A screen printer that measures a tension of a mask in a machine, including a mask holding device configured to hold a mask; a board device configured to position a board from below with respect to the mask held by the mask holding device; a squeegee device configured to apply and spread a cream solder on an upper surface of the mask; a mask pressing device configured to press the mask at a set pressure by a pusher which is installed on an upper travelling device or a lower travelling device with respect to the mask; a mask measurement device, installed on the upper travelling device or the lower travelling device to be opposed to the pusher, which is configured to measure a height of the mask; and a tension measurement device configured to calculate a tension of the mask based on a measured value of the mask measurement device.

A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.

A method of determining a cutter height on a wedge bonding machine is provided. The method includes the steps of: (a) lowering a wedge bonding tool toward a surface on the wedge bonding machine; (b) determining a first height measurement when the wedge bonding tool contacts the surface; (c) lowering a cutter of the wedge bonding machine, relative to the wedge bonding tool; (d) determining a second height measurement when the cutter contacts the surface; and (e) determining a cutter height using the first height measurement and the second height measurement.

An electronic-component carrier board includes carrier plates formed in a stack, and insulating layers each disposed between two adjacent ones of the carrier plates. Multiple conductive pins extend through the insulating layers and the carrier plates. Multiple conductive wires equal in length and width are provided. Each conductive wire is connected to one of the conductive pins, covered by one of the insulating layers, disposed between two adjacent ones of the carrier plates, and extends outwardly from the stack of the carrier plates. A wiring method for the electronic-component carrier board is also disclosed.

A paste dispensing transfer system of a stencil printer is configured to print an assembly material on an electronic substrate. The transfer system includes a paste cartridge mechanism coupled to a print head assembly of the stencil printer, and a rotary indexing mechanism coupled to a frame of the stencil printer. The paste dispensing transfer system is configured to transfer a used paste cartridge from the print head assembly to the rotary indexing mechanism supported by the frame and to transfer a new paste cartridge from the rotary indexing mechanism to the print head assembly.

A reflow soldering system comprising one or a plurality of individually heatable soldering process zones. The reflow soldering system is configured to supply heat to a workpiece selectively through condensation or through convection or as a combination of convection and condensation.

An LED tube lamp comprises a glass lamp tube having a main body, two end caps coupled to a respective end of the tube, an LED light strip adhered to inner circumferential surface of the tube by first adhesive, a plurality of LED light sources mounted on a mounting region, a power supply module having a circuit board and a plurality of electronic components mounted on the circuit board, a diffusion layer covering on outer surface or inner surface of the tube, and a protective layer being disposed on surface of the strip and having a plurality of first openings for disposing the plurality of LED light sources. The strip comprises the mounting region and connecting region at an end of the strip. The circuit board is substantially parallel with axial direction of the tube, electrically connects to the connecting region, and stacks with a portion of the connecting region.

Some implementations of the disclosure are directed to low melting temperature (e.g., liquidus temperature below 210° C.) SnIn solder alloys. A SnIn solder alloy may consist of: 8 to 20 wt % In; greater than 0 wt % to 4 wt % Ag; optionally, one or more of greater than 0 wt % to 5 wt % Sb, greater than 0 wt % to 3 wt % Cu, greater than 0 wt % to 2.5 wt % Zn, greater than 0 wt % to 1.5 wt % Ni, greater than 0 wt % to 1.5 wt % Co, greater than 0 wt % to 1.5 wt % Ge, greater than 0 wt % to 1.5 wt % P, and greater than 0 wt % to 1.5 wt % Mn; and a remainder of Sn.

A transport unit for transporting printed circuit boards along a direction of transport within at least one zone of a soldering system, in particular a reflow soldering system, characterized in that a base part is provided with an output shaft that can be driven, and with at least two output wheels which are rotatably coupled to the output shaft, in that at least two drive parts which can be releasably fastened on and removed from the base part are each provided with a drive wheel in such a manner that the drive parts have drive rollers which are rotatably coupled to the drive wheel, and which act on the printed circuit board to transport the printed circuit board through the zone, and in that, when the drive parts are fastened to the base part, each of the output wheels is in engagement with the associated drive wheel.

A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.