An exposed resistive heating element is coupled to an electric power supply. The exposed resistive heating element is malleable such that it can be wrapped around a component to be heated. A controller is coupled to the power supply and the exposed resistive heating element. The controller is configured to regulate current exchanged between the exposed heating element and the electric power supply.

An arc welded joint and an arc welding method. The arc welded joint has a weld formed by arc welding of an overlap of at least two steel sheets. A slag-covered area ratio is 20% or less. A Vickers hardness of a weld metal and a Vickers hardness of softened portions of a weld heat affected zone in the weld satisfy a specified relationship.

An arc welded joint and an arc welding method. The arc welded joint has a weld formed by arc welding of an overlap of at least two steel sheets. A slag-covered area ratio is 20% or less. A Vickers hardness of a weld metal and a Vickers hardness of softened portions of a weld heat affected zone in the weld satisfy a specified relationship.

A method for weld repairing a surface of a base material, wherein the base material has spheroidal graphite cast iron, wherein firstly a partial surface is configured, in a further step a two-ply buffer layer is used by means of MIG welding with the welding additive NiFe, wherein in a further step a fill layer is applied to the buffer layer, wherein the MIG welding method is used in conjunction with NiFe-2 in accordance with EN ISO 107 as welding additive material.

A system for connecting electronic assemblies, in particular a soldering and/or sintering system, has a transport device for conveying the assemblies through the system, with a plurality of gas-tightly separable modules for connecting the assemblies to one another. At least one module is a soldering and/or sintering module and one module is a cooling module. Between the soldering/sintering and the cooling module, a further module is a soft cooling module for cooling between a process temperature of the soldering or sintering module and an intermediate temperature, in particular below a solder solidification temperature. In a soldering or sintering module in a gas-tightly sealable process chamber, in particular in the soft cooling module, at least one heat source is contactable with the assemblies for heating the assemblies and at least one cold trap is arranged, having in operation a surface temperature which is lower than a heat source operating temperature.

A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be on a non-diffusable type, such as aluminum nitride, alumina, beryllium oxide, and zirconia, and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be on a non-diffusable type, such as aluminum nitride, alumina, beryllium oxide, and zirconia, and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

The disclosed technology generally relates to consumable electrode wires and more particularly to consumable electrode wires having a core-shell structure, where the core comprises aluminum. In one aspect, a welding wire comprises a sheath having a steel composition and a core surrounded by the sheath. The core comprises aluminum (Al) at a concentration between about 3 weight % and about 20 weight % on the basis of the total weight of the welding wire, where Al is in an elemental form or is alloyed with a different metal element. The disclosed technology also relates to welding methods and systems adapted for using the aluminum-comprising electrode wires.

The invention relates to a ternary gaseous mixture formed from argon, helium and oxygen, characterized in that it is formed from between 19.5 and 20.5% of helium, between 2.7 and 3.3% of Oi, and argon for the remainder (volume %), and to the use thereof as gaseous protection in a method of electric arc welding of at least one steel part to carbon, using a fusible filler wire. Preferably, the welded parts overlap or cover each other and the rotary arc welding takes place where the parts overlap.

The present disclosure provides a method for bonding an electronic component and a method for manufacturing a bonded body, which are capable of sintering a silver paste at a comparatively low temperature.

Disclosed is a method for bonding an electronic component using a silver paste containing silver particles, the method including: applying a silver paste containing silver particles on a surface of a substrate and setting electronic components on the silver paste applied, heating in a reducing atmosphere at a temperature of lower than 300 C., and after heating in the reducing atmosphere, heating in an oxidizing atmosphere at a temperature of 300 C. or lower.