lead-free solder alloy with 1-4 mass % Ag, 0.6-0.8 mass % Cu, 1-5 mass % Sb, 0.01-0.2 mass % Ni and the remainder being Sn is used. A solder alloy, which not only can withstand harsh temperature cycling characteristics from low temperatures of −40° C. to high temperatures of 125° C. but can also withstand external forces that occur when riding up on a curb or colliding with a vehicle in front for long periods, and an in-vehicle electronic circuit device using the solder alloy can thereby be obtained.

Some embodiments relate to a semiconductor device package, which includes a substrate with a contact pad. A non-solder ball is coupled to the contact pad at a contact pad interface surface. A layer of solder is disposed over an outer surface of the non-solder ball, and has an inner surface and an outer surface which are generally concentric with the outer surface of the non-solder ball. An intermediate layer separates the non-solder ball and the layer of solder. The intermediate layer is distinct in composition from both the non-solder ball and the layer of solder. Sidewalls of the layer of solder are curved or sphere-like and terminate at a planar surface, which is disposed at a maximum height of the layer of solder as measured from the contact pad interface surface.

A method for repairing a component is provided, including the following steps: introducing a recess into the component, via which recess a damaged region in the component is removed; positioning a filler body in the recess; and fixedly, i.e. non-detachably, connecting the filler body to the component, wherein the filler body is provisionally secured to the component prior to establishing the fixed connection to the component, in that a securing element is placed over the filler body and the securing element is attached to the component, wherein the securing element is removed again after the establishing of the fixed connection between the filler body and the component.

Provided is a solder material having oxidation resistance at the time of melting solder or after melting it, as well as managing a thickness of oxide film at a fixed value or less before melting the solder. A Cu core ball 1A is provided with a Cu ball 2A for keeping a space between a semiconductor package and a printed circuit board and a solder layer 3A that covers the Cu ball 2A. The solder layer 3A is composed of Sn or a solder alloy whose main component is Sn. For the Cu core ball 1A, lightness is equal to or more than 65 in the L*a*b* color space and yellowness is equal to or less than 7.0 in the L*a*b* color space, and more preferably, the lightness is equal to or more than 70 and the yellowness thereof is equal to or less than 5.1.

A window glass structure according to one aspect of the present invention includes a window glass for a vehicle that has a surface provided with a conductive layer having a predetermined pattern, and a connection terminal that is soldered to the conductive layer. The connection terminal includes a first joining portion that is joined to the conductive layer by soldering using a lead-free solder, a first side plate that is linked to the first joining portion and extends in a direction of separation from the surface of the window glass, a second joining portion that is joined to the conductive layer by soldering using a lead-free solder, a second side plate that is linked to the second joining portion and extends in a direction of separation from the surface of the window glass, a bridge portion that extends so as to link the two side plates, and a terminal portion configured to be linked to the bridge portion so as to have a face that is oriented in a direction different from directions in which faces of the two side plates and the bridge portion are oriented, at a position separated from regions to which the first side plate and the second side plate are linked.

The present disclosure provides a method of forming a hermetically sealed enclosure that comprises a diamond material. The method comprises providing first and second enclosure components comprising the diamond material and having first and second recesses, respectively, at edge portions. At least one of the first and second enclosure components has a cavity. The enclosure components have respective contact surfaces at the first and second recesses and are shaped such that an outer channel is formed by the co-operation of the first and second recesses when the first and second enclosure components are contacted at the contact surfaces to form the enclosure. The method further comprises bonding a first type of material to at least surface portions of the first and second recesses of the first and second enclosure components, respectively. The method also comprises bonding a second type of material to the first type of material so that the second type of material covers at least portions of the first type of material. The second type of material is biocompatible and suitable for forming a hermetically sealed seal. In addition, the method comprises contacting the enclosure components to form the enclosure and bonding the second type of material of the first enclosure component to the second type of material of the second enclosure component so as to form a hermetically sealed seal in the outer channel.

An article, a component, and a method of making a component are provided. The article includes a pre-sintered preform having a contoured proximal face and a contoured distal face. The contoured proximal face is arranged and disposed to substantially mirror a contour of an end wall of a component and the contoured distal face is arranged and disposed to form an exterior surface including a modified surface characteristic. The component includes a first end wall, a second end wall, and an article secured to at least one of the first end wall and the second end wall, the article including a pre-sintered preform having a contoured proximal face and a contoured distal face. The contoured proximal face substantially mirrors a contour of at least one of the first end wall and the second end wall, and the contoured distal face is arranged and disposed to form an exterior surface thereover.

Nickel base superalloys, including in some embodiments 5% to 7% Fe, which were previously developed and used for their corrosion resistance, also possess favorable characteristics for use as a braze filler in repair or joining of superalloy substrates, such as those used to form turbine engine blades and vanes, heat exchangers, vessels, and piping. In particular, such corrosion-resistant nickel base superalloys have favorable characteristics for wide-gap brazing of gaps greater than one millimeter in superalloy substrates that preserves favorable material properties throughout the braze region in the substrate.

The disclosed method relates to manufacturing a heat exchanger which causes no brazing defects, and a heat exchanger manufactured by the method. The method relates to manufacturing a heat exchanger having an aluminum alloy tube defining a cooling-medium flowing passage and a copper alloy tube defining a water flowing passage, wherein a heat exchange is carried out between a cooling medium flowing through the cooling-medium flowing passage and water flowing through the water flowing passage. The aluminum alloy tube and the copper alloy tube are brazed to each other at a temperature of less than 548° C.

Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3≦[Ag]≦4.0, Bi satisfying 0≦[Bi]≦1.0, and Cu satisfying 0<[Cu]≦1.2, where contents (mass %) of Ag, Bi, Cu and In in the solder material are denoted by [Ag], [Bi], [Cu], and [In], respectively. The solder material includes In in a range of 6.0≦[In]≦6.8 when [Cu] falls within a range of 0<[Cu]<0.5, In in a range of 5.2+(6−(1.55×[Cu]+4.428))≦[In]≦6.8 when [Cu] falls within a range of 0.5≦[Cu]≦1.0, In in a range of 5.2≦[In]≦6.8 when [Cu] falls within a range of 1.0<[Cu]≦1.2. A balance includes only not less than 87 mass % of Sn.