A method for the magnetic pulse soldering of an item having a stack of sheets consisting of a metal material. At least one hole through a thickness of the stack is formed. The first and second plates, both consisting of a metal material, are arranged on either side of the stack. A covering area covering at least one through-hole is formed. The plates-stack assembly is positioned opposite an active part of a coil such that a working area of the covering area faces the active part of the coil and the working area covering at least one hole. The working area is subjected to a magnetic field until the assembly is joined. While the working area is subjected to the magnetic field, pressure is exerted on the first plate, in the region of at least one hole, pressing the first plate against the second plate.

Provided is a solder composition including a flux, a solder alloy, and a silicone oil. The solder composition can have a kinematic viscosity at 25° C. of 5000 mm.sup.2/s or more and 200,000 mm.sup.2/s or less. The silicone oil can be at least one member selected from the group consisting of dimethyl silicone oil, methylphenyl silicone oil, methylhydrogen silicone oil, reactive silicone oil, and non-reactive silicone oil.

A method is provided for manufacturing a mold for injection molding, especially for injection molding of optical components of automotive lighting devices. The method includes at least the following steps: providing a mold body, laser milling a pattern into a surface of the mold body, and coating the surface of the mold body by electroless nickel plating.

A method of joining a first and a second object, each object having a substantially flat surface. The method includes the steps of: placing the objects with their surfaces in a contacting relationship along an interface, with their surfaces substantially parallel, the interface having a peripheral edge, irradiating a laser beam with a focal point onto the peripheral edge in the direction of the interface while the plates are in a contacting relationship, and moving the focal point of the laser beam along the interface in a direction transversely to the edge, to a position at a distance from the edge.

Provided is a semiconductor module including: a layered substrate on which a semiconductor chip is provided; and a connection terminal including a connection portion connected to the layered substrate, wherein the connection portion includes at least one ultrasonic connection section, and at least one laser-welded section, at least a portion of which is provided at a location other than a location at which the ultrasonic connection section is provided. The at least one ultrasonic connection section may be provided to be closer to the leading end of the connection portion than the at least one laser-welded section is.

A method for producing an overlap composite material from sheet metal is described, wherein a first sheet of a first metal and a second sheet of a second metal, which has a lower strength than the first metal, are positioned one above another in an overlapping manner in an edge region, and are then joined by rolling. The first sheet has a wedge-shaped edge in cross-section. The second sheet is to be positioned with its edge on a side surface of the first sheet formed by the wedge-shaped edge. The side surface formed by the wedge-shaped edge of the first sheet has a greater width than the side surface of the edge of the second sheet positioned on the said side surface of the first sheet, and, after positioning, the sheets are joined by rolling.

Physical vapor deposition target assemblies and methods of manufacturing such target assemblies are disclosed. An exemplary target assembly comprises a flow pattern including a plurality of arcs and bends fluidly connected to an inlet end and an outlet end.

A laser welding method according to this disclosure is a laser welding method for welding first and second coils (members) to each other by applying a laser beam to the first and second coils in a state where the first and second coils are brought into contact with each other. The laser welding method includes: a first step of forming a weld pool by applying a laser beam to the first coil; and a second step of continuing the application of the laser beam to the first coil until the width of a bridge formed between the first and second coils becomes wider than the width of the laser beam, the bridge being formed such that the weld pool is attached to the second coil by growing.

Embodiments of the present disclosure generally relate to flexible substrate fabrication. In particular, embodiments described herein relate to methods for flexible substrate fabrication which can be used to improve the life of lithium-ion batteries. In one or more embodiments, a method of fabricating alloy anodes includes forming an alloy anode using a planar flow melt spinning process including solidifying a molten material over a quenching surface of a rotating casting drum and performing a pre-lithiation surface treatment on the alloy anode.

Provided is a joining method that can prevent a plastic flowing material from flowing out from a butt section and that can reduce the thickness and weight of metal members. The joining method is for joining a first metal member and a second metal member by using a rotary tool comprising a stirring pin, and is characterized in that: the stirring pin comprises a flat surface perpendicular to the rotation axis of the rotary tool and comprises a protruding section protruding from the flat face; and in a friction stirring step, the flat surface is brought into contact with the first metal member and the second metal member, and a front end face of the protruding section is inserted deeper than an upper overlapping section to join an upper front butt section and the upper overlapping section.