A method for connecting two components with the aid of a laser weld seam. The two components are situated one above the other in a joining area. The first component is pressed in the direction of the second component with the aid of a clamping device. A laser beam impacts the first component on the side facing away from the second component and at least indirectly fusing material of the two components.

The present disclosure relates to a battery module comprising: a plurality of battery cells each including an electrode tab; and a bus bar connected to the electrode tab to electrically connect the plurality of battery cells to each other. The bus bar includes a plate having a plurality of holes. The electrode tab of each of the battery cells is inserted into at least a part of the plurality of holes of the plate. The electrode tab inserted into the hole and the plate are coupled to each other by a welding bead, and the welding bead has a width and a height defined by Equations 1 and 2, respectively.

Provided are a laser control structure and a laser bonding method using the same, and more particularly, a laser bonding method including: forming bonding portions on a substrate; providing a bonding object onto the bonding portions; providing a laser control structure onto the bonding object or the substrate; irradiating a laser toward the bonding object and the bonding portions; controlling quantity of laser light absorbed through the laser control structure; using the controlled quantity of laser light to heat the bonding portions and the bonding object to a bonding temperature; and bonding the bonding portions and the bonding object, wherein the laser control structure includes: a first substrate including a first region and a second region; a first thin film laminate on the first region; and a second thin film laminate on the second region, wherein: the first thin film laminate includes at least one first thin film layer and at least one second thin film layer, which are laminated on the first region; the second thin film laminate includes at least one third thin film layer and at least one fourth thin film layer, which are laminated on the second region; reflectance or absorptivity of the first thin film laminate with respect to laser is different from reflectance or absorptivity of the second thin film laminate; and the bonding temperature varies according to the quantity of laser light.

A welding method for welding grouped conductor ends of a component for an electrical machine by means of a welding device. In the method, a relative position of a first conductor end and a second conductor end of grouped conductor ends and then a first size parameter of a molten pool formed during welding are detected. Subsequently, a second size parameter of the molten pool formed during welding is detected. In a further method step, a value of the molten pool is determined from the first size parameter, the second size parameter and the relative position. Finally, a welding energy input is controlled depending on the determined value of the molten pool.

A secondary-battery electrode manufacturing method that allows a secondary-battery electrode including a neat linear cut portion to be stably manufactured at a high speed is provided. A method of manufacturing a secondary-battery electrode (10), which is an example of an embodiment, comprises a first step of forming an active material layer (22) on at least one surface of a long core body (21). The method of manufacturing the secondary-battery electrode (10), which is an example of the embodiment also comprises a second step of cutting an electrode precursor (20) into a predetermined shape by using a continuous wave laser, the electrode precursor (20) being the long core body (21) having the active material layer (22) formed thereon.

Provided is a laser welding apparatus configured to weld an electrode lead of at least one secondary battery of a battery module and a main bus bar configured to electrically connect a plurality of secondary batteries to each other. The laser welding apparatus includes: a laser beam emitting unit including a laser emitting element to irradiate a laser beam to the electrode lead and the main bus bar; a pressing jig including a pressing bar configured to move in a left-and-right direction such that the electrode lead is adhered to the main bus bar; and a blocking block movable to block the laser beam generated in the laser beam emitting unit from reaching the at least one secondary battery or movable to allow the generated laser beam to pass therethrough, according to a position of the pressing bar moved in the left-and-right direction.

A method for manufacturing a continuous casting mold in which cracking and spalling are less likely to occur in a filling laminate. The method includes filling a plurality of concave portions formed on an inner surface of a copper-made mold copper plate or a copper alloy-made mold copper plate used for continuously casting steel at least in a region including a meniscus position of molten steel in a casting process with a metal having a thermal conductivity different from that of the mold copper plate.

A light source module that emits a combined laser beam, and includes: a plurality of semiconductor laser elements; and a control circuit that controls power of a laser beam emitted by each of the semiconductor laser elements. The semiconductor laser elements include: a first element group that emits a first laser beam; and a second element group that emits a second laser beam. The combined laser beam includes at least one of the first laser beam or the second laser beam. The control circuit maintains an average combined-beam wavelength that is an average wavelength of the combined laser beam constant for a change in power of the combined laser beam. When the power of the first laser beam and the power of the second laser beam are equal to each other, an average wavelength of the first laser beam is longer than an average wavelength of the second laser beam.

A method for forming a bonding structure is provided, including providing a first metal, wherein the first metal has a first absolute melting point. The method includes forming a silver nano-twinned layer on the first metal. The silver nano-twinned layer includes parallel-arranged twin boundaries. The parallel-arranged twin boundaries include 90% or more [111] crystal orientation. The method includes oppositely bonding the silver nano-twinned layer to a second metal. The second metal has a second absolute melting point. The bonding of the silver nano-twinned layer and the second metal is performed at a temperature of 300° C. to half of the first absolute melting point or 300° C. to half of the second absolute melting point.

A method for forming a silicon carbide module integrated structure includes a heat sink and a silicon carbide module, which is fixedly connected with the heat sink. The solder paste is arranged between the heat sink and the silicon carbide module, and the heat sink and the silicon carbide module are hot pressed through a welding process to weld the silicon carbide module and the heat sink together.