Patent classifications
B23K37/0408
WELDING OF STEEL BLANKS
Method for joining a first and a second steel blanks, at least one of the blanks comprising aluminium. The method comprises providing a support being made of a magnetic material for each blank, the supports being arranged distanced apart by a central space; providing a coil winding around one support, arranging the first blank on one support and the second blank on the other support, such that a butt end of the first blank that is facing the second blank is brought into contact with a butt end of the second blank that is facing the first blank defining a contacting area that closes a path for magnetic flux. The method further comprises applying a laser beam onto the contacting area, while applying an alternating current to the coil winding, wherein an alternating magnetic field is created across the contacting area in a direction substantially in-line with the blanks.
Fabrication layout device and method
Techniques and devices are disclosed for fabrication layout device. The device includes a table with a work surface. The work surface being a continuous surface and configured to support a plurality of railing pieces for fabrication of a railing assembly. The device further includes a beam located above the work surface. The beam is operatively coupled to the table, such that the beam moves relative to the work surface in a first direction. Attached to the beam is an ink dispenser. The ink dispenser is configured to move along the beam in a second direction different from the first direction. The ink dispenser is further configured to dispense ink onto the work surface of the table in the form of a pattern of the railing assembly. Railing pieces are positioned on the pattern so that they can be assembled to one another.
System and method for plasma cutting sheet metal in an automated coil-line machine
A fully automated plasma sheet metal cutter that can be integrated into a HVAC coil-line and which increases the precision of cutting, decreases the time it takes to cut a particular component sheet metal part, and offers flexibility in cutting different sized and shaped holes or openings. Further, since the system is fully automated, it eliminates the error or cost attributed to a portion of the cutting process that heretofore has been associated with a manual laborer.
CONTROL DEVICE AND CONTROL METHOD FOR REDUCING AND HOMOGENIZING WELDING RESIDUAL STRESS BY ACOUSTIC WAVE
A control device for reducing and homogenizing welding residual stress by acoustic waves, comprising: a fixing tool having two rows of through holes; a plurality of ultrasonic transducers each having a body and a conical horn transmitting portion at a lower end of the body, wherein lower ends of the horn transmitting portions are fixedly connected with flanges, the horn transmitting portions of the ultrasonic transducers extend into respective through holes of the fixing tool to be in contact with welded parts below the fixing tool, the flanges are fixed to the fixing tool by bolts, and the two rows of through holes are arranged both sides of a welding seam of the welded parts; and a driving device for driving the ultrasonic transducers to operate. A corresponding control method is also provided. The control device can be used to control residual stress at the welding seam of steels.
WORKTABLE FOR LASER PROCESSING
A worktable for laser processing includes a lower plate, internal blocks, and external blocks. The lower plate includes a first area, a second area surrounding the first area, and a third area surrounding the second area. The internal blocks are disposed on the lower plate in the first area and the external blocks are disposed on the lower plate in the third area. The external blocks surround the internal blocks.
SINTERING TOOL FOR THE LOWER DIE OF A SINTERING DEVICE
Tool (10) for the lower die of a sintering device, the tool (10) having a rest (20) for an electronic subassembly (30) comprising a circuit carrier, to be sintered, where the rest (20) is formed from a material with a coefficient of linear expansion that is close to the coefficient of expansion of the circuit carrier of the electronic subassembly (30).
METHOD FOR BONDING SUBSTRATES TOGETHER, AND SUBSTRATE BONDING DEVICE
A production of voids between substrates is prevented when the substrates are bonded together, and the substrates are bonded together at a high positional precision while suppressing a strain. A method for bonding a first substrate and a second substrate includes a step of performing hydrophilization treatment to cause water or an OH containing substance to adhere to bonding surface of the first substrate and the bonding surface of the second substrate, a step of disposing the first substrate and the second substrate with the respective bonding surfaces facing each other, and bowing the first substrate in such a way that a central portion of the bonding surface protrudes toward the second substrate side relative to an outer circumferential portion of the bonding surface, a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate at the respective central portions, and a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate across the entirety of the bonding surfaces, decreasing a distance between the outer circumferential portion of the first substrate and an outer circumferential portion of the second substrate with the respective central portions abutting each other at a pressure that maintains a non-bonded condition.
SOLDERED PRODUCT MANUFACTURING DEVICE AND METHOD FOR MANUFACTURING SOLDERED PRODUCT
A soldered product manufacturing device 1 includes a stage 13 on which a substrate W is placed, solder being arranged on the substrate W; a cover 16 configured to cover at least an upper part of the substrate W placed on the stage 13 at a predetermined distance therefrom; a chamber 11 configured to house the stage 13 and the cover 16; a heater 15 configured to heat the substrate W on the stage 13; and a reducing gas supply device 19 configured to supply a reducing gas F. A method for manufacturing a soldered product includes, by using the soldered product manufacturing device 1, placing the substrate W on the stage 13; covering the substrate W placed on the stage 13 with the cover 16; heating the substrate W; and supplying the reducing gas F into the chamber 11.
WELDING APPARATUS AND METHOD
Provided are a welding apparatus and a method, including a welding torch, a wire nozzle, a support stand that supports the welding torch and the wire nozzle with a predetermined distance therebetween, and a first support mechanism that supports the support stand so that the support stand is rotatable around a first support axis that is along a direction in which the welding torch and the wire nozzle are arranged.
REACTION PLATE HAVING A LASER TREATED SURFACE, CLUTCH ASSEMBLY INCLUDING A LASER TREATED REACTION PLATE, AND METHOD OF LASER TREATING A REACTION PLATE
A reaction plate for a clutch including an annular body, the annular body including an inner circumferential edge, an outer circumferential edge, a first surface between the inner and outer circumferential edges and facing a first axial direction and a second surface between the inner and outer circumferential surfaces and facing a second axial direction, the second surface including recesses covering at least 50 percent of the second surface. A clutch assembly including a friction plate, the friction plate having a first axially-facing surface including a friction material, a reaction plate, the reaction plate having a second axially-facing surface including recesses covering at least 50 percent of the second axially-facing surface and an actuation means arranged to displace the friction plate or the reaction plate such that the first and second axially-facing surfaces frictionally engage. A method of fabricating a reaction plate for a clutch.