A bonding apparatus provided with a gas supplying unit for causing an inert gas to be sprayed from a spray aperture provided adjacent to a holding section of the bonding head. The spray aperture is provided so as to surround the holding section of the bonding head, in which a portion of the slits is a wide slit set to a higher jet flow rate of the inert gas than narrow slits of another portion, and the inert gas sprayed from the wide slit and the narrow slits forms an air curtain that surrounds the bonding portion between the semiconductor chip and the substrate. The inert gas sprayed from the wide slit forms a flow that passes between the semiconductor chip and the substrate.

A laser processing apparatus includes a support part, a light source, a spatial light modulator, a converging part, and a controller. The controller controls the spatial light modulator so that laser light is branched into a plurality of rays of processing light including 0th-order light and a plurality of converging points for the plurality of rays of processing light are located at positions different from each other in a Z direction and an X direction, and controls at least one of the support part and the converging part so that the X direction coincides with an extension direction of a line and the plurality of converging points move relatively along the line. The controller controls the spatial light modulator so that a converging point of the 0th-order light is located one side with respect to a converging point of non-modulated light of the laser light, in a Y direction.

A method of manufacturing a thinned wafer by separating a residual wafer from the thinned wafer, the method including: a weak layer forming step of forming a planar weak layer WL along one surface WFA of a semiconductor wafer WF to divide the semiconductor wafer WF into a thinned wafer WF1 and a residual wafer WF2 with the weak layer WL as a boundary; and a separating step of supporting at least one of a thinned wafer WF1 side and a residual wafer WF2 side of the semiconductor wafer WF and separating the thinned wafer WF1 and the residual wafer WF2 from each other, wherein the separation of the thinned wafer WF1 and the residual wafer WF2 gradually progresses from one end WFF in an outer edge of the semiconductor wafer WF toward the other end WFR in the outer edge of the semiconductor wafer WF.

A substrate includes a metal component on a surface. A polymeric layer is deposited on the surface using molecular layer deposition. The polymeric layer includes a metalcone and has a thickness from 1 nm to 20 nm. The polymeric layer is stable at room temperature, but will undergo a structural change at high temperatures. The polymeric layer can be annealed to cause a structural change, which can occur during soldering.

An integrated device package is disclosed. The integrated device package can include a substrate that has a first side and a second side, an electronic component that is mounted on the first side or the second side of the substrate, a molding material that is disposed at least on the first side of the substrate, and an conductive material that is disposed on the first side of the substrate and extending through the molding material. The molding material has an exterior surface facing away from the substrate. The exterior surface of the molding material includes laser grooves indicative of laser lapping.

A method for transferring an electronic device includes steps as follows. A flexible carrier is provided and has a surface with a plurality of electronic devices disposed thereon. A target substrate is provided corresponding to the surface of the flexible carrier. A pin is provided, and a pin end thereof presses on another surface of the flexible carrier without the electronic devices disposed thereon, so that the flexible carrier is deformed, causing at least one of the electronic devices to move toward the target substrate and to be in contact with the target substrate. A beam is provided to transmit at least a portion of the pin and emitted from the pin end to melt a solder. The electronic device is fixed on the target substrate by soldering. The pin is moved to restore the flexible carrier to its original shape, allowing the electronic device fixed by soldering to separate from the carrier.

An apparatus for manufacturing a display device and a method for manufacturing a display device are provided. The apparatus includes a stage; a laser module disposed above the stage and configured to output a laser beam; a scanner configured to receive the laser beam output from the laser module and irradiate the laser beam onto the stage; and a controller configured to control the laser module to irradiate the laser beam to a processing position while moving both the scanner and the stage in a first direction according to the processing position and a shape of a processing pattern.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

A laser processing device includes an irradiation unit configured to irradiate an object with laser light, an image capturing part configured to capture an image of the object with light having transparency to the object, a display unit configured to display information, and a control unit configured to control at least the irradiation unit, the image capturing part, and the display unit. The control unit performs a first process of irradiating the object with the laser light by control of the irradiation unit to form a modified spot and a fracture extending from the modified spot in the object so as not to reach an outer surface of the object, a second process of, after the first process, capturing an image of the object by control of the image capturing part and acquiring information indicating a formation state of the modified spot and/or the fracture.

A manufacturing method for a printed circuit board includes: passing a first laser beam output from a laser output device through a first aperture so as to define an outer diameter of the first laser beam, positioning the first laser beam by an optical axis positioning device including a galvano device and an fθ lens, and irradiating the printed circuit board with the first laser beam such that a through-hole is formed in a copper layer; and passing a second laser beam output from the laser output device through a second aperture so as to define an outer diameter of the second laser beam whereby a diameter of the second aperture is smaller than a diameter of the first aperture, positioning the second laser beam by the optical axis positioning device, and irradiating the printed circuit board with the second laser beam such that an insulating layer is processed.