Markings for electronic devices are disclosed. Markings are formed through a laser-based process which transforms a colorant in a multilayer structure disposed along an interior surface of a cover. The transformed colorant defines a marking visible along an external surface of the electronic device.

A method of laser welding a workpiece stack-up that includes two or more overlapping metal workpieces is disclosed. The disclosed method includes directing a laser beam at a top surface of the workpiece stack-up to create a molten metal weld pool and, optionally, a keyhole, and further gyrating the laser beam to move a focal point of the laser beam along a helical path having a central helix axis oriented transverse to the top and bottom surfaces of the workpiece stack-up. The gyration of the laser beam may even be practiced to move the focal point of the laser beam along a plurality of helical paths so as to alternately convey the focal point back-and-forth in a first overall axial direction and a second overall axial direction while advancing the laser beam relative to the top surface of the workpiece stack-up along a beam travel pattern.

Melting energy exemplified by an arc (24) is delivered to a metal alloy material (22, 23), forming a melt pool (26). A metal oxide material (34) is delivered (33) to the melt pool and dispersed therein. The melting energy and oxide deliveries are controlled (44) to melt the alloy material, but not to melt at least most of the metal oxide material. The deliveries may be controlled so that the melting energy does not intercept the metal oxide delivery. The melting energy may be controlled to create a temperature of the melt pool that does not reach the melting point of the metal oxide. Deliveries of the melting energy and the oxide may alternate so they do not overlap in time. A cold metal transfer apparatus (22) and process (18, 19, 20) may be used for example in combination with an oxide particle pulse delivery device (42, 46).

A structure and a method of creating the structure in which relatively thin pieces of non-weldable aluminum alloy or other non-weldable material are welded together. First layers of a weldable material, such as a weldable aluminum alloy or other weldable material, having a total thickness of between 0.01 and 0.30 inches, are built up on a surface of the first piece using an ultrasonic or other solid state joining technique, and second layers of the weldable material having a similar total thickness are built up on a surface of the second piece using the same technique. The first piece is then welded to the second piece at the first and second layers of weldable material using a fusion welding technique. The resulting structure may be part of an aircraft, landcraft, watercraft, or spacecraft type of vehicle or may be used in other high-performance applications.

A clad metal composite produced according to a method for edge-to-edge cladding of two or more different metals (such as aluminum and copper). The metals are joined next to each other to form an edge-to-edge or side-by-side clad bimetal. In one embodiment, nine metal strips are used to create the desired clad metal composite. The design includes strips of metal that have industry standard cut edges (such as, slit-cut edges). In one embodiment, the clad metal composite includes multiple layers of metals positioned edge-to-edge. In one embodiment, the method of making an edge-to-edge composite includes providing multiple layers of metal made of separate strips, aligning the strips in the multiple layers with one another so that edges of the strips of the multiple layers do not align with one another, and then bonding the layers and strips to one another.

In the present invention, while a welding current is applied with respect to a laminate body comprising thick metal plates and thin metal plates, a first welding pressure (F1) with respect to the laminate body from an upper tip contacting the metal plate and a second welding pressure (F2) with respect to the laminate body from a lower tip contacting the metal plate are changed relative to each other. Specifically, F1<F2 in a first step which is an initial period of welding, F1=F2 in a second step which is an intermediate period of welding, and F1>F2 in a third step which is a final period of welding.

The subject disclosure relates to electroplating niobium titanium (Nb/Ti) with a metal capable of being soldered to. According to an embodiment, a structure is provided that comprises a Nb/Ti substrate and a metal layer plated on a portion of the Nb/Ti substrate. The metal layer comprises an electroplated metal layer plated on the portion of the Nb/Ti substrate using electroplating. The metal layer can comprise a metal capable of being soldered to, such as copper. In another embodiment, a cable assembly is provided that comprises a niobium titanium wire, a metal layer plated on a first portion of the niobium titanium wire, and a metal coaxial connector soldered to the metal layer.

The present disclosure relates to a process for cutting and separating arbitrary shapes of thin substrates of transparent materials, particularly tailored composite fusion drawn glass sheets, and the disclosure also relates to a glass article prepared by the method. The developed laser method can be tailored for manual separation of the parts from the panel or full laser separation by thermally stressing the desired profile. The self-separation method involves the utilization of an ultra-short pulse laser that can be followed by a CO.sub.2 laser (coupled with high pressure air flow) for fully automated separation.

A method of removing material from an opposite side of workpiece includes directing a laser beam at a first side of the workpiece to remove the material from an opposite second side of the workpiece.

An inspection system includes a laser light source, an optical system for laser marking that irradiates a semiconductor device with laser light from a metal layer side, a control unit that controls the laser light source to control laser marking, a two-dimensional camera that detects light from the semiconductor device on a substrate side and outputs an optical reflection image, and an analysis unit that generates a pattern image of the semiconductor device, and the control unit controls the laser light source so that laser marking is performed until a mark image appears in a pattern image.