A method for joining an optical crystal to a substrate includes radiating a pulsed laser beam through the optical crystal or through the substrate onto a surface of an intermediate layer between the optical crystal and the substrate, and forming a fusion zone in the intermediate layer between the optical crystal and the substrate by the radiation of the pulsed laser beam, thereby integrally joining the optical crystal and the substrate.

A surgical instrument and related methods are described. The surgical instrument includes a first jaw including a first structural jaw element and a first sealplate fixed to the first structural jaw element and a second jaw including a second structural jaw element and a second sealplate fixed to the second structural jaw element. The second structural jaw element is moveably coupled to the first structural jaw element to facilitate pinching tissue between the first and second sealplates. The first and second sealplates are configured to facilitate sealing tissue pinched therebetween. The first jaw further includes a metallized tie layer between the first sealplate and the first structural jaw element, wherein the first sealplate is fixed to the first structural jaw element via a metal to metal joint between the first sealplate and the metallized tie layer.

A coated cutting tool includes a substrate with a rake side, a clearance side and a cutting edge, and a coating including a first layer and a second layer. The second layer includes an inner layer and an outer layer, wherein the first layer is exposed through an opening in the inner layer and the opening extends over at least a portion of the width of the cutting edge. Thereby, a double layer is provided in critical areas, whereas a single layer is provided in other areas. Preferably, the double oxide layer includes aluminum oxide layers. A method for manufacturing the coated cutting tool is also provided.

A method for machining a ceramic matrix composite (CMC), the method enhancing a machining speed for the ceramic matrix composite (CMC), includes: a step of scanning an irradiated portion of a surface of a machining target material by a laser head to irradiate the irradiated portion with laser light from the laser head, and forming a deteriorated layer on the irradiated portion of the surface of the machining target material; and a step of sequentially removing the deteriorated layer by an end mill, the deteriorated layer being formed on the irradiated portion, wherein the deteriorated layer is formed by heating the irradiated portion up to a predetermined temperature by irradiation of continuous oscillation laser light, and by forming a crack by irradiation of pulsed oscillation laser light.

The invention relates to a method for producing at least one solid layer and comprises at least the steps of: providing a carrier substrate (4) having a sacrificial layer (8) arranged thereon or arranging a sacrificial layer (8) on the provided carrier substrate (4), producing a useful layer (6) by way of chemical or physical gas phase deposition on the sacrificial layer (8) to form a multi-layer arrangement (2), removing the useful layer (6) as a result of a material weakening produced between the useful layer (6) and the carrier substrate (4), said material weakening being brought about by modifications (12) to the sacrificial layer (8) which were produced means of laser beams (10).

A wafer has a device area on one side with a plurality of devices partitioned by a plurality of division lines. Either side of the wafer is attached to an adhesive tape supported by a first annular frame. A modified region is formed in the wafer along the division lines by a laser. The wafer is placed on a support member whose outer diameter is smaller than an inner diameter of the first annular frame. After applying the laser beam, the adhesive tape is expanded thereby dividing the wafer along the division lines. A second annular frame is attached to a portion of the expanded adhesive tape. An inner diameter of the second annular frame is smaller than the outer diameter of the support member and smaller than the inner diameter of the first annular frame.

A method for assembling a zirconia part to a titanium element with braze, the method comprising the following steps: coating a surface of the titanium element with a niobium layer, positioning a braze between the zirconia part and the niobium, the braze being of gold or a gold alloy, heating the whole to a temperature higher than the melting temperature of the braze, and then cooling the whole, whereby an assembly comprising the zirconia part and the titanium element assembled by a brazing joint comprising a first portion of gold or a gold alloy, a second portion formed by a reaction layer comprising intermetallics of the AuNbTi system, and a third portion formed by an oxide reaction layer is obtained.

For allowing a crack to progress between respective lines reliably while shortening a laser beam irradiation time, a method for processing SiC material includes allowing a laser beam to be absorbed in a cutting scheduled plane of an SiC material to form an altered pattern including a plurality of line-shaped altered regions; and cutting the SiC material along the cutting scheduled plane, wherein a plurality of line-shaped main altered regions extending in a predetermined direction, arranged at a first pitch P1 and included in altered region groups is formed, and a plurality of altered region groups is arranged at a second pitch P2 larger than the first pitch P1.

A method of machining cooling holes includes providing a workpiece in which a cooling hole is to be formed. The cooling hole, once formed, defines distinct first and second sections. The workpiece is secured in a fixture that is mounted in a first machine. In the first machine, a laser is used to drill a through-hole in a wall of the workpiece. The through-hole is spatially common to the first and second sections of the cooling hole. After drilling the through-hole, the fixture with the workpiece secured therein is removed from the first machine and mounted in a second machine. In the second machine, ultrasonic machining is used to expand a portion of the through-hole to form the second section. An abrasive slurry used in the process is drained through the through-hole during the ultrasonic machining.

A method and system to manufacture workpieces employing a high intensity energy source to create a puddle and at least one resistively heated wire which is heated to at or near its melting temperature and deposited into the puddle as droplets.