A transport unit for transporting printed circuit boards along a direction of transport within at least one zone of a soldering system, in particular a reflow soldering system, characterized in that a base part is provided with an output shaft that can be driven, and with at least two output wheels which are rotatably coupled to the output shaft, in that at least two drive parts which can be releasably fastened on and removed from the base part are each provided with a drive wheel in such a manner that the drive parts have drive rollers which are rotatably coupled to the drive wheel, and which act on the printed circuit board to transport the printed circuit board through the zone, and in that, when the drive parts are fastened to the base part, each of the output wheels is in engagement with the associated drive wheel.

A reflected beam detection value obtained by detecting a reflected beam of a visible beam generated on a sheet metal or a scattered beam detection value obtained by detecting a scattered beam from an optical component is stored in a storage unit, the reflected beam or the scattered beam being detected at a time when the sheet metal is cut by irradiating the sheet metal with a laser beam under a predetermined processing condition. The reflected beam detection value or the scattered beam detection value stored in the storage unit is registered as a reference value associated with the predetermined processing condition.

Multi-axis alignment tools are described. The tools are usable to arrange workpieces across a variety of different axes and orientations and to ensure consistent and durable alignment of various workpieces while providing access for working thereon, which is not possible using conventional tools.

A system for locating a first component with respect to a second component. The system includes a bracket and a coupling member. The bracket defines a base wall and a side wall. The side wall extends from the base wall and defines an end remote to the base wall. The side wall defines a thickness and a length spanning from the base wall to the end. The coupling member is fastened to the base wall, and is configured to couple the base wall with the first component. The side wall is configured to be brought into contact with the second component to space and locate the second component with respect to the first component by at least one of the thickness defined by the side wall or at least a portion of the length defined by the side wall.

Disclosed is a warpage suppressing reflow oven, which comprises a reflow oven body, where a perforated steel plate circulating device comprising a perforated steel plate is disposed at a reflow-oven inner oven. A plurality of downdraft modules is arranged in the perforated steel plate, and the downdraft acting forces thereof face the upper panel. More than one air extractor is communicated with the plurality of downdraft modules via a plurality of pipelines. Under actuation of the air extractors, the downdraft modules generate downdraft acting forces to the bottom surfaces of the products, so that the products are flatly attached to the universal perforated carriers without warpage in a heat soldering process. Thereby, more uniform heating of the products and better contact of solder joints and effectively improving the yield of reflow soldering operations are achieved.

Disclosed is a bridge and body embodiment used in laser cutting machines. The embodiment has two bodies located facing each other and extending along at least a first guide component on an inner surface longitudinally, a bridge moving back and forth on the first guide component by at least one second guide component connected in between the bodies in perpendicular form and connected onto both side surfaces, a first driving component located on both side surface of the bridge or the inner surface of the body providing moving of the bridge, and a second driving component located on the body inner surface and providing movement of the first driving component on the inner surface of the body.

A fixture assembly for supporting a plurality of blanks during a welding operation. The fixture assembly includes a frame. A plurality of electromagnets are positioned on the frame for supporting the blanks and for drawing the blanks toward the electromagnets to secure the blanks into a desired position. A plurality of intensifiers are moveably connected to the frame for selectively overlying the top face of one of the electromagnets for clamping the blank against the electromagnet to intensify a magnetic force provided by the electromagnet. A plurality of electromagnet adjusters are each coupled with the frame and with at least one of the electromagnets for moving the electromagnets relative to the frame. A plurality of adjusting pins are each connected to the frame and moveable relative to the frame for adjusting a position of the blanks.

A method for laser cutting a workpiece includes the steps of guiding a laser beam over the workpiece in a cutting direction so as to produce a cutting kerf with two cutting flanks and melting material on the workpiece at a cutting front that extends between the cutting flanks and adjoins at least one of the cutting flanks at an angle. The laser beam has a non-circular cross section and, at a front of the laser beam in the cutting direction, a continuous cutting beam contour corresponding to the cutting front.

A processing device for processing opposing edges of a flexible sheet body is provided, including: a base; a first suction mechanism, arranged on the base and extending along a first direction, including first suction openings; at least one second suction mechanism, arranged on the base and extending in parallel with the first suction mechanism, including second suction openings, the at least one second suction mechanism and the first suction mechanism being relatively movable; a support platform, being adjustable and located between the first suction mechanism and the at least one second suction mechanism; at least one rail mechanism, arranged on the base; at least one gantry mechanism, movably arranged on the at least one rail mechanism; and at least two cutting mechanisms, arranged on the at least one gantry mechanism, at least one of the at least two cutting mechanisms being movable in a second direction.

A substrate processing apparatus includes a chuck table including a mounting table having a mounting surface on which a substrate is mounted, wherein the mounting surface is a curved surface; and a laser supply head configured to irradiate the substrate attached to the mounting table with a laser beam.